WO2014010282A1 - Die bonder and method for detecting positions of bonding tool and semiconductor die relative to each other - Google Patents

Die bonder and method for detecting positions of bonding tool and semiconductor die relative to each other Download PDF

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Publication number
WO2014010282A1
WO2014010282A1 PCT/JP2013/060853 JP2013060853W WO2014010282A1 WO 2014010282 A1 WO2014010282 A1 WO 2014010282A1 JP 2013060853 W JP2013060853 W JP 2013060853W WO 2014010282 A1 WO2014010282 A1 WO 2014010282A1
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WO
WIPO (PCT)
Prior art keywords
bonding tool
image
semiconductor die
camera
die
Prior art date
Application number
PCT/JP2013/060853
Other languages
French (fr)
Japanese (ja)
Inventor
正人 辻
沖人 梅原
圭一 比留間
亮 浦橋
Original Assignee
株式会社新川
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Publication date
Application filed by 株式会社新川 filed Critical 株式会社新川
Priority to CN201380011558.3A priority Critical patent/CN104137241B/en
Priority to KR1020147023857A priority patent/KR101739833B1/en
Publication of WO2014010282A1 publication Critical patent/WO2014010282A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors

Definitions

  • the present invention relates to a structure of a die bonder and a method for detecting a relative position between a bonding tool and a semiconductor die adsorbed on the tip of the bonding tool.
  • a die bonder is often used as a device for bonding a semiconductor die to a circuit board such as a lead frame.
  • the die bonder lowers the semiconductor die sucked and held at the tip of the bonding tool toward the surface of the circuit board sucked and fixed on the bonding stage, and bonds the semiconductor die onto the circuit board.
  • the die bonder it is necessary to press the semiconductor die against the circuit board in a state where the position of the semiconductor die attracted to the bonding tool is matched with the bonding position of the circuit board. For this reason, when the semiconductor die is transferred by the bonding tool, an image of the back surface of the semiconductor die attracted by the bonding tool is acquired, and the relative position of the semiconductor die and the circuit board is aligned based on the alignment mark on the back surface of the semiconductor die.
  • the method is used (for example, refer patent document 1).
  • Patent Document 1 it is necessary to temporarily stop the transfer of the semiconductor die when acquiring an image, and there is a problem that the tact time becomes long. Therefore, a reference member having a mirror and a rectangular through hole is fixed to the transfer head of the semiconductor die via an L-shaped connecting member, and when the semiconductor die is transferred by the transfer head, the transfer is temporarily stopped.
  • the first image data obtained by imaging the semiconductor die and the second image data obtained by imaging the reference component are obtained, and the position of the semiconductor die with respect to the reference component is detected by superimposing the two image data.
  • a method of correcting the position of the semiconductor die mounted on the circuit board in response to the above has been proposed (see, for example, Patent Document 2).
  • an object of the present invention is to detect misalignment between a bonding tool and a semiconductor die effectively with a simple configuration.
  • the die bonder of the present invention includes a bonding tool, a light source, a camera, and a reflector.
  • the bonding tool includes a suction surface at a tip that sucks a semiconductor die, a root thicker than the suction surface at the tip, and a suction surface.
  • a light source is disposed on the suction surface side of the bonding tool, and a camera reflects and reflects the image of the semiconductor die adsorbed on the suction surface.
  • the body image and the image of the inclined surface of the bonding tool are acquired at the same time, and the reflector is located adjacent to the base of the bonding tool and spaced apart from the focal depth of the camera in the longitudinal direction of the bonding tool from the suction surface At the same time, it is characterized in that it does not move relative to the bonding tool and reflects light from the light source to at least the suction surface side of the bonding tool.
  • the die bonder of the present invention further includes an image processing unit, and the image processing unit includes an image of the reflector acquired by the camera, an image of the inclined surface of the bonding tool acquired by the camera, and an image of the semiconductor die acquired by the camera. And detecting the relative position between the bonding tool and the semiconductor die.
  • the reflector is a shank that holds the bonding tool, a ring attached to the bonding tool, or a step adjacent to the base of the bonding tool, and is perpendicular to the longitudinal center line of the bonding tool. It has a reflecting surface, and the reflecting surface is preferably an end surface on the suction surface side of the shank, an end surface on the suction surface side of the ring, or an end surface of the stepped portion.
  • the relative position between the bonding tool and the semiconductor die is the amount of deviation between the position on the suction surface of the longitudinal center line of the bonding tool and the position on the suction surface of the center of the semiconductor die, or the suction It is also preferable that it is one or both of the inclination angles of the semiconductor die with respect to the reference axis on the surface.
  • the die bonder of the present invention further includes a moving mechanism and a control unit, the moving mechanism moves the bonding tool, the control unit moves the bonding tool by the moving mechanism, and the bonding tool moves to the pick-up position of the semiconductor die.
  • the light source emits light when a predetermined position between the bonding position and the bonding position is reached, and while moving the bonding tool, the image of the semiconductor die adsorbed on the adsorption surface by the camera, the image of the inclined surface of the bonding tool, and the reflector It is also preferable to acquire images simultaneously.
  • the die bonder of the present invention further includes a moving mechanism and a control unit.
  • the moving mechanism moves the bonding tool
  • the control unit changes the position of the bonding tool by the moving mechanism and detects the image processing unit. It is also preferable to correct the position of the bonding tool based on the relative position between the bonding tool and the semiconductor die.
  • a position detection method for detecting a relative position between a bonding tool and a semiconductor die is a position detection method for detecting a relative position between a bonding tool and a semiconductor die in a die bonder, an image acquisition step, and a relative position detection.
  • the die bonder includes a suction surface at the tip that sucks the semiconductor die, a base thicker than the suction surface at the tip, and an inclined surface that connects the suction surface and the root and is inclined with respect to the longitudinal center line.
  • the relative position between the bonding tool and the semiconductor die is the amount of deviation between the position on the suction surface of the longitudinal center line of the bonding tool and the position on the suction surface at the center of the semiconductor die, or It is also preferable that one or both of the inclination angles of the semiconductor die with respect to the reference axis on the adsorption surface.
  • the die bonder further includes a moving mechanism that moves the bonding tool, and the image acquisition step moves the bonding tool by the moving mechanism, and the bonding tool moves between the pickup position of the semiconductor die and the bonding position.
  • a light source is emitted, and while the bonding tool is moved, the image of the semiconductor die, the image of the reflector, and the image of the inclined surface of the bonding tool are simultaneously acquired by the camera. This is also preferable.
  • the present invention has an effect that it is possible to detect the positional deviation between the bonding tool and the semiconductor die effectively with a simple configuration.
  • a die bonder 10 of the present invention includes a bonding head 15 to which a bonding tool 24 is attached via a shank 20, a guide rail 11 for guiding the bonding head 15 in the Y direction, and the bonding head 15 in the Y direction.
  • a Y-direction moving mechanism 13 for moving the guide rail 11 and the bonding head 15 in the X direction, a camera 32 provided below the bonding head 15, and a strobe 34 as a light source.
  • the bonding tool 24 has an adsorption surface 27 that adsorbs the semiconductor die 30 at the tip, and the strobe 34 includes a reflecting mirror 35 that directs emitted light toward the bonding tool 24.
  • the bonding head 15 includes a Z-direction moving mechanism 16 that moves the bonding tool 24 in the Z direction and a ⁇ -direction moving mechanism 17 that rotates the bonding tool 24 in the ⁇ direction.
  • the controller 50 moves the bonding tool 24 in the X, Y, Z, and ⁇ directions by operating the moving mechanisms 12, 13, 16, and 17 in the X, Y, Z, and ⁇ directions. It is configured. 1, the horizontal direction on the paper is the Y direction, the vertical direction of the paper is the Z direction, the vertical direction to the paper is the X direction, and the rotation direction around the Z axis is the ⁇ direction.
  • the image processing unit 40 is a computer that includes a CPU 41 for processing signals and data therein, and a memory 42 for storing data and programs.
  • the memory 42 stores therein an image acquisition program 43, a relative position detection program 44, and control data 45 described later.
  • the image processing unit 40 includes a camera interface 47 and a strobe interface 48 for connecting to the camera 32 and the strobe 34.
  • the image processing unit 40 includes a data bus interface 46 for performing data communication with the control unit 50 which is another computer.
  • the CPU 41, the memory 42, the interfaces 47 and 48, and the data bus interface 46 are connected by a data bus 49 inside the image processing unit 40.
  • the control unit 50 is a computer that includes a CPU 51 that internally processes signals and data, and a memory 52 that stores data and programs, and a data bus interface 56. Are connected to the CPU 41 and the memory 42 of the image processing unit 40 via the communication line 60 and the data bus interface 46 of the image processing unit 40.
  • the memory 52 stores therein a position control program 53, a correction program 54, and control data 55, which will be described later.
  • the control unit 50 includes a moving mechanism interface 57 for connecting to the moving mechanisms 12, 13, 16, and 17 in the X, Y, Z, and ⁇ directions.
  • the CPU 51, the memory 52, the moving mechanism interface 57 and the data bus interface 56 are connected by a data bus 59 inside the control unit 50.
  • the X, Y, Z, and ⁇ moving mechanisms 12, 13, 16, and 17 of the die bonder 10 of the present embodiment are signals indicating the positions of the tip of the bonding tool 24 in the X, Y, Z, and ⁇ directions, respectively.
  • the control unit 50 obtains the position in the X, Y, Z, and ⁇ directions of the tip of the bonding tool 24 from the signals of the moving mechanisms 12, 13, 16, and 17.
  • the bonding tool 24 connects the tip suction surface 27 that sucks the semiconductor die 30, the root 25 that is thicker than the tip suction surface 27, and the suction surface 27 and the root 25. And an inclined curved surface 26 that is an inclined surface inclined with respect to the line 90.
  • the suction surface 27 at the tip is substantially the same size as the semiconductor die 30 and is a plane perpendicular to the longitudinal center line 90 of the bonding tool 24. For this reason, the back surface of the semiconductor die 30 attracted to the attracting surface 27 is also a plane perpendicular to the longitudinal center line 90 of the bonding tool 24.
  • the root 25 of the bonding tool 24 is thicker than the suction surface 27 at the tip and is a cylindrical shape fixed to the shank 20, and the inclined curved surface 26 is a curved surface that spreads in a funnel shape from the suction surface 27 toward the root 25.
  • the shank 20 has a cylindrical shape in which the outer peripheral surface of the base 25 of the bonding tool 24 is fitted on the inner peripheral side, and the end surface 21 on the lower side or the suction surface 27 side is in the longitudinal direction of the bonding tool 24.
  • the surface of the bonding tool 24 is a plane perpendicular to the longitudinal center line 90 and the surface thereof is mirror-finished. Since the shank 20 is engaged with the bonding tool 24, the shank 20 does not move relative to the bonding tool 24 and is disposed at a position adjacent to the root 25.
  • the camera 32 is focused on the back surface (the lower surface in the Z direction) of the semiconductor die 30 adsorbed by the bonding tool 24 when the bonding tool 24 moves to a predetermined position directly above. It is arranged so as to fit, and is adjusted so that a sharp image of the back surface of the semiconductor die 30 can be acquired. That is, the camera 32 is adjusted so that the optical path length L1 between the lens of the camera 32 and the back surface of the semiconductor die 30 becomes the focal length of the lens of the camera 32.
  • the inclined curved surface 26 of the bonding tool 24 and the end surface 21 of the shank 20 are arranged in the longitudinal direction away from the suction surface 27 that sucks the semiconductor die 30, and from the lens of the camera 32 to the bonding tool 24.
  • the optical path lengths to the inclined curved surface 26 and the end surface 21 of the shank 20 are optical path lengths L2 and L3.
  • the focal depth D of the lens of the camera 32 is slightly longer than the thickness of the semiconductor die 30, the optical path lengths L2 and L3 are longer than the length obtained by adding the focal depth D to the optical path length L1, respectively. .
  • the image of the back surface of the semiconductor die 30 the image of the inclined curved surface 26 of the bonding tool 24, and the image of the end surface 21 of the shank 20 are simultaneously acquired by the camera 32, the inclined curved surface 26 of the bonding tool 24 and the end surface of the shank 20. 21 is in an out-of-focus state, and the acquired image of the inclined curved surface 26 and the image of the end surface 21 are slightly blurred images.
  • the control unit 50 of the die bonder 10 executes a position control program 53 to drive the moving mechanisms 12, 13, 16, 17 in the X, Y, Z, and ⁇ directions to move the top of the pickup stage 36.
  • the bonding tool 24 is moved onto the diced wafer placed on the semiconductor wafer 30 and the semiconductor die 30 is sucked onto the suction surface 27 at the tip of the bonding tool 24.
  • the bonding head 15 is moved onto the bonding stage 37 as shown by a locus 38 shown in FIG. 3, the bonding head 15 is lowered onto the circuit board that is sucked and fixed onto the bonding stage 37, and the semiconductor die 30 is moved. Bond on the circuit board. This is the basic operation of the die bonder 10.
  • the CPU 51 of the control unit 50 executes the position control program 53 and moves the bonding tools 24 from the pickup stage 36 to the bonding stage 37 while the X, Y, Z, and ⁇ moving mechanisms 12, 13, 16, and 17 are moved.
  • the position of each of the X, Y, Z, and ⁇ directions of the tip of the bonding tool 24 is detected from the signal, and the bonding tool 24 comes to a predetermined position directly above the camera 32 as shown in FIG.
  • a trigger signal for causing the strobe 34 to emit light is output. This trigger signal is transmitted to the image processing unit 40 through the data bus interfaces 56 and 46 and the communication line 60.
  • the predetermined position is a position set in the position control program 53 in advance.
  • the CPU 41 of the image processing unit 40 executes the image acquisition program 43 when this trigger signal is input.
  • the CPU 41 outputs a command for causing the strobe 34 to emit light.
  • a flash signal is output from the flash interface 48 to the flash 34, and the flash 34 emits light.
  • the image processing unit 40 captures an image from the camera 32 through the camera interface 47 in synchronization with the light emission of the strobe 34.
