WO2014010282A1 - Microsoudeuse de puces et procédé permettant de détecter les positions de l'outil de soudage et de la puce de semi-conducteur l'un par rapport à l'autre - Google Patents

Microsoudeuse de puces et procédé permettant de détecter les positions de l'outil de soudage et de la puce de semi-conducteur l'un par rapport à l'autre Download PDF

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Publication number
WO2014010282A1
WO2014010282A1 PCT/JP2013/060853 JP2013060853W WO2014010282A1 WO 2014010282 A1 WO2014010282 A1 WO 2014010282A1 JP 2013060853 W JP2013060853 W JP 2013060853W WO 2014010282 A1 WO2014010282 A1 WO 2014010282A1
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WO
WIPO (PCT)
Prior art keywords
bonding tool
image
semiconductor die
camera
die
Prior art date
Application number
PCT/JP2013/060853
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English (en)
Japanese (ja)
Inventor
正人 辻
沖人 梅原
圭一 比留間
亮 浦橋
Original Assignee
株式会社新川
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Application filed by 株式会社新川 filed Critical 株式会社新川
Priority to KR1020147023857A priority Critical patent/KR101739833B1/ko
Priority to CN201380011558.3A priority patent/CN104137241B/zh
Publication of WO2014010282A1 publication Critical patent/WO2014010282A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors

Definitions

  • the present invention relates to a structure of a die bonder and a method for detecting a relative position between a bonding tool and a semiconductor die adsorbed on the tip of the bonding tool.
  • a die bonder is often used as a device for bonding a semiconductor die to a circuit board such as a lead frame.
  • the die bonder lowers the semiconductor die sucked and held at the tip of the bonding tool toward the surface of the circuit board sucked and fixed on the bonding stage, and bonds the semiconductor die onto the circuit board.
  • the die bonder it is necessary to press the semiconductor die against the circuit board in a state where the position of the semiconductor die attracted to the bonding tool is matched with the bonding position of the circuit board. For this reason, when the semiconductor die is transferred by the bonding tool, an image of the back surface of the semiconductor die attracted by the bonding tool is acquired, and the relative position of the semiconductor die and the circuit board is aligned based on the alignment mark on the back surface of the semiconductor die.
  • the method is used (for example, refer patent document 1).
  • Patent Document 1 it is necessary to temporarily stop the transfer of the semiconductor die when acquiring an image, and there is a problem that the tact time becomes long. Therefore, a reference member having a mirror and a rectangular through hole is fixed to the transfer head of the semiconductor die via an L-shaped connecting member, and when the semiconductor die is transferred by the transfer head, the transfer is temporarily stopped.
  • the first image data obtained by imaging the semiconductor die and the second image data obtained by imaging the reference component are obtained, and the position of the semiconductor die with respect to the reference component is detected by superimposing the two image data.
  • a method of correcting the position of the semiconductor die mounted on the circuit board in response to the above has been proposed (see, for example, Patent Document 2).
  • an object of the present invention is to detect misalignment between a bonding tool and a semiconductor die effectively with a simple configuration.
  • the die bonder of the present invention includes a bonding tool, a light source, a camera, and a reflector.
  • the bonding tool includes a suction surface at a tip that sucks a semiconductor die, a root thicker than the suction surface at the tip, and a suction surface.
  • a light source is disposed on the suction surface side of the bonding tool, and a camera reflects and reflects the image of the semiconductor die adsorbed on the suction surface.
  • the body image and the image of the inclined surface of the bonding tool are acquired at the same time, and the reflector is located adjacent to the base of the bonding tool and spaced apart from the focal depth of the camera in the longitudinal direction of the bonding tool from the suction surface At the same time, it is characterized in that it does not move relative to the bonding tool and reflects light from the light source to at least the suction surface side of the bonding tool.
  • the die bonder of the present invention further includes an image processing unit, and the image processing unit includes an image of the reflector acquired by the camera, an image of the inclined surface of the bonding tool acquired by the camera, and an image of the semiconductor die acquired by the camera. And detecting the relative position between the bonding tool and the semiconductor die.