  • the captured image is stored in the memory 42 of the image processing unit 40. Note that the image is captured while the bonding tool 24 is moved (without stopping the movement).
  • the shank 20 is a reflector, and the end surface 21 of the shank 20 is a reflecting surface.
  • a part of the light incident on the back surface or the lower surface (the surface on the negative side in the Z direction) of the semiconductor die 30 is, as indicated by an arrow 75 shown in FIG.
  • the light is reflected in the direction along the longitudinal center line 90 of the bonding tool 24 (minus side in the Z direction) and enters the camera 32 on the lower side of the bonding tool 24 (on the suction surface 27 side).
  • the light incident on the inclined curved surface 26 of the bonding tool 24 as shown by an arrow 73 in FIG. 4 is a direction different from the longitudinal direction of the bonding tool 24 such as the horizontal direction or the arrow 74 shown in FIG.
  • the light is reflected in a direction different from the direction along the longitudinal center line 90 of the bonding tool 24.
  • the lightness (white) ring-shaped image 81 (reflector) of the end face 21 where the light from the strobe 34 reflects toward the camera 32 is reflected.
  • a high-lightness (white) square image 84 of the back surface of the semiconductor die 30 in which light from 34 is reflected toward the camera 32 is captured.
  • the image processing unit 40 simultaneously acquires these three images 81, 82, and 84 by the camera 32 and stores them in the memory 42. Note that an image 83 of the tip of the bonding tool 24 indicated by a broken line in FIG. 4B is hidden behind the image of the semiconductor die 30 and cannot be captured by the camera 32.
  • the image 84 on the back surface of the semiconductor die 30 is a sharp image.
  • the end surface 21 of the shank 20 and the inclined curved surface 26 of the bonding tool 24 are shifted in the Z direction from the back surface of the semiconductor die 30 to be larger than the focal depth D of the camera 32, the brightness of the end surface 21 is high (white).
  • the ring-shaped image 81 and the low-intensity (black or gray) circular image 82 of the inclined curved surface 26 are blurred images.
  • the CPU 41 of the image processing unit 40 executes a relative position detection program 44.
  • the brightness of the image is described as 256 gradations (brightness 0 to brightness 255).
  • the image acquired by the camera 32 includes a ring-shaped image 81 (reflector image) with a lightness of 255 on the end face 21 and a circular lightness with a lightness of 0 on the inclined curved surface 26 of the bonding tool 24.
  • An image 82 an image of an inclined surface
  • a square image 84 of lightness 255 on the back surface of the semiconductor die 30 are included.
  • the ring-shaped image 81 and the circular image 82 are blurred because the camera 32 is out of focus.
  • the brightness of the image 81 is 255 at the outer peripheral portion as shown by the line a.
  • the brightness of the black image 82 increases.
  • the part is mixed and the brightness gradually decreases as shown by the line b.
  • the state of lightness 0 continues to the image 84 on the back surface of the semiconductor die 30. Since the camera 32 is focused on the back surface of the semiconductor die 30, the image 84 has a sharp outline.
  • the back surface of the semiconductor die 30 reflects the light of the strobe 34, the lightness is 255. Accordingly, the brightness of the image rises almost vertically from the brightness 0 to the brightness 255 at the edge of the image 84, as indicated by the line d. In the region of the image 84, the brightness is constant at 255 as indicated by the line e.
  • the CPU 41 of the image processing unit 40 uses a preset binarization threshold value, as shown in FIG. And the square outline reference line 92 of the image 84 are acquired.
  • the binarization threshold is such that a circular line having a diameter substantially the same as the outer shape of the root 25 of the bonding tool 24 is a round outer reference of the image 82 when conditions such as the light state of the strobe 34 and the photographing position are reference conditions. It is determined in advance by a test or the like so that it can be acquired as the line 91.
  • the image 81 and the image 82 are images of the inclined curved surface 26 of the bonding tool 24 and the end surface 21 of the shank 20 arranged concentrically, the change in brightness of each region indicated by the line a to the line e in FIG.
  • the object is around the longitudinal center line of the tool 24. Therefore, even when conditions such as the light state of the strobe 34 and the photographing position deviate from the reference conditions, the change curve of the brightness between the image 81 and the image 82 is as shown by the alternate long and short dash line b ′ in FIG. Since the left and right objects (objects around the center line in the longitudinal direction of the bonding tool 24), the round outline reference line 91 ′ acquired using the binarization threshold shown in FIG.
  • 5B is the root 25 of the bonding tool 24. It becomes a concentric circle with the outer shape of the bonding tool 24 having a diameter smaller than the outer shape. For this reason, even when conditions such as the light state of the strobe 34 and the photographing position deviate from the reference conditions, the centers of the round outline reference lines 91 and 91 ′ coincide with the position of the longitudinal center line of the bonding tool 24.
  • the back surface of the semiconductor die 30 is in focus, and the brightness changes almost vertically at the edge of the image 84. Therefore, even if the light condition of the strobe 34, the shooting position, etc. deviate from the reference condition, the image The size of 84 square outline reference lines 92 is almost the same.
  • the ring-shaped image 81 of the end face 21 that reflects the light of the strobe 34 has high brightness
  • the circular image 82 of the inclined curved surface 26 that does not reflect the light of the strobe 34 has lightness. Is low and the brightness difference is very large. Therefore, the longitudinal positions of the bonding tool 24 of the end surface 21 and the inclined curved surface 26 are separated from the back surface of the semiconductor die 30 by the depth of focus D, and the brightness of the images 81 and 82 can be obtained even if a sharp image cannot be acquired.
  • the large difference it is possible to reliably extract the circular outer shape reference line 91 concentric with the outer shape of the bonding tool 24.
  • the square outline reference line 92 can be reliably extracted using the sharp edge of the image 84 on the back surface of the semiconductor die 30.
  • the image processing unit 40 detects the position of the center 97 of the circular outline reference line 91 and the position of the center 98 of the square outline reference line 92 from the processed image, and the circular outline reference line 91.
  • An X-direction reference line 94 passing through the center 97 of the camera 32 and extending in the X direction of the field of view 33 of the camera 32, and a Y-direction reference line 93 passing through the center 97 of the circular outer shape reference line 91 and extending in the Y direction of the field of view 33 of the camera 32.
  • the image processing unit 40 passes through the center 98 of the square outline reference line 92 and the X direction measurement line 96 and the center 98 of the square outline reference line 92 parallel to the side of the square outline reference line 92 close to the X direction reference line 94.
  • a Y-direction measurement line 95 is set in parallel to a side of the street square outline reference line 92 close to the Y-direction reference line 93. Then, the image processing unit 40 obtains deviation amounts ⁇ X and ⁇ Y in the X direction and the Y direction between the position of the center 97 of the circular outline reference line 91 and the position of the center 98 of the square outline reference line 92, respectively.
  • the image processing unit 40 also calculates a square outline reference line from the angle difference in the ⁇ direction between the X direction reference line 94 and the X direction measurement line 96 or the angle difference in the ⁇ direction between the Y direction reference line 93 and the Y direction measurement line 95.
  • the rotation angle deviation ⁇ of 92 in the ⁇ direction is detected.
  • the circular outer shape reference line 91 is concentric with the outer shape line inside the end surface 21 of the shank 20 that is not displaced relative to the bonding tool 24, and the outer shape line of the bonding tool 24 is Since it is also a concentric circle, the position of the center 97 of the circular outline reference line 91 is the center position of the longitudinal center line 90 of the bonding tool 24 shown in FIG. 4A, and the square outline reference line 92 is the position of the semiconductor die 30. Since it is an edge of the outer shape, the center 98 of the square outer reference line 92 is the center position of the semiconductor die 30.
  • the deviation amounts ⁇ X and ⁇ Y in the X and Y directions between the circular outer shape reference line 91 and the square outer shape reference line 92 are the X and Y direction differences between the center position of the bonding tool 24 and the center position of the semiconductor die 30. It becomes the amount of deviation.
  • an X-direction reference line 94 that passes through the center 97 of the circular outer shape reference line 91 and goes in the X direction of the visual field 33 of the camera 32, and passes through the center 97 of the circular outer shape reference line 91 in the Y direction of the visual field 33 of the camera 32.
  • the heading Y-direction reference line 93 is a reference line on the suction surface 27 of the bonding tool 24, passes through the center 98 of the rectangular outer shape reference line 92, and is parallel to a side near the X-direction reference line 94 of the rectangular outer shape reference line 92.
  • the Y-direction measurement line 95 passing through the center 98 of the square X-direction measurement line 96 and the square outline reference line 92 and parallel to the side close to the Y-direction reference line 93 of the square outline reference line 92 is on the suction surface 27 of the bonding tool 24.
  • This is a line indicating the inclination angle of the semiconductor die 30 with respect to the reference line.
  • the ⁇ direction of the square outline reference line 92 obtained from the angle difference in the ⁇ direction between the X direction reference line 94 and the X direction measurement line 96 or the angle difference in the ⁇ direction between the Y direction reference line 93 and the Y direction measurement line 95.
  • the amount of deviation in the X and Y directions between the center position of the bonding tool 24 and the center position of the semiconductor die 30 and the inclination angle of the semiconductor die 30 with respect to the reference axis on the suction surface 27 of the bonding tool 24 are determined by bonding.
  • the image processing unit 40 detects the deviation amounts ⁇ X, ⁇ Y, ⁇ of the semiconductor die 30 with respect to the bonding tool 24 in the X, Y, ⁇ directions
  • the data is transmitted to the control unit 50 through the data bus interfaces 46, 56 and the communication line 60. Send to.
  • the CPU 51 of the control unit 50 executes the correction program 54 and detects the tip of the bonding tool 24 detected by each moving mechanism 12, 13, 16, 17 until the bonding tool 24 is moved to the bonding stage 37 shown in FIG. 3.
  • the semiconductor die 30 can be bonded to the circuit board on the bonding stage 37 at an accurate position and direction by correcting the received positions by X, Y, and ⁇ shift amounts ⁇ X, ⁇ Y, and ⁇ .
  • the die bonder 10 has a brightness difference between the image 81 of the end surface 21 of the shank 20 holding the bonding tool 24 and the image 82 of the inclined curved surface 26 of the bonding tool 24. Since the center position of the longitudinal center line 90 of the bonding tool 24 and the center position of the semiconductor die 30 are detected using the difference in brightness between the image 84 of the back surface 30 and the image 82 of the inclined curved surface 26 of the bonding tool 24, the end surface 21.
  • the inclined curved surface 26 deviates from the back surface of the semiconductor die 30 more than the depth of focus D, and the relative position between the bonding tool 24 and the semiconductor die 30 can be reliably detected even when the images 81 and 82 are not sharp. it can.
  • the inclined surface of the bonding tool 24 has been described as the funnel-shaped inclined curved surface 26, but the inclined surface is inclined with respect to the longitudinal center line 90 of the bonding tool 24, and from the strobe 34. Any shape may be used as long as it does not reflect light in the direction along the longitudinal center line 90. For example, it may be a tapered surface that obliquely connects the suction surface 27 and the root 25. .
  • the positional deviation amount is detected during the bonding operation and corrected.
  • the present invention is not limited to the correction during the bonding operation.
  • the present invention can also be applied to the case where the positional deviation is measured in advance and the offset amount of the bonding tool 24 is set based on the result. In that case, when the image is acquired, the movement of the bonding tool 24 is stopped, and the inclined curved surface 26 of the bonding tool 24, the shank 20, the images 81, 82, and 84 of the semiconductor die 30 taken in a stationary state and the bonding tool.
  • the shift amount and the offset amount may be set by combining the images 81, 82, and 84 acquired without stopping the movement of 24.
  • the position of the bonding tool 24 is corrected based on the relative position between the bonding tool 24 and the semiconductor die 30 sucked on the suction surface 27 of the bonding tool 24.
  • the relative position between the bonding tool 24 and the pickup stage 36 or the bonding stage 37 is corrected, and the deviation amount of the pickup position or the bonding position due to the temperature change of the die bonder 10 is corrected. It is good also as correcting.
  • a moving average of the positional deviation between the bonding tool 24 and the pickup stage 36 or the bonding stage 37 is obtained, and the correction direction of the deviation amount is determined based on the tendency of the change of the moving average value. Also good.
  • a ring 22 that is fitted and fixed to the outer periphery of the root 25 of the bonding tool 24 is attached to the lower side of the shank 20 of the embodiment described with reference to FIGS. 1 to 6.
  • the lower end surface 23 of the ring 22 is mirror-finished so that light from the strobe 34 can be reflected.
  • the ring 22 is a reflector
  • the end surface 23 is a reflecting surface
  • the ring 22 is disposed adjacent to the root 25.
  • the camera 32 has a slightly blurred image 86 of the end surface 23 of the ring-shaped ring 22 with a high brightness (white) and a slightly curved surface of the bonding tool 24 slightly blurred.
  • a low brightness (black or gray) image 82 and a high brightness (white) backside image 84 of the semiconductor die 30 are obtained, and a circular outer shape of the image 86 of the end face 23 and the inclined curved surface 26 image 82 is obtained.
  • a reference line 91, a square outline reference line 92 of the inclined curved surface 26 image 82 and the back surface image 84 of the semiconductor die 30 are extracted, and a relative position between the bonding tool 24 and the semiconductor die 30 is detected.
  • the effect of this embodiment is the same as that of the embodiment described above with reference to FIGS.
  • the base 25 of the bonding tool 24 is stepped, and the lower surface 29 below the stepped portion 28 is mirror-finished so that light from the strobe 34 can be reflected. It is a thing.
  • the step portion 28 of the bonding tool 24 is a reflector, the lower surface 29 of the step portion 28 is a reflecting surface, and the lower surface 29 is disposed adjacent to the root 25.
  • the camera 32 has an image 88 of the lower surface 29 of the ring-shaped step portion 28 having a slightly blurred high brightness (white) and a slightly inclined tilt of the bonding tool 24.
  • a low-lightness (black or gray) image 82 of the curved surface 26 and a high-lightness (white) image 84 of the back surface of the semiconductor die 30 are obtained, and the circular image of the image 88 of the bottom surface 29 and the inclined curved surface 26 image 82 is obtained.
  • the outline reference line 91, the square outline reference line 92 of the inclined curved surface 26 image 82 and the back surface image 84 of the semiconductor die 30 are extracted, and the relative position between the bonding tool 24 and the semiconductor die 30 is detected.
  • the effect of this embodiment is the same as that of the embodiment described above with reference to FIGS.

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Abstract

A die bonder contains a bonding tool (24), a strobe (34), a camera (32), and a shank (20). The bonding tool (24) has the following: a tip suction surface (27) that holds a semiconductor die (30) by suction; a base that is wider than said tip suction surface (27); and a sloped surface that connects the suction surface (27) to the base and is sloped with respect to a lengthwise centerline. The camera (32) simultaneously acquires an image of the semiconductor die (30) held by the suction surface (27), an image of the shank (20), and an image of the sloped surface of the bonding tool (24). The shank (20) is in contact with the base of the bonding tool (24), is separated from the suction surface (27) by a distance greater than the depth of focus of the camera (32) in the lengthwise direction of the bonding tool (24), does not move relative to the bonding tool (24), and reflects light from the strobe (34). Misalignment between a semiconductor die and a bonding tool in a die bonder can thus be detected effectively with a simple configuration.

Description

ダイボンダおよびボンディングツールと半導体ダイとの相対位置の検出方法Method of detecting relative position between die bonder and bonding tool and semiconductor die
　本発明は、ダイボンダの構造およびボンディングツールとボンディングツールの先端に吸着された半導体ダイとの相対位置の検出方法に関する。 The present invention relates to a structure of a die bonder and a method for detecting a relative position between a bonding tool and a semiconductor die adsorbed on the tip of the bonding tool.
　半導体ダイをリードフレーム等の回路基板にボンディングする装置としてダイボンダが多く用いられている。ダイボンダは、ボンディングステージの上に吸着固定した回路基板の表面に向かってボンディングツールの先端に吸着保持した半導体ダイを降下させ、半導体ダイを回路基板上にボンディングするものである。 A die bonder is often used as a device for bonding a semiconductor die to a circuit board such as a lead frame. The die bonder lowers the semiconductor die sucked and held at the tip of the bonding tool toward the surface of the circuit board sucked and fixed on the bonding stage, and bonds the semiconductor die onto the circuit board.
　ダイボンダでは、ボンディングツールに吸着された半導体ダイの位置を回路基板のボンディング位置に合わせた状態で半導体ダイを回路基板に押し付けることが必要となる。このため、ボンディングツールによって半導体ダイを移送する際に、ボンディングツールに吸着された半導体ダイの裏面の画像を取得し、半導体ダイ裏面のアライメントマークに基づいて半導体ダイと回路基板との相対位置を合わせる方法が用いられている（例えば、特許文献１参照）。 In the die bonder, it is necessary to press the semiconductor die against the circuit board in a state where the position of the semiconductor die attracted to the bonding tool is matched with the bonding position of the circuit board. For this reason, when the semiconductor die is transferred by the bonding tool, an image of the back surface of the semiconductor die attracted by the bonding tool is acquired, and the relative position of the semiconductor die and the circuit board is aligned based on the alignment mark on the back surface of the semiconductor die. The method is used (for example, refer patent document 1).
　しかし、特許文献１に記載された方法では、画像を取得する際に半導体ダイの移送を一時停止する必要があり、タクトタイムが長くなってしまうという問題があった。そこで、半導体ダイの移載ヘッドにＬ字状の連接部材を介してミラーと矩形状の貫通穴を有する基準部材を固定し、移載ヘッドにより半導体ダイを搬送する際に、搬送を一時停止することなく、半導体ダイを撮像した第１画像データと基準部品を撮像した第２画像データとを取得し、この２つの画像データを重ね合わせて、基準部品に対する半導体ダイの位置を検出し、検出結果に応じて半導体ダイの回路基板に搭載する位置を補正する方法が提案されている（例えば、特許文献２参照）。 However, in the method described in Patent Document 1, it is necessary to temporarily stop the transfer of the semiconductor die when acquiring an image, and there is a problem that the tact time becomes long. Therefore, a reference member having a mirror and a rectangular through hole is fixed to the transfer head of the semiconductor die via an L-shaped connecting member, and when the semiconductor die is transferred by the transfer head, the transfer is temporarily stopped. The first image data obtained by imaging the semiconductor die and the second image data obtained by imaging the reference component are obtained, and the position of the semiconductor die with respect to the reference component is detected by superimposing the two image data. A method of correcting the position of the semiconductor die mounted on the circuit board in response to the above has been proposed (see, for example, Patent Document 2).
特開２０１０－４０７３８号公報JP 2010-40738 A 特開２００７－１１５８５１号公報JP 2007-115851 A
　ところで、特許文献２に記載された従来技術では、基準部材をボンディングに支障のない位置に配置することが必要となることから基準部材からカメラまでの光路と移載ヘッドの先端に吸着された半導体ダイまでの光路とを別の光路とすることが必要となる。一方、基準部材の画像と移載ヘッドの先端に吸着された半導体ダイの画像とを同時に撮像するためには２つの光路を一つにまとめるように光路を構成することが必要となる。また、基準部材からカメラまでの光路長と半導体ダイの表面からカメラまでの光路長とを等しくして基準部材と半導体ダイとの画像のピントが合うようにすることが必要となる。このため、光学系にハーフミラーやプリズムを多用することが必要となり、光学系の構成が複雑になってしまうという問題があった。 By the way, in the prior art described in Patent Document 2, since it is necessary to arrange the reference member at a position that does not hinder bonding, the semiconductor adsorbed on the optical path from the reference member to the camera and the tip of the transfer head It is necessary to make the optical path to the die a different optical path. On the other hand, in order to simultaneously capture the image of the reference member and the image of the semiconductor die attracted to the tip of the transfer head, it is necessary to configure the optical path so that the two optical paths are combined into one. It is also necessary to make the optical path length from the reference member to the camera equal to the optical path length from the surface of the semiconductor die to the camera so that the image of the reference member and the semiconductor die is in focus. For this reason, it is necessary to use many half mirrors and prisms in the optical system, and there is a problem that the configuration of the optical system becomes complicated.
　また、特許文献２に記載された従来技術は、基準部材を連接部材によって移載ヘッドに取り付けていることから、移載ヘッドの往復移動によって基準部品が振動し、これによる検出誤差によって半導体ダイの位置ずれが生じる場合があるという問題があった（特許文献２、段落００９６参照）。 Further, in the prior art described in Patent Document 2, since the reference member is attached to the transfer head by the connecting member, the reference component vibrates due to the reciprocating movement of the transfer head, and the detection error caused by this causes the detection of the semiconductor die. There has been a problem that misalignment may occur (see Patent Document 2, paragraph 0096).
　そこで、本発明は、簡便な構成で効果的にボンディングツールと半導体ダイとの位置ずれを検出することを目的とする。 Therefore, an object of the present invention is to detect misalignment between a bonding tool and a semiconductor die effectively with a simple configuration.
　本発明のダイボンダは、ボンディングツールと、光源と、カメラと、反射体と、を含み、ボンディングツールは、半導体ダイを吸着する先端の吸着面と、先端の吸着面よりも太い根元と、吸着面と根元とをつなぎ、長手方向中心線に対して傾斜した傾斜面と、を備え、光源は、ボンディングツールの吸着面側に配置され、カメラは、吸着面に吸着された半導体ダイの画像と反射体の画像とボンディングツールの傾斜面の画像とを同時に取得し、反射体は、ボンディングツールの根元に隣接し、吸着面からボンディングツールの長手方向にカメラの焦点深度よりも離間して配置されると共に、ボンディングツールとの間で相対的に移動せず、光源からの光を少なくともボンディングツールの吸着面側に反射する、ことを特徴とする。 The die bonder of the present invention includes a bonding tool, a light source, a camera, and a reflector. The bonding tool includes a suction surface at a tip that sucks a semiconductor die, a root thicker than the suction surface at the tip, and a suction surface. A light source is disposed on the suction surface side of the bonding tool, and a camera reflects and reflects the image of the semiconductor die adsorbed on the suction surface. The body image and the image of the inclined surface of the bonding tool are acquired at the same time, and the reflector is located adjacent to the base of the bonding tool and spaced apart from the focal depth of the camera in the longitudinal direction of the bonding tool from the suction surface At the same time, it is characterized in that it does not move relative to the bonding tool and reflects light from the light source to at least the suction surface side of the bonding tool.
　本発明のダイボンダは、更に、画像処理部を含み、画像処理部は、カメラによって取得した反射体の画像と、カメラによって取得したボンディングツールの傾斜面の画像と、カメラによって取得した半導体ダイの画像とを処理し、ボンディングツールと半導体ダイとの相対位置を検出すること、としても好適である。 The die bonder of the present invention further includes an image processing unit, and the image processing unit includes an image of the reflector acquired by the camera, an image of the inclined surface of the bonding tool acquired by the camera, and an image of the semiconductor die acquired by the camera. And detecting the relative position between the bonding tool and the semiconductor die.
　本発明のダイボンダにおいて、反射体は、ボンディングツールを把持するシャンクまたは、ボンディングツールに取り付けたリングまたは、ボンディングツールの根元に隣接する段部であり、ボンディングツールの長手方向中心線に対して垂直な反射面を有し、反射面は、シャンクの吸着面側の端面または、リングの吸着面側の端面または、段部の端面であること、としても好適である。 In the die bonder of the present invention, the reflector is a shank that holds the bonding tool, a ring attached to the bonding tool, or a step adjacent to the base of the bonding tool, and is perpendicular to the longitudinal center line of the bonding tool. It has a reflecting surface, and the reflecting surface is preferably an end surface on the suction surface side of the shank, an end surface on the suction surface side of the ring, or an end surface of the stepped portion.
　本発明のダイボンダにおいて、ボンディングツールと半導体ダイとの相対位置は、ボンディングツールの長手方向中心線の吸着面上の位置と半導体ダイの中心の吸着面上の位置との間のずれ量または、吸着面上の基準軸に対する半導体ダイの傾斜角度のいずれか一方または両方であること、としても好適である。 In the die bonder of the present invention, the relative position between the bonding tool and the semiconductor die is the amount of deviation between the position on the suction surface of the longitudinal center line of the bonding tool and the position on the suction surface of the center of the semiconductor die, or the suction It is also preferable that it is one or both of the inclination angles of the semiconductor die with respect to the reference axis on the surface.
　本発明のダイボンダは、更に、移動機構と、制御部と、を含み、移動機構は、ボンディングツールを移動させ、制御部は、移動機構によってボンディングツールを移動させ、ボンディングツールが半導体ダイのピックアップ位置からボンディング位置との間の所定の位置に達した際に光源を発光させ、ボンディングツールを移動させながらカメラによって吸着面に吸着された半導体ダイの画像とボンディングツールの傾斜面の画像と反射体の画像とを同時に取得すること、としても好適である。 The die bonder of the present invention further includes a moving mechanism and a control unit, the moving mechanism moves the bonding tool, the control unit moves the bonding tool by the moving mechanism, and the bonding tool moves to the pick-up position of the semiconductor die. The light source emits light when a predetermined position between the bonding position and the bonding position is reached, and while moving the bonding tool, the image of the semiconductor die adsorbed on the adsorption surface by the camera, the image of the inclined surface of the bonding tool, and the reflector It is also preferable to acquire images simultaneously.
　本発明のダイボンダは、更に、移動機構と、制御部と、を含み、移動機構は、ボンディングツールを移動させ、制御部は、移動機構によってボンディングツールの位置を変化させると共に、画像処理部の検出したボンディングツールと半導体ダイとの相対位置に基づいてボンディングツールの位置を補正すること、としても好適である。 The die bonder of the present invention further includes a moving mechanism and a control unit. The moving mechanism moves the bonding tool, and the control unit changes the position of the bonding tool by the moving mechanism and detects the image processing unit. It is also preferable to correct the position of the bonding tool based on the relative position between the bonding tool and the semiconductor die.
　本発明のボンディングツールと半導体ダイとの相対位置を検出する位置検出方法は、ダイボンダにおいて、ボンディングツールと半導体ダイとの相対位置を検出する位置検出方法であって、画像取得工程と、相対位置検出工程と、を含み、ダイボンダは、半導体ダイを吸着する先端の吸着面と、先端の吸着面よりも太い根元と、吸着面と根元とをつなぎ、長手方向中心線に対して傾斜した傾斜面と、を有するボンディングツールと、ボンディングツールの吸着面側に配置される光源と、ボンディングツールとの間で相対的に移動せず、光源からの光をボンディングツールの吸着面側に反射する反射体と、吸着面に吸着された半導体ダイの画像と反射体の画像とボンディングツールの傾斜面の画像とを同時に取得するカメラと、を備え、反射体がボンディングツールの根元に隣接し、吸着面からボンディングツールの長手方向にカメラの焦点深度よりも離間して配置され、ボンディングツールの長手方向中心線に対して垂直な反射面を含み、画像取得工程は、カメラによって吸着面に吸着された半導体ダイの画像と反射体の画像とボンディングツールの傾斜面の画像とを同時に取得し、相対位置検出工程は、カメラによって取得した反射体の画像と、カメラによって取得したボンディングツールの傾斜面の画像と、カメラによって取得した半導体ダイの画像とからボンディングツールと半導体ダイとの相対位置を検出すること、を特徴とする。 A position detection method for detecting a relative position between a bonding tool and a semiconductor die according to the present invention is a position detection method for detecting a relative position between a bonding tool and a semiconductor die in a die bonder, an image acquisition step, and a relative position detection. The die bonder includes a suction surface at the tip that sucks the semiconductor die, a base thicker than the suction surface at the tip, and an inclined surface that connects the suction surface and the root and is inclined with respect to the longitudinal center line. , A light source disposed on the suction surface side of the bonding tool, and a reflector that does not move relative to the bonding tool and reflects light from the light source to the suction surface side of the bonding tool A camera that simultaneously acquires an image of the semiconductor die adsorbed on the adsorption surface, an image of the reflector, and an image of the inclined surface of the bonding tool, and the reflection Is disposed adjacent to the base of the bonding tool, spaced from the suction surface in the longitudinal direction of the bonding tool with respect to the focal depth of the camera, and including a reflective surface perpendicular to the longitudinal center line of the bonding tool, Acquires the image of the semiconductor die adsorbed on the adsorption surface by the camera, the image of the reflector, and the image of the inclined surface of the bonding tool at the same time, and the relative position detection step includes the image of the reflector obtained by the camera, the camera The relative position between the bonding tool and the semiconductor die is detected from the image of the inclined surface of the bonding tool acquired by the above and the image of the semiconductor die acquired by the camera.