  • the reflector is a shank that holds the bonding tool, a ring attached to the bonding tool, or a step adjacent to the base of the bonding tool, and is perpendicular to the longitudinal center line of the bonding tool. It has a reflecting surface, and the reflecting surface is preferably an end surface on the suction surface side of the shank, an end surface on the suction surface side of the ring, or an end surface of the stepped portion.
  • the relative position between the bonding tool and the semiconductor die is the amount of deviation between the position on the suction surface of the longitudinal center line of the bonding tool and the position on the suction surface of the center of the semiconductor die, or the suction It is also preferable that it is one or both of the inclination angles of the semiconductor die with respect to the reference axis on the surface.
  • the die bonder of the present invention further includes a moving mechanism and a control unit, the moving mechanism moves the bonding tool, the control unit moves the bonding tool by the moving mechanism, and the bonding tool moves to the pick-up position of the semiconductor die.
  • the light source emits light when a predetermined position between the bonding position and the bonding position is reached, and while moving the bonding tool, the image of the semiconductor die adsorbed on the adsorption surface by the camera, the image of the inclined surface of the bonding tool, and the reflector It is also preferable to acquire images simultaneously.
  • the die bonder of the present invention further includes a moving mechanism and a control unit.
  • the moving mechanism moves the bonding tool
  • the control unit changes the position of the bonding tool by the moving mechanism and detects the image processing unit. It is also preferable to correct the position of the bonding tool based on the relative position between the bonding tool and the semiconductor die.
  • a position detection method for detecting a relative position between a bonding tool and a semiconductor die is a position detection method for detecting a relative position between a bonding tool and a semiconductor die in a die bonder, an image acquisition step, and a relative position detection.
  • the die bonder includes a suction surface at the tip that sucks the semiconductor die, a base thicker than the suction surface at the tip, and an inclined surface that connects the suction surface and the root and is inclined with respect to the longitudinal center line.
  • the relative position between the bonding tool and the semiconductor die is the amount of deviation between the position on the suction surface of the longitudinal center line of the bonding tool and the position on the suction surface at the center of the semiconductor die, or It is also preferable that one or both of the inclination angles of the semiconductor die with respect to the reference axis on the adsorption surface.
  • the die bonder further includes a moving mechanism that moves the bonding tool, and the image acquisition step moves the bonding tool by the moving mechanism, and the bonding tool moves between the pickup position of the semiconductor die and the bonding position.
  • a light source is emitted, and while the bonding tool is moved, the image of the semiconductor die, the image of the reflector, and the image of the inclined surface of the bonding tool are simultaneously acquired by the camera. This is also preferable.
  • the present invention has an effect that it is possible to detect the positional deviation between the bonding tool and the semiconductor die effectively with a simple configuration.
  • a die bonder 10 of the present invention includes a bonding head 15 to which a bonding tool 24 is attached via a shank 20, a guide rail 11 for guiding the bonding head 15 in the Y direction, and the bonding head 15 in the Y direction.
  • a Y-direction moving mechanism 13 for moving the guide rail 11 and the bonding head 15 in the X direction, a camera 32 provided below the bonding head 15, and a strobe 34 as a light source.
  • the bonding tool 24 has an adsorption surface 27 that adsorbs the semiconductor die 30 at the tip, and the strobe 34 includes a reflecting mirror 35 that directs emitted light toward the bonding tool 24.
  • the bonding head 15 includes a Z-direction moving mechanism 16 that moves the bonding tool 24 in the Z direction and a ⁇ -direction moving mechanism 17 that rotates the bonding tool 24 in the ⁇ direction.
  • the controller 50 moves the bonding tool 24 in the X, Y, Z, and ⁇ directions by operating the moving mechanisms 12, 13, 16, and 17 in the X, Y, Z, and ⁇ directions. It is configured. 1, the horizontal direction on the paper is the Y direction, the vertical direction of the paper is the Z direction, the vertical direction to the paper is the X direction, and the rotation direction around the Z axis is the ⁇ direction.