　本発明の位置検出方法において、ボンディングツールと半導体ダイとの相対位置は、ボンディングツールの長手方向中心線の吸着面上の位置と半導体ダイの中心の吸着面上の位置との間のずれ量または、吸着面上の基準軸に対する半導体ダイの傾斜角度のいずれか一方または両方であること、としても好適である。 In the position detection method of the present invention, the relative position between the bonding tool and the semiconductor die is the amount of deviation between the position on the suction surface of the longitudinal center line of the bonding tool and the position on the suction surface at the center of the semiconductor die, or It is also preferable that one or both of the inclination angles of the semiconductor die with respect to the reference axis on the adsorption surface.
　本発明の位置検出方法において、ダイボンダは、更に、ボンディングツールを移動させる移動機構を備え、画像取得工程は、移動機構によってボンディングツール移動させ、ボンディングツールが半導体ダイのピックアップ位置からボンディング位置との間の所定の位置に達した際に光源を発光させ、ボンディングツールを移動させながらカメラによって吸着面に吸着された半導体ダイの画像と反射体の画像とボンディングツールの傾斜面の画像とを同時に取得すること、としても好適である。 In the position detection method of the present invention, the die bonder further includes a moving mechanism that moves the bonding tool, and the image acquisition step moves the bonding tool by the moving mechanism, and the bonding tool moves between the pickup position of the semiconductor die and the bonding position. When a predetermined position is reached, a light source is emitted, and while the bonding tool is moved, the image of the semiconductor die, the image of the reflector, and the image of the inclined surface of the bonding tool are simultaneously acquired by the camera. This is also preferable.
　本発明は、簡便な構成で効果的にボンディングツールと半導体ダイとの位置ずれを検出することができるという効果を奏する。 The present invention has an effect that it is possible to detect the positional deviation between the bonding tool and the semiconductor die effectively with a simple configuration.
本発明の実施形態におけるダイボンダの制御システムの構成を示す系統図である。It is a distribution diagram showing the composition of the control system of the die bonder in the embodiment of the present invention. 本発明の実施形態におけるダイボンダのボンディングツールとシャンクとの詳細を示す説明図である。It is explanatory drawing which shows the detail of the bonding tool and shank of the die bonder in embodiment of this invention. 本発明の実施形態におけるダイボンダの動作を示す説明図である。It is explanatory drawing which shows operation | movement of the die bonder in embodiment of this invention. 本発明の実施形態におけるダイボンダのボンディングツールとシャンクの構造と、カメラによって捉えた画像を示す説明図である。It is explanatory drawing which shows the structure of the bonding tool and shank of the die bonder in embodiment of this invention, and the image caught with the camera. 図４に示す画像を二値化処理する工程を示す説明図である。It is explanatory drawing which shows the process of binarizing the image shown in FIG. 図４に示す画像を二値化処理した画像を示す説明図である。It is explanatory drawing which shows the image which binarized the image shown in FIG. 本発明の他の実施形態におけるダイボンダのボンディングツールとリングの構造と、カメラによって捉えた画像を示す説明図である。It is explanatory drawing which shows the structure of the bonding tool and ring of the die bonder in other embodiment of this invention, and the image caught with the camera. 本発明の他の実施形態におけるダイボンダのボンディングツールの構造と、カメラによって捉えた画像を示す説明図である。It is explanatory drawing which shows the structure of the bonding tool of the die bonder in other embodiment of this invention, and the image caught with the camera.
　以下、図面を参照しながら本発明の実施形態について説明する。図１に示すように、本発明のダイボンダ１０は、シャンク２０を介してボンディングツール２４が取り付けられるボンディングヘッド１５と、ボンディングヘッド１５をＹ方向にガイドするガイドレール１１と、ボンディングヘッド１５をＹ方向に移動させるＹ方向移動機構１３と、ガイドレール１１とボンディングヘッド１５とをＸ方向に移動させるＸ方向移動機構１２と、ボンディングヘッド１５の下側に設けられたカメラ３２と、光源であるストロボ３４と、カメラ３２とストロボ３４とが接続される画像処理部４０と、Ｘ、Ｙ方向移動機構１２，１３が接続される制御部５０を備えている。ボンディングツール２４は、先端に半導体ダイ３０を吸着する吸着面２７を有し、ストロボ３４は発光した光をボンディングツール２４の方向に向ける反射鏡３５を備えている。ボンディングヘッド１５は、内部にボンディングツール２４をＺ方向に移動するＺ方向移動機構１６と、ボンディングツール２４をθ方向に回転移動するθ方向移動機構１７とを備えており、各移動機構１６，１７はそれぞれ制御部５０に接続されている。制御部５０は、このＸ，Ｙ，Ｚ，θ方向の各移動機構１２，１３，１６，１７を動作させることによって、ボンディングツール２４をＸ，Ｙ，Ｚ，θの各方向に移動させるように構成されている。なお、図１の中の座標軸に示すように、紙面に水平方向がＹ方向、紙面の上下方向がＺ方向、紙面に垂直方向がＸ方向、Ｚ軸周りの回転方向がθ方向である。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIG. 1, a die bonder 10 of the present invention includes a bonding head 15 to which a bonding tool 24 is attached via a shank 20, a guide rail 11 for guiding the bonding head 15 in the Y direction, and the bonding head 15 in the Y direction. A Y-direction moving mechanism 13 for moving the guide rail 11 and the bonding head 15 in the X direction, a camera 32 provided below the bonding head 15, and a strobe 34 as a light source. An image processing unit 40 to which the camera 32 and the strobe 34 are connected, and a control unit 50 to which the X and Y direction moving mechanisms 12 and 13 are connected. The bonding tool 24 has an adsorption surface 27 that adsorbs the semiconductor die 30 at the tip, and the strobe 34 includes a reflecting mirror 35 that directs emitted light toward the bonding tool 24. The bonding head 15 includes a Z-direction moving mechanism 16 that moves the bonding tool 24 in the Z direction and a θ-direction moving mechanism 17 that rotates the bonding tool 24 in the θ direction. Are respectively connected to the control unit 50. The controller 50 moves the bonding tool 24 in the X, Y, Z, and θ directions by operating the moving mechanisms 12, 13, 16, and 17 in the X, Y, Z, and θ directions. It is configured. 1, the horizontal direction on the paper is the Y direction, the vertical direction of the paper is the Z direction, the vertical direction to the paper is the X direction, and the rotation direction around the Z axis is the θ direction.
　図１に示すように、画像処理部４０は、内部に信号、データの処理を行うＣＰＵ４１と、データやプログラムを記憶するメモリ４２とを備えるコンピュータである。メモリ４２は後で説明する画像取得プログラム４３、相対位置検出プログラム４４、制御データ４５を内部に格納している。また、画像処理部４０は、カメラ３２、ストロボ３４との接続を行うカメラインターフェース４７、ストロボインターフェース４８とを備えている。また、画像処理部４０は、他のコンピュータである制御部５０との間でデータ通信を行うためのデータバスインターフェース４６を備えている。ＣＰＵ４１、メモリ４２、各インターフェース４７，４８とデータバスインターフェース４６とは画像処理部４０内部のデータバス４９によって接続されている。 As shown in FIG. 1, the image processing unit 40 is a computer that includes a CPU 41 for processing signals and data therein, and a memory 42 for storing data and programs. The memory 42 stores therein an image acquisition program 43, a relative position detection program 44, and control data 45 described later. Further, the image processing unit 40 includes a camera interface 47 and a strobe interface 48 for connecting to the camera 32 and the strobe 34. Further, the image processing unit 40 includes a data bus interface 46 for performing data communication with the control unit 50 which is another computer. The CPU 41, the memory 42, the interfaces 47 and 48, and the data bus interface 46 are connected by a data bus 49 inside the image processing unit 40.
　図１に示すように、制御部５０は、画像処理部４０と同様、内部に信号、データの処理を行うＣＰＵ５１と、データやプログラムを記憶するメモリ５２とを備えるコンピュータであり、データバスインターフェース５６と通信ライン６０、画像処理部４０のデータバスインターフェース４６を介して画像処理部４０のＣＰＵ４１、メモリ４２と接続されている。メモリ５２は後で説明する位置制御プログラム５３、補正プログラム５４、制御データ５５を内部に格納している。また、制御部５０は、Ｘ，Ｙ，Ｚ，θ方向の各移動機構１２，１３，１６，１７との接続を行う移動機構インターフェース５７を備えている。ＣＰＵ５１、メモリ５２、移動機構インターフェース５７とデータバスインターフェース５６とは制御部５０内部のデータバス５９によって接続されている。 As shown in FIG. 1, like the image processing unit 40, the control unit 50 is a computer that includes a CPU 51 that internally processes signals and data, and a memory 52 that stores data and programs, and a data bus interface 56. Are connected to the CPU 41 and the memory 42 of the image processing unit 40 via the communication line 60 and the data bus interface 46 of the image processing unit 40. The memory 52 stores therein a position control program 53, a correction program 54, and control data 55, which will be described later. In addition, the control unit 50 includes a moving mechanism interface 57 for connecting to the moving mechanisms 12, 13, 16, and 17 in the X, Y, Z, and θ directions. The CPU 51, the memory 52, the moving mechanism interface 57 and the data bus interface 56 are connected by a data bus 59 inside the control unit 50.
　本実施形態のダイボンダ１０のＸ，Ｙ，Ｚ，θの各移動機構１２，１３，１６，１７は、それぞれ、ボンディングツール２４の先端のＸ，Ｙ，Ｚ，θの各方向の位置を示す信号を出力するように構成されており、制御部５０は、各移動機構１２，１３，１６，１７の信号からボンディングツール２４の先端のＸ，Ｙ，Ｚ，θの各方向の位置を取得する。 The X, Y, Z, and θ moving mechanisms 12, 13, 16, and 17 of the die bonder 10 of the present embodiment are signals indicating the positions of the tip of the bonding tool 24 in the X, Y, Z, and θ directions, respectively. The control unit 50 obtains the position in the X, Y, Z, and θ directions of the tip of the bonding tool 24 from the signals of the moving mechanisms 12, 13, 16, and 17.
　図２に示すように、ボンディングツール２４は、半導体ダイ３０を吸着する先端の吸着面２７と、先端の吸着面２７よりも太い根元２５と、吸着面２７と根元２５とをつなぎ、長手方向中心線９０に対して傾斜した傾斜面である傾斜曲面２６と、を有している。先端の吸着面２７は半導体ダイ３０の大きさと略同様の大きさで、ボンディングツール２４の長手方向中心線９０に対して垂直な平面となっている。このため、吸着面２７に吸着された半導体ダイ３０の裏面もボンディングツール２４の長手方向中心線９０に対して垂直な平面となる。 As shown in FIG. 2, the bonding tool 24 connects the tip suction surface 27 that sucks the semiconductor die 30, the root 25 that is thicker than the tip suction surface 27, and the suction surface 27 and the root 25. And an inclined curved surface 26 that is an inclined surface inclined with respect to the line 90. The suction surface 27 at the tip is substantially the same size as the semiconductor die 30 and is a plane perpendicular to the longitudinal center line 90 of the bonding tool 24. For this reason, the back surface of the semiconductor die 30 attracted to the attracting surface 27 is also a plane perpendicular to the longitudinal center line 90 of the bonding tool 24.
　ボンディングツール２４の根元２５は先端の吸着面２７よりも太く、シャンク２０に固定される円柱形であり、傾斜曲面２６は、吸着面２７から根元２５に向かって漏斗状に広がる曲面である。また、シャンク２０は、内周側にボンディングツール２４の根元２５の外周面が嵌合する円筒形となっており、その下側あるいは吸着面２７の側の端面２１は、ボンディングツール２４の長手方向あるいはボンディングツール２４の長手方向中心線９０に垂直な平面で、その表面が鏡面仕上げされている。シャンク２０はボンディングツール２４と嵌合しているので、ボンディングツール２４との間で相対的に移動せず、根元２５に隣接する位置に配置されている。 The root 25 of the bonding tool 24 is thicker than the suction surface 27 at the tip and is a cylindrical shape fixed to the shank 20, and the inclined curved surface 26 is a curved surface that spreads in a funnel shape from the suction surface 27 toward the root 25. Further, the shank 20 has a cylindrical shape in which the outer peripheral surface of the base 25 of the bonding tool 24 is fitted on the inner peripheral side, and the end surface 21 on the lower side or the suction surface 27 side is in the longitudinal direction of the bonding tool 24. Alternatively, the surface of the bonding tool 24 is a plane perpendicular to the longitudinal center line 90 and the surface thereof is mirror-finished. Since the shank 20 is engaged with the bonding tool 24, the shank 20 does not move relative to the bonding tool 24 and is disposed at a position adjacent to the root 25.
　図２に示すように、カメラ３２は、ボンディングツール２４が真上の所定の位置に移動してきた際にボンディングツール２４に吸着された半導体ダイ３０の裏面（Ｚ方向下側の面）にピントが合うような位置に配置され、半導体ダイ３０の裏面のシャープな画像を取得できるように調整されている。つまり、カメラ３２は、カメラ３２のレンズと半導体ダイ３０の裏面との光路長Ｌ１がカメラ３２のレンズの焦点距離となるように調整されている。 As shown in FIG. 2, the camera 32 is focused on the back surface (the lower surface in the Z direction) of the semiconductor die 30 adsorbed by the bonding tool 24 when the bonding tool 24 moves to a predetermined position directly above. It is arranged so as to fit, and is adjusted so that a sharp image of the back surface of the semiconductor die 30 can be acquired. That is, the camera 32 is adjusted so that the optical path length L1 between the lens of the camera 32 and the back surface of the semiconductor die 30 becomes the focal length of the lens of the camera 32.