  • the image processing unit 40 is a computer that includes a CPU 41 for processing signals and data therein, and a memory 42 for storing data and programs.
  • the memory 42 stores therein an image acquisition program 43, a relative position detection program 44, and control data 45 described later.
  • the image processing unit 40 includes a camera interface 47 and a strobe interface 48 for connecting to the camera 32 and the strobe 34.
  • the image processing unit 40 includes a data bus interface 46 for performing data communication with the control unit 50 which is another computer.
  • the CPU 41, the memory 42, the interfaces 47 and 48, and the data bus interface 46 are connected by a data bus 49 inside the image processing unit 40.
  • the control unit 50 is a computer that includes a CPU 51 that internally processes signals and data, and a memory 52 that stores data and programs, and a data bus interface 56. Are connected to the CPU 41 and the memory 42 of the image processing unit 40 via the communication line 60 and the data bus interface 46 of the image processing unit 40.
  • the memory 52 stores therein a position control program 53, a correction program 54, and control data 55, which will be described later.
  • the control unit 50 includes a moving mechanism interface 57 for connecting to the moving mechanisms 12, 13, 16, and 17 in the X, Y, Z, and ⁇ directions.
  • the CPU 51, the memory 52, the moving mechanism interface 57 and the data bus interface 56 are connected by a data bus 59 inside the control unit 50.
  • the X, Y, Z, and ⁇ moving mechanisms 12, 13, 16, and 17 of the die bonder 10 of the present embodiment are signals indicating the positions of the tip of the bonding tool 24 in the X, Y, Z, and ⁇ directions, respectively.
  • the control unit 50 obtains the position in the X, Y, Z, and ⁇ directions of the tip of the bonding tool 24 from the signals of the moving mechanisms 12, 13, 16, and 17.
  • the bonding tool 24 connects the tip suction surface 27 that sucks the semiconductor die 30, the root 25 that is thicker than the tip suction surface 27, and the suction surface 27 and the root 25. And an inclined curved surface 26 that is an inclined surface inclined with respect to the line 90.
  • the suction surface 27 at the tip is substantially the same size as the semiconductor die 30 and is a plane perpendicular to the longitudinal center line 90 of the bonding tool 24. For this reason, the back surface of the semiconductor die 30 attracted to the attracting surface 27 is also a plane perpendicular to the longitudinal center line 90 of the bonding tool 24.
  • the root 25 of the bonding tool 24 is thicker than the suction surface 27 at the tip and is a cylindrical shape fixed to the shank 20, and the inclined curved surface 26 is a curved surface that spreads in a funnel shape from the suction surface 27 toward the root 25.
  • the shank 20 has a cylindrical shape in which the outer peripheral surface of the base 25 of the bonding tool 24 is fitted on the inner peripheral side, and the end surface 21 on the lower side or the suction surface 27 side is in the longitudinal direction of the bonding tool 24.
  • the surface of the bonding tool 24 is a plane perpendicular to the longitudinal center line 90 and the surface thereof is mirror-finished. Since the shank 20 is engaged with the bonding tool 24, the shank 20 does not move relative to the bonding tool 24 and is disposed at a position adjacent to the root 25.
  • the camera 32 is focused on the back surface (the lower surface in the Z direction) of the semiconductor die 30 adsorbed by the bonding tool 24 when the bonding tool 24 moves to a predetermined position directly above. It is arranged so as to fit, and is adjusted so that a sharp image of the back surface of the semiconductor die 30 can be acquired. That is, the camera 32 is adjusted so that the optical path length L1 between the lens of the camera 32 and the back surface of the semiconductor die 30 becomes the focal length of the lens of the camera 32.
  • the inclined curved surface 26 of the bonding tool 24 and the end surface 21 of the shank 20 are arranged in the longitudinal direction away from the suction surface 27 that sucks the semiconductor die 30, and from the lens of the camera 32 to the bonding tool 24.