　一方、図２に示すように、ボンディングツール２４の傾斜曲面２６、シャンク２０の端面２１は半導体ダイ３０を吸着する吸着面２７から長手方向に離間して配置され、カメラ３２のレンズからボンディングツール２４の傾斜曲面２６、シャンク２０の端面２１までの光路長は光路長Ｌ２，Ｌ３となっている。一方、カメラ３２のレンズの焦点深度Ｄは半導体ダイ３０の厚さよりも少し長い程度であるので、各光路長Ｌ２，Ｌ３はそれぞれ光路長Ｌ１に焦点深度Ｄを加えた長さよりも長くなっている。このため、カメラ３２によって半導体ダイ３０の裏面の画像とボンディングツール２４の傾斜曲面２６の画像とシャンク２０の端面２１の画像とを同時に取得する場合、ボンディングツール２４の傾斜曲面２６とシャンク２０の端面２１はピントが合っていない状態となり、取得する傾斜曲面２６の画像と端面２１の画像とは、多少ぼけた画像となる。 On the other hand, as shown in FIG. 2, the inclined curved surface 26 of the bonding tool 24 and the end surface 21 of the shank 20 are arranged in the longitudinal direction away from the suction surface 27 that sucks the semiconductor die 30, and from the lens of the camera 32 to the bonding tool 24. The optical path lengths to the inclined curved surface 26 and the end surface 21 of the shank 20 are optical path lengths L2 and L3. On the other hand, since the focal depth D of the lens of the camera 32 is slightly longer than the thickness of the semiconductor die 30, the optical path lengths L2 and L3 are longer than the length obtained by adding the focal depth D to the optical path length L1, respectively. . For this reason, when the image of the back surface of the semiconductor die 30, the image of the inclined curved surface 26 of the bonding tool 24, and the image of the end surface 21 of the shank 20 are simultaneously acquired by the camera 32, the inclined curved surface 26 of the bonding tool 24 and the end surface of the shank 20. 21 is in an out-of-focus state, and the acquired image of the inclined curved surface 26 and the image of the end surface 21 are slightly blurred images.
　次に、本実施形態のダイボンダ１０の動作について説明する。図３に示すように、ダイボンダ１０の制御部５０は位置制御プログラム５３を実行してＸ，Ｙ，Ｚ，θ方向の各移動機構１２，１３，１６，１７を駆動してピックアップステージ３６の上に置かれているダイシング済みのウエハの上にボンディングツール２４を移動させ、ボンディングツール２４の先端の吸着面２７に半導体ダイ３０を吸着する。そして、図３に示す軌跡３８のようにボンディングヘッド１５をボンディングステージ３７の上に移動させ、ボンディングヘッド１５をボンディングステージ３７の上に吸着固定させた回路基板の上に降下させ、半導体ダイ３０を回路基板の上にボンディングする。これが、ダイボンダ１０の基本動作である。 Next, the operation of the die bonder 10 of this embodiment will be described. As shown in FIG. 3, the control unit 50 of the die bonder 10 executes a position control program 53 to drive the moving mechanisms 12, 13, 16, 17 in the X, Y, Z, and θ directions to move the top of the pickup stage 36. The bonding tool 24 is moved onto the diced wafer placed on the semiconductor wafer 30 and the semiconductor die 30 is sucked onto the suction surface 27 at the tip of the bonding tool 24. Then, the bonding head 15 is moved onto the bonding stage 37 as shown by a locus 38 shown in FIG. 3, the bonding head 15 is lowered onto the circuit board that is sucked and fixed onto the bonding stage 37, and the semiconductor die 30 is moved. Bond on the circuit board. This is the basic operation of the die bonder 10.
　制御部５０のＣＰＵ５１は、位置制御プログラム５３を実行し、ボンディングツール２４をピックアップステージ３６からボンディングステージ３７に移動させる間、Ｘ，Ｙ，Ｚ，θの各移動機構１２，１３，１６，１７の信号からボンディングツール２４の先端のＸ，Ｙ，Ｚ，θの各方向の位置を検出し、図２に示すように、ボンディングツール２４がカメラ３２の真上の所定の位置に来て、カメラ３２のレンズの中心位置にボンディングツール２４の長手方向中心線９０が合った状態となったらストロボ３４を発光させるトリガ信号を出力する。このトリガ信号は、データバスインターフェース５６，４６、通信ライン６０により画像処理部４０に伝達される。なお、所定の位置は、予め位置制御プログラム５３の中に設定されている位置である。 The CPU 51 of the control unit 50 executes the position control program 53 and moves the bonding tools 24 from the pickup stage 36 to the bonding stage 37 while the X, Y, Z, and θ moving mechanisms 12, 13, 16, and 17 are moved. The position of each of the X, Y, Z, and θ directions of the tip of the bonding tool 24 is detected from the signal, and the bonding tool 24 comes to a predetermined position directly above the camera 32 as shown in FIG. When the longitudinal center line 90 of the bonding tool 24 is aligned with the center position of the lens, a trigger signal for causing the strobe 34 to emit light is output. This trigger signal is transmitted to the image processing unit 40 through the data bus interfaces 56 and 46 and the communication line 60. The predetermined position is a position set in the position control program 53 in advance.
　画像処理部４０のＣＰＵ４１はこのトリガ信号が入力されたら、画像取得プログラム４３を実行する。ＣＰＵ４１は、ストロボ３４を発光させる指令を出力する。この指令により、ストロボインターフェース４８から発光信号がストロボ３４に出力され、ストロボ３４が発光する。また、画像処理部４０は、トリガ信号が入力されたら、ストロボ３４の発光と同期させてカメラインターフェース４７を通してカメラ３２からの画像の取り込みを行う。そして、取り込んだ画像は、画像処理部４０のメモリ４２に格納される。なお、画像の取り込みは、ボンディングツール２４を移動させながら（移動を停止させずに）行う。 The CPU 41 of the image processing unit 40 executes the image acquisition program 43 when this trigger signal is input. The CPU 41 outputs a command for causing the strobe 34 to emit light. In response to this command, a flash signal is output from the flash interface 48 to the flash 34, and the flash 34 emits light. Further, when the trigger signal is input, the image processing unit 40 captures an image from the camera 32 through the camera interface 47 in synchronization with the light emission of the strobe 34. The captured image is stored in the memory 42 of the image processing unit 40. Note that the image is captured while the bonding tool 24 is moved (without stopping the movement).
　ストロボ３４が発光するとストロボ３４からの光は、図４（ａ）に示す矢印７１，７３，７５のようにボンディングツール２４の吸着面２７の側からボンディングツール２４の傾斜曲面２６、半導体ダイ３０の裏面、シャンク２０の端面２１に入射する。シャンク２０の端面２１に入射した光の一部は、図４に示す矢印７２のように、ボンディングツール２４の長手方向あるいは、ボンディングツール２４の長手方向中心線９０に沿った方向（Ｚ方向マイナス側）に向かって反射され、図２に示したように、ボンディングツール２４の下側（吸着面２７側）のカメラ３２に入射する。従って、本実施形態では、シャンク２０は反射体であり、シャンク２０の端面２１は反射面である。また、半導体ダイ３０の裏面あるいは下側の面（Ｚ方向マイナス側の面）に入射した光の一部は、図４（ａ）に示す矢印７５のように、ボンディングツール２４の長手方向あるいは、ボンディングツール２４の長手方向中心線９０に沿った方向（Ｚ方向マイナス側）に向かって反射され、ボンディングツール２４の下側（吸着面２７側）のカメラ３２に入射する。 When the stroboscope 34 emits light, light from the stroboscope 34 from the suction surface 27 side of the bonding tool 24 as shown by arrows 71, 73, 75 shown in FIG. The light enters the back surface, the end surface 21 of the shank 20. A part of the light incident on the end face 21 of the shank 20 is in the longitudinal direction of the bonding tool 24 or in the direction along the longitudinal center line 90 of the bonding tool 24 (Z direction minus side) as indicated by an arrow 72 shown in FIG. ) And enters the camera 32 below the bonding tool 24 (on the suction surface 27 side), as shown in FIG. Therefore, in this embodiment, the shank 20 is a reflector, and the end surface 21 of the shank 20 is a reflecting surface. Further, a part of the light incident on the back surface or the lower surface (the surface on the negative side in the Z direction) of the semiconductor die 30 is, as indicated by an arrow 75 shown in FIG. The light is reflected in the direction along the longitudinal center line 90 of the bonding tool 24 (minus side in the Z direction) and enters the camera 32 on the lower side of the bonding tool 24 (on the suction surface 27 side).
　一方、図４の矢印７３に示すようにボンディングツール２４の傾斜曲面２６に入射した光は、図４（ａ）に示す矢印７４のように、水平方向などボンディングツール２４の長手方向と異なる方向あるいはボンディングツール２４の長手方向中心線９０に沿った方向と異なる方向に向かって反射される。 On the other hand, the light incident on the inclined curved surface 26 of the bonding tool 24 as shown by an arrow 73 in FIG. 4 is a direction different from the longitudinal direction of the bonding tool 24 such as the horizontal direction or the arrow 74 shown in FIG. The light is reflected in a direction different from the direction along the longitudinal center line 90 of the bonding tool 24.
　すると、図４（ｂ）に示すように、カメラ３２の視野３３には、ストロボ３４からの光がカメラ３２に向かって反射する端面２１の明度の高い（白い）リング状の画像８１（反射体の画像）と、ストロボ３４からの光がカメラ３２に向かって反射しないボンディングツール２４の傾斜曲面２６の明度の低い（黒あるいはグレー）円形の画像８２と、円形の画像８２の中に位置するストロボ３４からの光がカメラ３２に向かって反射する半導体ダイ３０の裏面の明度の高い（白い）四角い画像８４と、が捉えられる。画像処理部４０は、カメラ３２によって、この３つの画像８１，８２，８４を同時に取得し、メモリ４２に格納する。なお、図４（ｂ）に破線で示すボンディングツール２４の先端の画像８３は、半導体ダイ３０の画像に隠れてカメラ３２には捉えられない。 Then, as shown in FIG. 4B, in the visual field 33 of the camera 32, the lightness (white) ring-shaped image 81 (reflector) of the end face 21 where the light from the strobe 34 reflects toward the camera 32 is reflected. ), A low-lightness (black or gray) circular image 82 of the inclined curved surface 26 of the bonding tool 24 in which the light from the strobe 34 does not reflect toward the camera 32, and a strobe located in the circular image 82. A high-lightness (white) square image 84 of the back surface of the semiconductor die 30 in which light from 34 is reflected toward the camera 32 is captured. The image processing unit 40 simultaneously acquires these three images 81, 82, and 84 by the camera 32 and stores them in the memory 42. Note that an image 83 of the tip of the bonding tool 24 indicated by a broken line in FIG. 4B is hidden behind the image of the semiconductor die 30 and cannot be captured by the camera 32.
　先に説明したように、カメラ３２のピントは、半導体ダイ３０の裏面に合うように調整されているので、半導体ダイ３０の裏面の画像８４はシャープな画像である。しかし、シャンク２０の端面２１、ボンディングツール２４の傾斜曲面２６は、半導体ダイ３０の裏面からカメラ３２の焦点深度Ｄよりも大きくＺ方向にずれていることから、端面２１の明度の高い（白い）リング状の画像８１と、傾斜曲面２６の明度の低い（黒あるいはグレー）円形の画像８２はぼやけた画像となっている。 As described above, since the focus of the camera 32 is adjusted to match the back surface of the semiconductor die 30, the image 84 on the back surface of the semiconductor die 30 is a sharp image. However, since the end surface 21 of the shank 20 and the inclined curved surface 26 of the bonding tool 24 are shifted in the Z direction from the back surface of the semiconductor die 30 to be larger than the focal depth D of the camera 32, the brightness of the end surface 21 is high (white). The ring-shaped image 81 and the low-intensity (black or gray) circular image 82 of the inclined curved surface 26 are blurred images.
　画像処理部４０のＣＰＵ４１は、相対位置検出プログラム４４を実行する。以下の説明では、画像の明度は、２５６階調（明度０～明度２５５）として説明する。カメラ３２によって取得した画像は、図５（ａ）に示すように、端面２１の明度２５５のリング状の画像８１（反射体の画像）と、ボンディングツール２４の傾斜曲面２６の明度０の円形の画像８２（傾斜面の画像）と、半導体ダイ３０の裏面の明度２５５の四角い画像８４を含んでいる。先に説明したように、リング状の画像８１と、円形の画像８２とはカメラ３２のピントがずれているので、ぼやけた画像となっている。このため、図５（ａ）に示す様に、画像８１の明度は外周部では、線ａで示す様に明度２５５であるが、円形の画像８２に近づくにつれてピンボケのために黒い画像８２の一部が混ざりこみ、線ｂに示す様に少しずつ明度が低下してくる。そして、画像８２の領域の中に入ると、急速に明度が低下し、画像８２の内部領域では、明度は０近傍となる。そして、線ｃで示す様に、明度０の状態は、半導体ダイ３０の裏面の画像８４まで続く。カメラ３２のピントは半導体ダイ３０の裏面に合っているので、画像８４はシャープな輪郭を持っている。また、半導体ダイ３０の裏面はストロボ３４の光を反射しているので明度は明度２５５となっている。従って、画像の明度は、線ｄに示す様に、画像８４のエッジにおいて明度０から明度２５５までほぼ垂直に立ち上がる。そして、画像８４の領域では線ｅに示す様に、明度２５５で一定となる。 The CPU 41 of the image processing unit 40 executes a relative position detection program 44. In the following description, the brightness of the image is described as 256 gradations (brightness 0 to brightness 255). As shown in FIG. 5A, the image acquired by the camera 32 includes a ring-shaped image 81 (reflector image) with a lightness of 255 on the end face 21 and a circular lightness with a lightness of 0 on the inclined curved surface 26 of the bonding tool 24. An image 82 (an image of an inclined surface) and a square image 84 of lightness 255 on the back surface of the semiconductor die 30 are included. As described above, the ring-shaped image 81 and the circular image 82 are blurred because the camera 32 is out of focus. Therefore, as shown in FIG. 5 (a), the brightness of the image 81 is 255 at the outer peripheral portion as shown by the line a. However, as the circular image 82 approaches, the brightness of the black image 82 increases. The part is mixed and the brightness gradually decreases as shown by the line b. Then, when entering the area of the image 82, the brightness rapidly decreases, and in the inner area of the image 82, the brightness is close to zero. Then, as indicated by the line c, the state of lightness 0 continues to the image 84 on the back surface of the semiconductor die 30. Since the camera 32 is focused on the back surface of the semiconductor die 30, the image 84 has a sharp outline. Further, since the back surface of the semiconductor die 30 reflects the light of the strobe 34, the lightness is 255. Accordingly, the brightness of the image rises almost vertically from the brightness 0 to the brightness 255 at the edge of the image 84, as indicated by the line d. In the region of the image 84, the brightness is constant at 255 as indicated by the line e.