  • the optical path lengths to the inclined curved surface 26 and the end surface 21 of the shank 20 are optical path lengths L2 and L3.
  • the focal depth D of the lens of the camera 32 is slightly longer than the thickness of the semiconductor die 30, the optical path lengths L2 and L3 are longer than the length obtained by adding the focal depth D to the optical path length L1, respectively. .
  • the image of the back surface of the semiconductor die 30 the image of the inclined curved surface 26 of the bonding tool 24, and the image of the end surface 21 of the shank 20 are simultaneously acquired by the camera 32, the inclined curved surface 26 of the bonding tool 24 and the end surface of the shank 20. 21 is in an out-of-focus state, and the acquired image of the inclined curved surface 26 and the image of the end surface 21 are slightly blurred images.
  • the control unit 50 of the die bonder 10 executes a position control program 53 to drive the moving mechanisms 12, 13, 16, 17 in the X, Y, Z, and ⁇ directions to move the top of the pickup stage 36.
  • the bonding tool 24 is moved onto the diced wafer placed on the semiconductor wafer 30 and the semiconductor die 30 is sucked onto the suction surface 27 at the tip of the bonding tool 24.
  • the bonding head 15 is moved onto the bonding stage 37 as shown by a locus 38 shown in FIG. 3, the bonding head 15 is lowered onto the circuit board that is sucked and fixed onto the bonding stage 37, and the semiconductor die 30 is moved. Bond on the circuit board. This is the basic operation of the die bonder 10.
  • the CPU 51 of the control unit 50 executes the position control program 53 and moves the bonding tools 24 from the pickup stage 36 to the bonding stage 37 while the X, Y, Z, and ⁇ moving mechanisms 12, 13, 16, and 17 are moved.
  • the position of each of the X, Y, Z, and ⁇ directions of the tip of the bonding tool 24 is detected from the signal, and the bonding tool 24 comes to a predetermined position directly above the camera 32 as shown in FIG.
  • a trigger signal for causing the strobe 34 to emit light is output. This trigger signal is transmitted to the image processing unit 40 through the data bus interfaces 56 and 46 and the communication line 60.
  • the predetermined position is a position set in the position control program 53 in advance.
  • the CPU 41 of the image processing unit 40 executes the image acquisition program 43 when this trigger signal is input.
  • the CPU 41 outputs a command for causing the strobe 34 to emit light.
  • a flash signal is output from the flash interface 48 to the flash 34, and the flash 34 emits light.
  • the image processing unit 40 captures an image from the camera 32 through the camera interface 47 in synchronization with the light emission of the strobe 34.
  • the captured image is stored in the memory 42 of the image processing unit 40. Note that the image is captured while the bonding tool 24 is moved (without stopping the movement).
  • the shank 20 is a reflector, and the end surface 21 of the shank 20 is a reflecting surface.
  • a part of the light incident on the back surface or the lower surface (the surface on the negative side in the Z direction) of the semiconductor die 30 is, as indicated by an arrow 75 shown in FIG.
  • the light is reflected in the direction along the longitudinal center line 90 of the bonding tool 24 (minus side in the Z direction) and enters the camera 32 on the lower side of the bonding tool 24 (on the suction surface 27 side).
  • the light incident on the inclined curved surface 26 of the bonding tool 24 as shown by an arrow 73 in FIG. 4 is a direction different from the longitudinal direction of the bonding tool 24 such as the horizontal direction or the arrow 74 shown in FIG.
  • the light is reflected in a direction different from the direction along the longitudinal center line 90 of the bonding tool 24.
  • the lightness (white) ring-shaped image 81 (reflector) of the end face 21 where the light from the strobe 34 reflects toward the camera 32 is reflected.
  • a high-lightness (white) square image 84 of the back surface of the semiconductor die 30 in which light from 34 is reflected toward the camera 32 is captured.
  • the image processing unit 40 simultaneously acquires these three images 81, 82, and 84 by the camera 32 and stores them in the memory 42. Note that an image 83 of the tip of the bonding tool 24 indicated by a broken line in FIG. 4B is hidden behind the image of the semiconductor die 30 and cannot be captured by the camera 32.
  • the image 84 on the back surface of the semiconductor die 30 is a sharp image.
  • the end surface 21 of the shank 20 and the inclined curved surface 26 of the bonding tool 24 are shifted in the Z direction from the back surface of the semiconductor die 30 to be larger than the focal depth D of the camera 32, the brightness of the end surface 21 is high (white).
  • the ring-shaped image 81 and the low-intensity (black or gray) circular image 82 of the inclined curved surface 26 are blurred images.
  • the CPU 41 of the image processing unit 40 executes a relative position detection program 44.
  • the brightness of the image is described as 256 gradations (brightness 0 to brightness 255).
  • the image acquired by the camera 32 includes a ring-shaped image 81 (reflector image) with a lightness of 255 on the end face 21 and a circular lightness with a lightness of 0 on the inclined curved surface 26 of the bonding tool 24.
  • An image 82 an image of an inclined surface
  • a square image 84 of lightness 255 on the back surface of the semiconductor die 30 are included.
  • the ring-shaped image 81 and the circular image 82 are blurred because the camera 32 is out of focus.
  • the brightness of the image 81 is 255 at the outer peripheral portion as shown by the line a.
  • the brightness of the black image 82 increases.
  • the part is mixed and the brightness gradually decreases as shown by the line b.
  • the state of lightness 0 continues to the image 84 on the back surface of the semiconductor die 30. Since the camera 32 is focused on the back surface of the semiconductor die 30, the image 84 has a sharp outline.
  • the back surface of the semiconductor die 30 reflects the light of the strobe 34, the lightness is 255. Accordingly, the brightness of the image rises almost vertically from the brightness 0 to the brightness 255 at the edge of the image 84, as indicated by the line d. In the region of the image 84, the brightness is constant at 255 as indicated by the line e.
  • the CPU 41 of the image processing unit 40 uses a preset binarization threshold value, as shown in FIG. And the square outline reference line 92 of the image 84 are acquired.
  • the binarization threshold is such that a circular line having a diameter substantially the same as the outer shape of the root 25 of the bonding tool 24 is a round outer reference of the image 82 when conditions such as the light state of the strobe 34 and the photographing position are reference conditions. It is determined in advance by a test or the like so that it can be acquired as the line 91.
  • the image 81 and the image 82 are images of the inclined curved surface 26 of the bonding tool 24 and the end surface 21 of the shank 20 arranged concentrically, the change in brightness of each region indicated by the line a to the line e in FIG.
  • the object is around the longitudinal center line of the tool 24. Therefore, even when conditions such as the light state of the strobe 34 and the photographing position deviate from the reference conditions, the change curve of the brightness between the image 81 and the image 82 is as shown by the alternate long and short dash line b ′ in FIG. Since the left and right objects (objects around the center line in the longitudinal direction of the bonding tool 24), the round outline reference line 91 ′ acquired using the binarization threshold shown in FIG.
  • 5B is the root 25 of the bonding tool 24. It becomes a concentric circle with the outer shape of the bonding tool 24 having a diameter smaller than the outer shape. For this reason, even when conditions such as the light state of the strobe 34 and the photographing position deviate from the reference conditions, the centers of the round outline reference lines 91 and 91 ′ coincide with the position of the longitudinal center line of the bonding tool 24.
  • the back surface of the semiconductor die 30 is in focus, and the brightness changes almost vertically at the edge of the image 84. Therefore, even if the light condition of the strobe 34, the shooting position, etc. deviate from the reference condition, the image The size of 84 square outline reference lines 92 is almost the same.
  • the ring-shaped image 81 of the end face 21 that reflects the light of the strobe 34 has high brightness
  • the circular image 82 of the inclined curved surface 26 that does not reflect the light of the strobe 34 has lightness. Is low and the brightness difference is very large. Therefore, the longitudinal positions of the bonding tool 24 of the end surface 21 and the inclined curved surface 26 are separated from the back surface of the semiconductor die 30 by the depth of focus D, and the brightness of the images 81 and 82 can be obtained even if a sharp image cannot be acquired.