　図５（ａ）に示す様に、画像処理部４０のＣＰＵ４１は、予めセットしておいた二値化閾値を用いて、図５（ｂ）に示す様に、画像８２の丸い外形基準線９１と、画像８４の四角い外形基準線９２とを取得する。二値化閾値は、ストロボ３４の光の状態、撮影位置などの条件が基準条件である場合に、ボンディングツール２４の根元２５の外形とほぼ同一の直径の円形の線が画像８２の丸い外形基準線９１として取得できるように予め試験などで決めておくものである。画像８１と画像８２は同心に配置されているボンディングツール２４の傾斜曲面２６とシャンク２０の端面２１の画像であるので、図５に線ａから線ｅで示す各領域の明度の変化は、ボンディングツール２４の長手方向中心線の周りに対象となる。従って、ストロボ３４の光の状態、撮影位置などの条件が基準条件とずれた場合でも画像８１と画像８２との間の明度の変化曲線は、図５（ａ）の一点鎖線ｂ´の様に左右対象（ボンディングツール２４の長手方向中心線の周りに対象）となるので、図５（ｂ）に示す二値化閾値を用いて取得する丸い外形基準線９１´は、ボンディングツール２４の根元２５の外形よりも小さい直径のボンディングツール２４の外形と同心円となる。このため、ストロボ３４の光の状態、撮影位置などの条件が基準条件とずれた場合でも丸い外形基準線９１、９１´の中心はいずれもボンディングツール２４の長手方向中心線の位置と一致する。 As shown in FIG. 5A, the CPU 41 of the image processing unit 40 uses a preset binarization threshold value, as shown in FIG. And the square outline reference line 92 of the image 84 are acquired. The binarization threshold is such that a circular line having a diameter substantially the same as the outer shape of the root 25 of the bonding tool 24 is a round outer reference of the image 82 when conditions such as the light state of the strobe 34 and the photographing position are reference conditions. It is determined in advance by a test or the like so that it can be acquired as the line 91. Since the image 81 and the image 82 are images of the inclined curved surface 26 of the bonding tool 24 and the end surface 21 of the shank 20 arranged concentrically, the change in brightness of each region indicated by the line a to the line e in FIG. The object is around the longitudinal center line of the tool 24. Therefore, even when conditions such as the light state of the strobe 34 and the photographing position deviate from the reference conditions, the change curve of the brightness between the image 81 and the image 82 is as shown by the alternate long and short dash line b ′ in FIG. Since the left and right objects (objects around the center line in the longitudinal direction of the bonding tool 24), the round outline reference line 91 ′ acquired using the binarization threshold shown in FIG. 5B is the root 25 of the bonding tool 24. It becomes a concentric circle with the outer shape of the bonding tool 24 having a diameter smaller than the outer shape. For this reason, even when conditions such as the light state of the strobe 34 and the photographing position deviate from the reference conditions, the centers of the round outline reference lines 91 and 91 ′ coincide with the position of the longitudinal center line of the bonding tool 24.
　なお、半導体ダイ３０の裏面にはピントが合っており、画像８４のエッジではほぼ垂直に明度が変化するので、ストロボ３４の光の状態、撮影位置などの条件が基準条件とずれた場合でも画像８４の四角い外形基準線９２の大きさはほとんど変わらない。 Note that the back surface of the semiconductor die 30 is in focus, and the brightness changes almost vertically at the edge of the image 84. Therefore, even if the light condition of the strobe 34, the shooting position, etc. deviate from the reference condition, the image The size of 84 square outline reference lines 92 is almost the same.
　つまり、本実施形態では、ストロボ３４の光を反射している端面２１のリング状の画像８１は明度が高く、逆にストロボ３４の光を反射していない傾斜曲面２６の円形の画像８２は明度が低く、その明度差が非常に大きくなっている。このため、端面２１、傾斜曲面２６のボンディングツール２４の長手方向の位置が半導体ダイ３０の裏面から焦点深度Ｄよりも離れており、シャープな画像を取得できなくとも、各画像８１，８２の明度差が大きいことを利用して、確実にボンディングツール２４の外形と同心円の円形の外形基準線９１を抽出できる。また、半導体ダイ３０の裏面の画像８４のシャープなエッジを利用して確実に四角い外形基準線９２を抽出することができる。 That is, in the present embodiment, the ring-shaped image 81 of the end face 21 that reflects the light of the strobe 34 has high brightness, and conversely, the circular image 82 of the inclined curved surface 26 that does not reflect the light of the strobe 34 has lightness. Is low and the brightness difference is very large. Therefore, the longitudinal positions of the bonding tool 24 of the end surface 21 and the inclined curved surface 26 are separated from the back surface of the semiconductor die 30 by the depth of focus D, and the brightness of the images 81 and 82 can be obtained even if a sharp image cannot be acquired. By utilizing the large difference, it is possible to reliably extract the circular outer shape reference line 91 concentric with the outer shape of the bonding tool 24. In addition, the square outline reference line 92 can be reliably extracted using the sharp edge of the image 84 on the back surface of the semiconductor die 30.
　図６に示すように、画像処理部４０は、処理した画像から円形の外形基準線９１の中心９７の位置と、四角い外形基準線９２の中心９８の位置を検出し、円形の外形基準線９１の中心９７を通りカメラ３２の視野３３のＸ方向に向かうＸ方向基準線９４と、円形の外形基準線９１の中心９７を通りカメラ３２の視野３３のＹ方向に向かうＹ方向基準線９３とを設定する。また、画像処理部４０は、四角い外形基準線９２の中心９８を通り四角い外形基準線９２のＸ方向基準線９４に近い辺に並行なＸ方向計測線９６と四角い外形基準線９２の中心９８を通り四角い外形基準線９２のＹ方向基準線９３に近い辺に並行なＹ方向計測線９５とを設定する。そして、画像処理部４０は、円形の外形基準線９１の中心９７の位置と四角い外形基準線９２の中心９８の位置のＸ方向、Ｙ方向それぞれのずれ量ΔＸ，ΔＹを求める。また、画像処理部４０は、Ｘ方向基準線９４とＸ方向計測線９６とのθ方向の角度差あるいはＹ方向基準線９３とＹ方向計測線９５とのθ方向の角度差から四角い外形基準線９２のθ方向の回転角度ずれΔθを検出する。 As shown in FIG. 6, the image processing unit 40 detects the position of the center 97 of the circular outline reference line 91 and the position of the center 98 of the square outline reference line 92 from the processed image, and the circular outline reference line 91. An X-direction reference line 94 passing through the center 97 of the camera 32 and extending in the X direction of the field of view 33 of the camera 32, and a Y-direction reference line 93 passing through the center 97 of the circular outer shape reference line 91 and extending in the Y direction of the field of view 33 of the camera 32. Set. Further, the image processing unit 40 passes through the center 98 of the square outline reference line 92 and the X direction measurement line 96 and the center 98 of the square outline reference line 92 parallel to the side of the square outline reference line 92 close to the X direction reference line 94. A Y-direction measurement line 95 is set in parallel to a side of the street square outline reference line 92 close to the Y-direction reference line 93. Then, the image processing unit 40 obtains deviation amounts ΔX and ΔY in the X direction and the Y direction between the position of the center 97 of the circular outline reference line 91 and the position of the center 98 of the square outline reference line 92, respectively. The image processing unit 40 also calculates a square outline reference line from the angle difference in the θ direction between the X direction reference line 94 and the X direction measurement line 96 or the angle difference in the θ direction between the Y direction reference line 93 and the Y direction measurement line 95. The rotation angle deviation Δθ of 92 in the θ direction is detected.
　先に説明したように、円形の外形基準線９１は、ボンディングツール２４と相対的に位置がずれないシャンク２０の端面２１の内側の外形線と同心円であり、かつ、ボンディングツール２４の外形線と同心円でもあることから、円形の外形基準線９１の中心９７の位置は図４（ａ）に示すボンディングツール２４の長手方向中心線９０の中心位置であり、四角い外形基準線９２は半導体ダイ３０の外形のエッジであることから四角い外形基準線９２の中心９８は、半導体ダイ３０の中心位置となる。従って、円形の外形基準線９１と四角い外形基準線９２とのＸ、Ｙ方向の各ずれ量ΔＸ，ΔＹは、ボンディングツール２４の中心位置と半導体ダイ３０の中心位置とのＸ、Ｙ方向の各ずれ量となる。 As described above, the circular outer shape reference line 91 is concentric with the outer shape line inside the end surface 21 of the shank 20 that is not displaced relative to the bonding tool 24, and the outer shape line of the bonding tool 24 is Since it is also a concentric circle, the position of the center 97 of the circular outline reference line 91 is the center position of the longitudinal center line 90 of the bonding tool 24 shown in FIG. 4A, and the square outline reference line 92 is the position of the semiconductor die 30. Since it is an edge of the outer shape, the center 98 of the square outer reference line 92 is the center position of the semiconductor die 30. Therefore, the deviation amounts ΔX and ΔY in the X and Y directions between the circular outer shape reference line 91 and the square outer shape reference line 92 are the X and Y direction differences between the center position of the bonding tool 24 and the center position of the semiconductor die 30. It becomes the amount of deviation.
　同様に円形の外形基準線９１の中心９７を通りカメラ３２の視野３３のＸ方向に向かうＸ方向基準線９４と、円形の外形基準線９１の中心９７を通りカメラ３２の視野３３のＹ方向に向かうＹ方向基準線９３とは、ボンディングツール２４の吸着面２７の上の基準線であり、四角い外形基準線９２の中心９８を通り四角い外形基準線９２のＸ方向基準線９４に近い辺に並行なＸ方向計測線９６と四角い外形基準線９２の中心９８を通り四角い外形基準線９２のＹ方向基準線９３に近い辺に並行なＹ方向計測線９５は、ボンディングツール２４の吸着面２７の上の基準線に対する半導体ダイ３０の傾斜角度を示す線となる。従って、Ｘ方向基準線９４とＸ方向計測線９６とのθ方向の角度差あるいはＹ方向基準線９３とＹ方向計測線９５とのθ方向の角度差から求められる四角い外形基準線９２のθ方向の回転角度ずれΔθは、ボンディングツール２４の吸着面２７の上の基準軸に対する半導体ダイ３０の傾斜角度となる。そして、ボンディングツール２４の中心位置と半導体ダイ３０の中心位置とのＸ、Ｙ方向の各ずれ量と、ボンディングツール２４の吸着面２７の上の基準軸に対する半導体ダイ３０の傾斜角度とは、ボンディングツール２４と半導体ダイ３０との相対位置である。 Similarly, an X-direction reference line 94 that passes through the center 97 of the circular outer shape reference line 91 and goes in the X direction of the visual field 33 of the camera 32, and passes through the center 97 of the circular outer shape reference line 91 in the Y direction of the visual field 33 of the camera 32. The heading Y-direction reference line 93 is a reference line on the suction surface 27 of the bonding tool 24, passes through the center 98 of the rectangular outer shape reference line 92, and is parallel to a side near the X-direction reference line 94 of the rectangular outer shape reference line 92. The Y-direction measurement line 95 passing through the center 98 of the square X-direction measurement line 96 and the square outline reference line 92 and parallel to the side close to the Y-direction reference line 93 of the square outline reference line 92 is on the suction surface 27 of the bonding tool 24. This is a line indicating the inclination angle of the semiconductor die 30 with respect to the reference line. Accordingly, the θ direction of the square outline reference line 92 obtained from the angle difference in the θ direction between the X direction reference line 94 and the X direction measurement line 96 or the angle difference in the θ direction between the Y direction reference line 93 and the Y direction measurement line 95. Is a tilt angle of the semiconductor die 30 with respect to the reference axis on the suction surface 27 of the bonding tool 24. The amount of deviation in the X and Y directions between the center position of the bonding tool 24 and the center position of the semiconductor die 30 and the inclination angle of the semiconductor die 30 with respect to the reference axis on the suction surface 27 of the bonding tool 24 are determined by bonding. The relative position between the tool 24 and the semiconductor die 30.
　画像処理部４０は、ボンディングツール２４に対する半導体ダイ３０のＸ，Ｙ，θ方向の各ずれ量ΔＸ，ΔＹ，Δθを検出したら、そのデータをデータバスインターフェース４６，５６，通信ライン６０を通して制御部５０に送信する。制御部５０のＣＰＵ５１は、補正プログラム５４を実行し、ボンディングツール２４を図３に示すボンディングステージ３７に移動するまでの間に各移動機構１２，１３，１６，１７によって検出するボンディングツール２４の先端の位置を受信したＸ，Ｙ，θ方向の各ずれ量ΔＸ，ΔＹ，Δθだけ補正し、ボンディングステージ３７の上の回路基板に正確な位置、方向で半導体ダイ３０をボンディングすることができる。 When the image processing unit 40 detects the deviation amounts ΔX, ΔY, Δθ of the semiconductor die 30 with respect to the bonding tool 24 in the X, Y, θ directions, the data is transmitted to the control unit 50 through the data bus interfaces 46, 56 and the communication line 60. Send to. The CPU 51 of the control unit 50 executes the correction program 54 and detects the tip of the bonding tool 24 detected by each moving mechanism 12, 13, 16, 17 until the bonding tool 24 is moved to the bonding stage 37 shown in FIG. 3. Thus, the semiconductor die 30 can be bonded to the circuit board on the bonding stage 37 at an accurate position and direction by correcting the received positions by X, Y, and θ shift amounts ΔX, ΔY, and Δθ.
　以上、説明したように、本実施形態のダイボンダ１０は、ボンディングツール２４を把持しているシャンク２０の端面２１の画像８１と、ボンディングツール２４の傾斜曲面２６の画像８２との明度差、半導体ダイ３０の裏面の画像８４とボンディングツール２４の傾斜曲面２６の画像８２との明度差を利用してボンディングツール２４の長手方向中心線９０の中心位置、半導体ダイ３０の中心位置を検出するので、端面２１、傾斜曲面２６が半導体ダイ３０の裏面から焦点深度Ｄよりも大きくずれており、各画像８１，８２がシャープでない場合でも確実にボンディングツール２４と半導体ダイ３０との相対位置を検出することができる。このため、シャンク２０の端面２１を鏡面仕上げして反射面とするという簡便な構成で、複雑な光学系を用いなくとも効果的に半導体ダイの位置ずれを検出することができる。また、シャンク２０はボンディングツール２４を把持するものであり、ボンディングツール２４と相対的な移動が無いので、ボンディングツール２４、シャンク２０、半導体ダイ３０の画像を取得する際にボンディングツール２４の移動を停止する必要が無く、タクトタイムを短縮することができる。さらに、シャンク２０はボンディングヘッド１５から突出していないので、ボンディングヘッド１５の移動により振動が発生することが無く、簡便な構成で、効果的に半導体ダイの位置ずれを検出することができる。 As described above, the die bonder 10 according to the present embodiment has a brightness difference between the image 81 of the end surface 21 of the shank 20 holding the bonding tool 24 and the image 82 of the inclined curved surface 26 of the bonding tool 24. Since the center position of the longitudinal center line 90 of the bonding tool 24 and the center position of the semiconductor die 30 are detected using the difference in brightness between the image 84 of the back surface 30 and the image 82 of the inclined curved surface 26 of the bonding tool 24, the end surface 21. The inclined curved surface 26 deviates from the back surface of the semiconductor die 30 more than the depth of focus D, and the relative position between the bonding tool 24 and the semiconductor die 30 can be reliably detected even when the images 81 and 82 are not sharp. it can. For this reason, it is possible to detect the positional deviation of the semiconductor die effectively without using a complicated optical system with a simple configuration in which the end surface 21 of the shank 20 is mirror-finished to be a reflecting surface. Further, since the shank 20 holds the bonding tool 24 and does not move relative to the bonding tool 24, the movement of the bonding tool 24 is performed when images of the bonding tool 24, the shank 20, and the semiconductor die 30 are acquired. There is no need to stop and the tact time can be shortened. Further, since the shank 20 does not protrude from the bonding head 15, no vibration is generated by the movement of the bonding head 15, and the semiconductor die position shift can be detected effectively with a simple configuration.
　本実施形態では、ボンディングツール２４の傾斜面は漏斗状の傾斜曲面２６であるとして説明したが、傾斜面は、ボンディングツール２４の長手方向中心線９０に対して傾斜しており、ストロボ３４からの光を長手方向中心線９０に沿った方向に反射しないような面であればどのような形状であってもよく、例えば、吸着面２７と根元２５とを斜めにつなぐテーパ面であってもよい。 In the present embodiment, the inclined surface of the bonding tool 24 has been described as the funnel-shaped inclined curved surface 26, but the inclined surface is inclined with respect to the longitudinal center line 90 of the bonding tool 24, and from the strobe 34. Any shape may be used as long as it does not reflect light in the direction along the longitudinal center line 90. For example, it may be a tapered surface that obliquely connects the suction surface 27 and the root 25. .
　また、本実施形態では、ボンディングの動作中に位置ずれ量を検出し、その補正を行うこととして説明したが、本発明は、ボンディングの動作中の補正のみでなく、例えば、実製品のボンディングの前のトレーニングあるいはティーチングにおいて、予め位置ずれを測定しその結果によりボンディングツール２４のオフセット量を設定する際にも適用することができる。その場合には、画像を取得する際にボンディングツール２４の移動を停止させ、静止状態で撮像したボンディングツール２４の傾斜曲面２６、シャンク２０、半導体ダイ３０の各画像８１，８２，８４とボンディングツール２４の移動を停止せずに取得した各画像８１，８２，８４を組み合わせてずれ量、オフセット量を設定するようにしてもよい。 In the present embodiment, the positional deviation amount is detected during the bonding operation and corrected. However, the present invention is not limited to the correction during the bonding operation. In the previous training or teaching, the present invention can also be applied to the case where the positional deviation is measured in advance and the offset amount of the bonding tool 24 is set based on the result. In that case, when the image is acquired, the movement of the bonding tool 24 is stopped, and the inclined curved surface 26 of the bonding tool 24, the shank 20, the images 81, 82, and 84 of the semiconductor die 30 taken in a stationary state and the bonding tool. The shift amount and the offset amount may be set by combining the images 81, 82, and 84 acquired without stopping the movement of 24.
　また、本実施形態では、ボンディングツール２４とボンディングツール２４の吸着面２７に吸着された半導体ダイ３０との相対位置に基づいてボンディングツール２４の位置を補正することとして説明したが、ボンディングツール２４の長手方向中心線９０の位置検出結果を利用して、ボンディングツール２４とピックアップステージ３６あるいはボンディングステージ３７との間の相対位置を補正し、ダイボンダ１０の温度変化によるピックアップ位置あるいはボンディング位置のずれ量を補正することとしてもよい。この場合、例えば、ボンディングツール２４とピックアップステージ３６あるいはボンディングステージ３７との間の位置ずれの移動平均を求め、この移動平均値の変化の傾向に基づいてずれ量の補正方向を決定するようにしてもよい。 In the present embodiment, the position of the bonding tool 24 is corrected based on the relative position between the bonding tool 24 and the semiconductor die 30 sucked on the suction surface 27 of the bonding tool 24. Using the position detection result of the longitudinal center line 90, the relative position between the bonding tool 24 and the pickup stage 36 or the bonding stage 37 is corrected, and the deviation amount of the pickup position or the bonding position due to the temperature change of the die bonder 10 is corrected. It is good also as correcting. In this case, for example, a moving average of the positional deviation between the bonding tool 24 and the pickup stage 36 or the bonding stage 37 is obtained, and the correction direction of the deviation amount is determined based on the tendency of the change of the moving average value. Also good.
　次に、図７、図８を参照して、本発明の他の実施形態について説明する。図１から図６を参照して説明した実施形態と同様の部分には同様の符号を付して説明は省略する。図７に示す実施形態は、図１から図６を参照して説明した実施形態のシャンク２０の下側にボンディングツール２４の根元２５の外周に嵌って固定されるリング２２を取り付けたものである。リング２２の下側の端面２３は鏡面仕上げされてストロボ３４からの光を反射することができるように構成されている。本実施形態では、リング２２が反射体であり、端面２３が反射面で、リング２２は根元２５に隣接して配置されている。 Next, another embodiment of the present invention will be described with reference to FIGS. Parts similar to those of the embodiment described with reference to FIG. 1 to FIG. In the embodiment shown in FIG. 7, a ring 22 that is fitted and fixed to the outer periphery of the root 25 of the bonding tool 24 is attached to the lower side of the shank 20 of the embodiment described with reference to FIGS. 1 to 6. . The lower end surface 23 of the ring 22 is mirror-finished so that light from the strobe 34 can be reflected. In the present embodiment, the ring 22 is a reflector, the end surface 23 is a reflecting surface, and the ring 22 is disposed adjacent to the root 25.
　図７（ｂ）に示すように、本実施形態では、カメラ３２は、少しぼけた明度の高い（白い）リング状のリング２２の端面２３の画像８６と、少しぼけたボンディングツール２４の傾斜曲面２６の明度の低い（黒またはグレー）の画像８２と、明度の高い（白い）半導体ダイ３０の裏面の画像８４とを取得し、端面２３の画像８６と傾斜曲面２６画像８２との円形の外形基準線９１と、傾斜曲面２６画像８２と半導体ダイ３０の裏面の画像８４との四角い外形基準線９２とを抽出し、ボンディングツール２４と半導体ダイ３０との相対位置を検出する。本実施形態の効果は先に図１から図６を参照して説明した実施形態と同様である。 As shown in FIG. 7B, in this embodiment, the camera 32 has a slightly blurred image 86 of the end surface 23 of the ring-shaped ring 22 with a high brightness (white) and a slightly curved surface of the bonding tool 24 slightly blurred. 26, a low brightness (black or gray) image 82 and a high brightness (white) backside image 84 of the semiconductor die 30 are obtained, and a circular outer shape of the image 86 of the end face 23 and the inclined curved surface 26 image 82 is obtained. A reference line 91, a square outline reference line 92 of the inclined curved surface 26 image 82 and the back surface image 84 of the semiconductor die 30 are extracted, and a relative position between the bonding tool 24 and the semiconductor die 30 is detected. The effect of this embodiment is the same as that of the embodiment described above with reference to FIGS.
　図８（ａ）に示す他の実施形態は、ボンディングツール２４の根元２５を段つきとし、その段部２８の下側の下面２９を鏡面仕上げとしてストロボ３４からの光を反射することができるようにしたものである。本実施形態では、ボンディングツール２４の段部２８が反射体であり、段部２８の下面２９が反射面で、下面２９は根元２５に隣接して配置されている。 In another embodiment shown in FIG. 8A, the base 25 of the bonding tool 24 is stepped, and the lower surface 29 below the stepped portion 28 is mirror-finished so that light from the strobe 34 can be reflected. It is a thing. In the present embodiment, the step portion 28 of the bonding tool 24 is a reflector, the lower surface 29 of the step portion 28 is a reflecting surface, and the lower surface 29 is disposed adjacent to the root 25.
　図８（ｂ）に示すように、本実施形態では、カメラ３２は、少しぼけた明度の高い（白い）リング状の段部２８の下面２９の画像８８と、少しぼけたボンディングツール２４の傾斜曲面２６の明度の低い（黒またはグレー）の画像８２と、明度の高い（白い）半導体ダイ３０の裏面の画像８４とを取得し、下面２９の画像８８と傾斜曲面２６画像８２との円形の外形基準線９１と、傾斜曲面２６画像８２と半導体ダイ３０の裏面の画像８４との四角い外形基準線９２とを抽出し、ボンディングツール２４と半導体ダイ３０との相対位置を検出する。本実施形態の効果は先に図１から図６を参照して説明した実施形態と同様である。 As shown in FIG. 8B, in the present embodiment, the camera 32 has an image 88 of the lower surface 29 of the ring-shaped step portion 28 having a slightly blurred high brightness (white) and a slightly inclined tilt of the bonding tool 24. A low-lightness (black or gray) image 82 of the curved surface 26 and a high-lightness (white) image 84 of the back surface of the semiconductor die 30 are obtained, and the circular image of the image 88 of the bottom surface 29 and the inclined curved surface 26 image 82 is obtained. The outline reference line 91, the square outline reference line 92 of the inclined curved surface 26 image 82 and the back surface image 84 of the semiconductor die 30 are extracted, and the relative position between the bonding tool 24 and the semiconductor die 30 is detected. The effect of this embodiment is the same as that of the embodiment described above with reference to FIGS.
　本発明は以上説明した実施形態に限定されるものではなく、請求の範囲により規定されている本発明の技術的範囲ないし本質から逸脱することない全ての変更及び修正を包含するものである。 The present invention is not limited to the embodiments described above, but includes all changes and modifications that do not depart from the technical scope or essence of the present invention defined by the claims.
　１０　ダイボンダ、１１　ガイドレール、１２　Ｘ方向移動機構、１３　Ｙ方向移動機構、１５　ボンディングヘッド、１６　Ｚ方向移動機構、１７　θ方向移動機構、２０　シャンク、２１，２３　端面、２２　リング、２４　ボンディングツール、２５　根元、２６　傾斜曲面、２７　吸着面、２８　段部、２９　下面、３０　半導体ダイ、３２　カメラ、３３　視野、３４　ストロボ、３５　反射鏡、３６　ピックアップステージ、３７　ボンディングステージ、３８　軌跡、４０　画像処理部、４１，５１　ＣＰＵ、４２，５２　メモリ、４３　画像取得プログラム、４４　相対位置検出プログラム、４５，５５　制御データ、４６，５６　データバスインターフェース、４７　カメラインターフェース、４８　ストロボインターフェース、４９，５９　データバス、５０　制御部、５３　位置制御プログラム、５４　補正プログラム、５７　移動機構インターフェース、６０　通信ライン、７１～７６　矢印、８１～８９　画像、９０　長手方向中心線、９１　円形の外形基準線、９２　四角い外形基準線、９３　Ｙ方向基準線、９４　Ｘ方向基準線、９５　Ｙ方向計測線、９６　Ｘ方向計測線、９７，９８　中心、Ｄ　焦点深度、Ｌ１～Ｌ３　光路長、ΔＸ，ΔＹ，Δθ　ずれ量。 10 die bonder, 11 guide rail, 12 X direction moving mechanism, 13 Y direction moving mechanism, 15 bonding head, 16 Z direction moving mechanism, 17 θ direction moving mechanism, 20 shank, 21, 23 end face, 22 ring, 24 bonding tool, 25 root, 26 inclined surface, 27 suction surface, 28 steps, 29 bottom, 30 semiconductor die, 32 camera, 33 field of view, 34 strobe, 35 reflector, 36 pickup stage, 37 bonding stage, 38 locus, 40 image processing unit 41, 51 CPU, 42, 52 memory, 43 image acquisition program, 44 relative position detection program, 45, 55 control data, 46, 56 data bus interface, 47 camera interface, 48 strobe interface Ace, 49, 59 data bus, 50 control unit, 53 position control program, 54 correction program, 57 movement mechanism interface, 60 communication line, 71-76 arrow, 81-89 image, 90 longitudinal center line, 91 circular outline Reference line, 92 square outline reference line, 93 Y direction reference line, 94 X direction reference line, 95 Y direction measurement line, 96 X direction measurement line, 97, 98 center, D focal depth, L1-L3 optical path length, ΔX, ΔY, Δθ Deviation amount.