  • the large difference it is possible to reliably extract the circular outer shape reference line 91 concentric with the outer shape of the bonding tool 24.
  • the square outline reference line 92 can be reliably extracted using the sharp edge of the image 84 on the back surface of the semiconductor die 30.
  • the image processing unit 40 detects the position of the center 97 of the circular outline reference line 91 and the position of the center 98 of the square outline reference line 92 from the processed image, and the circular outline reference line 91.
  • An X-direction reference line 94 passing through the center 97 of the camera 32 and extending in the X direction of the field of view 33 of the camera 32, and a Y-direction reference line 93 passing through the center 97 of the circular outer shape reference line 91 and extending in the Y direction of the field of view 33 of the camera 32.
  • the image processing unit 40 passes through the center 98 of the square outline reference line 92 and the X direction measurement line 96 and the center 98 of the square outline reference line 92 parallel to the side of the square outline reference line 92 close to the X direction reference line 94.
  • a Y-direction measurement line 95 is set in parallel to a side of the street square outline reference line 92 close to the Y-direction reference line 93. Then, the image processing unit 40 obtains deviation amounts ⁇ X and ⁇ Y in the X direction and the Y direction between the position of the center 97 of the circular outline reference line 91 and the position of the center 98 of the square outline reference line 92, respectively.
  • the image processing unit 40 also calculates a square outline reference line from the angle difference in the ⁇ direction between the X direction reference line 94 and the X direction measurement line 96 or the angle difference in the ⁇ direction between the Y direction reference line 93 and the Y direction measurement line 95.
  • the rotation angle deviation ⁇ of 92 in the ⁇ direction is detected.
  • the circular outer shape reference line 91 is concentric with the outer shape line inside the end surface 21 of the shank 20 that is not displaced relative to the bonding tool 24, and the outer shape line of the bonding tool 24 is Since it is also a concentric circle, the position of the center 97 of the circular outline reference line 91 is the center position of the longitudinal center line 90 of the bonding tool 24 shown in FIG. 4A, and the square outline reference line 92 is the position of the semiconductor die 30. Since it is an edge of the outer shape, the center 98 of the square outer reference line 92 is the center position of the semiconductor die 30.
  • the deviation amounts ⁇ X and ⁇ Y in the X and Y directions between the circular outer shape reference line 91 and the square outer shape reference line 92 are the X and Y direction differences between the center position of the bonding tool 24 and the center position of the semiconductor die 30. It becomes the amount of deviation.
  • an X-direction reference line 94 that passes through the center 97 of the circular outer shape reference line 91 and goes in the X direction of the visual field 33 of the camera 32, and passes through the center 97 of the circular outer shape reference line 91 in the Y direction of the visual field 33 of the camera 32.
  • the heading Y-direction reference line 93 is a reference line on the suction surface 27 of the bonding tool 24, passes through the center 98 of the rectangular outer shape reference line 92, and is parallel to a side near the X-direction reference line 94 of the rectangular outer shape reference line 92.
  • the Y-direction measurement line 95 passing through the center 98 of the square X-direction measurement line 96 and the square outline reference line 92 and parallel to the side close to the Y-direction reference line 93 of the square outline reference line 92 is on the suction surface 27 of the bonding tool 24.
  • This is a line indicating the inclination angle of the semiconductor die 30 with respect to the reference line.
  • the ⁇ direction of the square outline reference line 92 obtained from the angle difference in the ⁇ direction between the X direction reference line 94 and the X direction measurement line 96 or the angle difference in the ⁇ direction between the Y direction reference line 93 and the Y direction measurement line 95.
  • the amount of deviation in the X and Y directions between the center position of the bonding tool 24 and the center position of the semiconductor die 30 and the inclination angle of the semiconductor die 30 with respect to the reference axis on the suction surface 27 of the bonding tool 24 are determined by bonding.