Claims (12)

  1. 　ボンディングツールと、
    　光源と、
    　カメラと、
    　反射体と、
    　を含み、
    　前記ボンディングツールは、半導体ダイを吸着する先端の吸着面と、先端の前記吸着面よりも太い根元と、前記吸着面と前記根元とをつなぎ、長手方向中心線に対して傾斜した傾斜面と、を備え、
    　前記光源は、前記ボンディングツールの前記吸着面側に配置され、
    　前記カメラは、前記吸着面に吸着された前記半導体ダイの画像と前記反射体の画像と前記ボンディングツールの前記傾斜面の画像とを同時に取得し、
    　前記反射体は、前記ボンディングツールの前記根元に隣接し、前記吸着面から前記ボンディングツールの長手方向に前記カメラの焦点深度よりも離間して配置されると共に、前記ボンディングツールとの間で相対的に移動せず、前記光源からの光を少なくとも前記ボンディングツールの前記吸着面側に反射する、
    　ダイボンダ。     A bonding tool,
    A light source;
    A camera,
    A reflector,
    Including
    The bonding tool includes a suction surface at a tip that sucks a semiconductor die, a base thicker than the suction surface at a tip, an inclined surface that connects the suction surface and the root, and is inclined with respect to a longitudinal center line. With
    The light source is disposed on the suction surface side of the bonding tool,
    The camera simultaneously acquires an image of the semiconductor die adsorbed on the adsorption surface, an image of the reflector, and an image of the inclined surface of the bonding tool,
    The reflector is adjacent to the base of the bonding tool, and is spaced apart from the suction surface in the longitudinal direction of the bonding tool with respect to the focal depth of the camera, and relative to the bonding tool. The light from the light source is reflected at least on the suction surface side of the bonding tool,
    Die bonder.
  2. 　請求項１に記載のダイボンダであって、
    　更に、画像処理部を含み、
    　前記画像処理部は、
    　前記カメラによって取得した前記反射体の画像と、前記カメラによって取得した前記ボンディングツールの前記傾斜面の画像と、前記カメラによって取得した前記半導体ダイの画像とを処理し、前記ボンディングツールと前記半導体ダイとの相対位置を検出するダイボンダ。     The die bonder according to claim 1,
    Furthermore, an image processing unit is included,
    The image processing unit
    An image of the reflector acquired by the camera, an image of the inclined surface of the bonding tool acquired by the camera, and an image of the semiconductor die acquired by the camera are processed, and the bonding tool and the semiconductor die are processed. A die bonder that detects the relative position of
  3. 　請求項１に記載のダイボンダであって、
    　前記反射体は、前記ボンディングツールを把持するシャンクまたは、前記ボンディングツールに取り付けたリングまたは、前記ボンディングツールの前記根元に隣接する段部であり、前記ボンディングツールの長手方向中心線に対して垂直な反射面を有し、
    　前記反射面は、前記シャンクの前記吸着面側の端面または、前記リングの前記吸着面側の端面または、前記段部の端面であるダイボンダ。     The die bonder according to claim 1,
    The reflector is a shank that grips the bonding tool, a ring attached to the bonding tool, or a step adjacent to the root of the bonding tool, and is perpendicular to the longitudinal center line of the bonding tool. Having a reflective surface,
    The reflective surface is a die bonder that is an end surface on the suction surface side of the shank, an end surface on the suction surface side of the ring, or an end surface of the stepped portion.
  4. 　請求項２に記載のダイボンダであって、
    　前記反射体は、前記ボンディングツールを把持するシャンクまたは、前記ボンディングツールに取り付けたリングまたは、前記ボンディングツールの前記根元に隣接する段部であり、前記ボンディングツールの長手方向中心線に対して垂直な反射面を有し、
    　前記反射面は、前記シャンクの前記吸着面側の端面または、前記リングの前記吸着面側の端面または、前記段部の端面であるダイボンダ。     The die bonder according to claim 2,
    The reflector is a shank that grips the bonding tool, a ring attached to the bonding tool, or a step adjacent to the root of the bonding tool, and is perpendicular to the longitudinal center line of the bonding tool. Having a reflective surface,
    The reflective surface is a die bonder that is an end surface on the suction surface side of the shank, an end surface on the suction surface side of the ring, or an end surface of the stepped portion.
  5. 　請求項２に記載のダイボンダであって、
    　前記ボンディングツールと前記半導体ダイとの相対位置は、前記ボンディングツールの長手方向中心線の前記吸着面上の位置と前記半導体ダイの中心の前記吸着面上の位置との間のずれ量または、前記吸着面上の基準軸に対する前記半導体ダイの傾斜角度のいずれか一方または両方であるダイボンダ。     The die bonder according to claim 2,
    The relative position between the bonding tool and the semiconductor die is the amount of deviation between the position on the suction surface of the longitudinal center line of the bonding tool and the position on the suction surface at the center of the semiconductor die, or A die bonder that is one or both of the inclination angles of the semiconductor die with respect to a reference axis on a suction surface.
  6. 　請求項１に記載のダイボンダであって、
    　更に、移動機構と、
    　制御部と、を含み、
    　前記移動機構は、前記ボンディングツールを移動させ、
    　前記制御部は、前記移動機構によって前記ボンディングツールを移動させ、前記ボンディングツールが前記半導体ダイのピックアップ位置からボンディング位置との間の所定の位置に達した際に前記光源を発光させ、前記ボンディングツールを移動させながら前記カメラによって前記吸着面に吸着された半導体ダイの画像と前記ボンディングツールの前記傾斜面の画像と前記反射体の画像とを同時に取得するダイボンダ。     The die bonder according to claim 1,
    A moving mechanism;
    A control unit,
    The moving mechanism moves the bonding tool,
    The control unit moves the bonding tool by the moving mechanism, and causes the light source to emit light when the bonding tool reaches a predetermined position between a pickup position of the semiconductor die and a bonding position, and the bonding tool A die bonder that simultaneously acquires an image of the semiconductor die adsorbed on the adsorption surface by the camera, an image of the inclined surface of the bonding tool, and an image of the reflector while moving the image.
  7. 　請求項２に記載のダイボンダであって、
    　更に、移動機構と、
    　制御部と、を含み、
    　前記移動機構は、前記ボンディングツールを移動させ、
    　前記制御部は、前記移動機構によって前記ボンディングツールを移動させ、前記ボンディングツールが前記半導体ダイのピックアップ位置からボンディング位置との間の所定の位置に達した際に前記光源を発光させ、前記ボンディングツールを移動させながら前記カメラによって前記吸着面に吸着された半導体ダイの画像と前記ボンディングツールの前記傾斜面の画像と前記反射体の画像とを同時に取得するダイボンダ。     The die bonder according to claim 2,
    A moving mechanism;
    A control unit,
    The moving mechanism moves the bonding tool,
    The control unit moves the bonding tool by the moving mechanism, and causes the light source to emit light when the bonding tool reaches a predetermined position between a pickup position of the semiconductor die and a bonding position, and the bonding tool A die bonder that simultaneously acquires an image of the semiconductor die adsorbed on the adsorption surface by the camera, an image of the inclined surface of the bonding tool, and an image of the reflector while moving the image.
  8. 　請求項２に記載のダイボンダであって、
    　更に、移動機構と、
    　制御部と、を含み、
    　前記移動機構は、前記ボンディングツールを移動させ、
    　前記制御部は、前記移動機構によって前記ボンディングツールの位置を変化させると共に、前記画像処理部の検出した前記ボンディングツールと前記半導体ダイとの相対位置に基づいて前記ボンディングツールの位置を補正するダイボンダ。     The die bonder according to claim 2,
    A moving mechanism;
    A control unit,
    The moving mechanism moves the bonding tool,
    The control unit is a die bonder that changes the position of the bonding tool by the moving mechanism and corrects the position of the bonding tool based on the relative position between the bonding tool and the semiconductor die detected by the image processing unit.
  9. 　ダイボンダにおいて、ボンディングツールと半導体ダイとの相対位置を検出する位置検出方法であって、
    　画像取得工程と、
    　相対位置検出工程と、
    　を含み、
    　前記ダイボンダは、前記半導体ダイを吸着する先端の吸着面と、先端の前記吸着面よりも太い根元と、前記吸着面と前記根元とをつなぎ、長手方向中心線に対して傾斜した傾斜面と、を有するボンディングツールと、前記ボンディングツールの吸着面側に配置される光源と、前記ボンディングツールとの間で相対的に移動せず、前記光源からの光を前記ボンディングツールの前記吸着面側に反射する反射体と、前記吸着面に吸着された半導体ダイの画像と前記反射体の画像と前記ボンディングツールの前記傾斜面の画像とを同時に取得するカメラと、を備え、前記反射体が前記ボンディングツールの前記根元に隣接し、前記吸着面から前記ボンディングツールの長手方向に前記カメラの焦点深度よりも離間して配置され、前記ボンディングツールの長手方向中心線に対して垂直な反射面を含み、
    　前記画像取得工程は、前記カメラによって前記吸着面に吸着された前記半導体ダイの画像と前記反射体の画像と前記ボンディングツールの前記傾斜面の画像とを同時に取得し、
    　前記相対位置検出工程は、前記カメラによって取得した前記反射体の画像と、前記カメラによって取得した前記ボンディングツールの前記傾斜面の画像と、前記カメラによって取得した前記半導体ダイの画像とから前記ボンディングツールと前記半導体ダイとの相対位置を検出する位置検出方法。     In a die bonder, a position detection method for detecting a relative position between a bonding tool and a semiconductor die,
    An image acquisition process;
    A relative position detection step;
    Including
    The die bonder has an adsorption surface at the tip that adsorbs the semiconductor die, a root thicker than the adsorption surface at the tip, an inclined surface that connects the adsorption surface and the root, and is inclined with respect to a longitudinal centerline. And a light source disposed on the suction surface side of the bonding tool, and the light from the light source is reflected to the suction surface side of the bonding tool without moving relative to the bonding tool. And a camera that simultaneously acquires an image of the semiconductor die adsorbed on the adsorption surface, an image of the reflector, and an image of the inclined surface of the bonding tool, and the reflector is the bonding tool. The bonding tool is disposed adjacent to the root of the bonding tool and spaced apart from the focal depth of the camera in the longitudinal direction of the bonding tool from the suction surface. Includes a reflecting surface perpendicular relative Le longitudinal centerline,
    The image acquisition step simultaneously acquires an image of the semiconductor die adsorbed on the adsorption surface by the camera, an image of the reflector, and an image of the inclined surface of the bonding tool,
    The relative position detecting step includes the bonding tool based on the image of the reflector acquired by the camera, the image of the inclined surface of the bonding tool acquired by the camera, and the image of the semiconductor die acquired by the camera. And a position detection method for detecting a relative position between the semiconductor die and the semiconductor die.
  10. 　請求項９に記載の位置検出方法であって、
    　前記ボンディングツールと前記半導体ダイとの相対位置は、前記ボンディングツールの長手方向中心線の前記吸着面上の位置と前記半導体ダイの中心の前記吸着面上の位置との間のずれ量または、前記吸着面上の基準軸に対する前記半導体ダイの傾斜角度のいずれか一方または両方である位置検出方法。     The position detection method according to claim 9,
    The relative position between the bonding tool and the semiconductor die is the amount of deviation between the position on the suction surface of the longitudinal center line of the bonding tool and the position on the suction surface at the center of the semiconductor die, or A position detection method that is one or both of the inclination angles of the semiconductor die with respect to a reference axis on a suction surface.
  11. 　請求項９に記載の位置検出方法であって、
    　前記ダイボンダは、更に、前記ボンディングツールを移動させる移動機構を備え、
    　前記画像取得工程は、前記移動機構によって前記ボンディングツール移動させ、前記ボンディングツールが前記半導体ダイのピックアップ位置からボンディング位置との間の所定の位置に達した際に前記光源を発光させ、前記ボンディングツールを移動させながら前記カメラによって前記吸着面に吸着された半導体ダイの画像と前記反射体の画像と前記ボンディングツールの前記傾斜面の画像とを同時に取得する位置検出方法。     The position detection method according to claim 9,
    The die bonder further includes a moving mechanism for moving the bonding tool,
    In the image acquisition step, the bonding tool is moved by the moving mechanism, and when the bonding tool reaches a predetermined position between a pickup position of the semiconductor die and a bonding position, the light source emits light, and the bonding tool A position detection method for simultaneously acquiring an image of a semiconductor die adsorbed on the adsorption surface by the camera, an image of the reflector, and an image of the inclined surface of the bonding tool while moving the image.
  12. 　請求項１０に記載の位置検出方法であって、
    　前記ダイボンダは、更に、前記ボンディングツールを移動させる移動機構を備え、
    　前記画像取得工程は、前記移動機構によって前記ボンディングツール移動させ、前記ボンディングツールが前記半導体ダイのピックアップ位置からボンディング位置との間の所定の位置に達した際に前記光源を発光させ、前記ボンディングツールを移動させながら前記カメラによって前記吸着面に吸着された半導体ダイの画像と前記反射体の画像と前記ボンディングツールの前記傾斜面の画像とを同時に取得する位置検出方法。     The position detection method according to claim 10,
    The die bonder further includes a moving mechanism for moving the bonding tool,
    In the image acquisition step, the bonding tool is moved by the moving mechanism, and when the bonding tool reaches a predetermined position between a pickup position of the semiconductor die and a bonding position, the light source emits light, and the bonding tool A position detection method for simultaneously acquiring an image of a semiconductor die adsorbed on the adsorption surface by the camera, an image of the reflector, and an image of the inclined surface of the bonding tool while moving the image.
PCT/JP2013/060853 2012-07-12 2013-04-10 Die bonder and method for detecting positions of bonding tool and semiconductor die relative to each other WO2014010282A1 (en)

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