  • the image processing unit 40 detects the deviation amounts ⁇ X, ⁇ Y, ⁇ of the semiconductor die 30 with respect to the bonding tool 24 in the X, Y, ⁇ directions
  • the data is transmitted to the control unit 50 through the data bus interfaces 46, 56 and the communication line 60. Send to.
  • the CPU 51 of the control unit 50 executes the correction program 54 and detects the tip of the bonding tool 24 detected by each moving mechanism 12, 13, 16, 17 until the bonding tool 24 is moved to the bonding stage 37 shown in FIG. 3.
  • the semiconductor die 30 can be bonded to the circuit board on the bonding stage 37 at an accurate position and direction by correcting the received positions by X, Y, and ⁇ shift amounts ⁇ X, ⁇ Y, and ⁇ .
  • the die bonder 10 has a brightness difference between the image 81 of the end surface 21 of the shank 20 holding the bonding tool 24 and the image 82 of the inclined curved surface 26 of the bonding tool 24. Since the center position of the longitudinal center line 90 of the bonding tool 24 and the center position of the semiconductor die 30 are detected using the difference in brightness between the image 84 of the back surface 30 and the image 82 of the inclined curved surface 26 of the bonding tool 24, the end surface 21.
  • the inclined curved surface 26 deviates from the back surface of the semiconductor die 30 more than the depth of focus D, and the relative position between the bonding tool 24 and the semiconductor die 30 can be reliably detected even when the images 81 and 82 are not sharp. it can.
  • the inclined surface of the bonding tool 24 has been described as the funnel-shaped inclined curved surface 26, but the inclined surface is inclined with respect to the longitudinal center line 90 of the bonding tool 24, and from the strobe 34. Any shape may be used as long as it does not reflect light in the direction along the longitudinal center line 90. For example, it may be a tapered surface that obliquely connects the suction surface 27 and the root 25. .
  • the positional deviation amount is detected during the bonding operation and corrected.
  • the present invention is not limited to the correction during the bonding operation.
  • the present invention can also be applied to the case where the positional deviation is measured in advance and the offset amount of the bonding tool 24 is set based on the result. In that case, when the image is acquired, the movement of the bonding tool 24 is stopped, and the inclined curved surface 26 of the bonding tool 24, the shank 20, the images 81, 82, and 84 of the semiconductor die 30 taken in a stationary state and the bonding tool.
  • the shift amount and the offset amount may be set by combining the images 81, 82, and 84 acquired without stopping the movement of 24.
  • the position of the bonding tool 24 is corrected based on the relative position between the bonding tool 24 and the semiconductor die 30 sucked on the suction surface 27 of the bonding tool 24.
  • the relative position between the bonding tool 24 and the pickup stage 36 or the bonding stage 37 is corrected, and the deviation amount of the pickup position or the bonding position due to the temperature change of the die bonder 10 is corrected. It is good also as correcting.
  • a moving average of the positional deviation between the bonding tool 24 and the pickup stage 36 or the bonding stage 37 is obtained, and the correction direction of the deviation amount is determined based on the tendency of the change of the moving average value. Also good.
  • a ring 22 that is fitted and fixed to the outer periphery of the root 25 of the bonding tool 24 is attached to the lower side of the shank 20 of the embodiment described with reference to FIGS. 1 to 6.
  • the lower end surface 23 of the ring 22 is mirror-finished so that light from the strobe 34 can be reflected.
  • the ring 22 is a reflector
  • the end surface 23 is a reflecting surface
  • the ring 22 is disposed adjacent to the root 25.
  • the camera 32 has a slightly blurred image 86 of the end surface 23 of the ring-shaped ring 22 with a high brightness (white) and a slightly curved surface of the bonding tool 24 slightly blurred.
  • a low brightness (black or gray) image 82 and a high brightness (white) backside image 84 of the semiconductor die 30 are obtained, and a circular outer shape of the image 86 of the end face 23 and the inclined curved surface 26 image 82 is obtained.
  • a reference line 91, a square outline reference line 92 of the inclined curved surface 26 image 82 and the back surface image 84 of the semiconductor die 30 are extracted, and a relative position between the bonding tool 24 and the semiconductor die 30 is detected.
  • the effect of this embodiment is the same as that of the embodiment described above with reference to FIGS.
  • the base 25 of the bonding tool 24 is stepped, and the lower surface 29 below the stepped portion 28 is mirror-finished so that light from the strobe 34 can be reflected. It is a thing.
  • the step portion 28 of the bonding tool 24 is a reflector, the lower surface 29 of the step portion 28 is a reflecting surface, and the lower surface 29 is disposed adjacent to the root 25.
  • the camera 32 has an image 88 of the lower surface 29 of the ring-shaped step portion 28 having a slightly blurred high brightness (white) and a slightly inclined tilt of the bonding tool 24.
  • a low-lightness (black or gray) image 82 of the curved surface 26 and a high-lightness (white) image 84 of the back surface of the semiconductor die 30 are obtained, and the circular image of the image 88 of the bottom surface 29 and the inclined curved surface 26 image 82 is obtained.
  • the outline reference line 91, the square outline reference line 92 of the inclined curved surface 26 image 82 and the back surface image 84 of the semiconductor die 30 are extracted, and the relative position between the bonding tool 24 and the semiconductor die 30 is detected.
  • the effect of this embodiment is the same as that of the embodiment described above with reference to FIGS.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention a trait à une microsoudeuse de puces qui contient un outil de soudage (24), un stroboscope (34), une caméra (32) et une tige (20). L'outil de soudage (24) est équipé des éléments suivants : une surface d'aspiration de pointe (27) qui maintient une puce de semi-conducteur (30) par aspiration ; une base qui est plus large que ladite surface d'aspiration de pointe (27) ; et une surface inclinée qui relie la surface d'aspiration (27) à la base et qui est inclinée par rapport à une ligne médiane dans le sens de la longueur. La caméra (32) acquiert simultanément une image de la puce de semi-conducteur (30) qui est maintenue par la surface d'aspiration (27), une image de la tige (20) et une image de la surface inclinée de l'outil de soudage (24). La tige (20) est en contact avec la base de l'outil de soudage (24), est séparée de la surface d'aspiration (27) d'une distance supérieure à la profondeur de foyer de la caméra (32) dans le sens de la longueur de l'outil de soudage (24), ne se déplace pas par rapport à l'outil de soudage (24) et réfléchit la lumière provenant du stroboscope (34). De la sorte, il est possible de détecter de façon efficace au moyen d'une configuration simple tout mauvais alignement entre une puce de semi-conducteur et un outil de soudage dans une microsoudeuse de puces.
PCT/JP2013/060853 2012-07-12 2013-04-10 Microsoudeuse de puces et procédé permettant de détecter les positions de l'outil de soudage et de la puce de semi-conducteur l'un par rapport à l'autre WO2014010282A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020147023857A KR101739833B1 (ko) 2012-07-12 2013-04-10 다이본더 및 본딩 툴과 반도체 다이와의 상대 위치의 검출 방법
CN201380011558.3A CN104137241B (zh) 2012-07-12 2013-04-10 晶粒接合器及接合工具与半导体晶粒的相对位置检测方法

Applications Claiming Priority (2)

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JP2012-156409 2012-07-12
JP2012156409A JP6047723B2 (ja) 2012-07-12 2012-07-12 ダイボンダおよびボンディングツールと半導体ダイとの相対位置の検出方法

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WO2014010282A1 true WO2014010282A1 (fr) 2014-01-16

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JP (1) JP6047723B2 (fr)
KR (1) KR101739833B1 (fr)
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JPH1117392A (ja) * 1997-06-23 1999-01-22 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2004172465A (ja) * 2002-11-21 2004-06-17 Fuji Mach Mfg Co Ltd 電子回路部品像取得装置および方法
JP2013098341A (ja) * 2011-10-31 2013-05-20 Panasonic Corp 部品実装装置

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JP2689403B2 (ja) * 1988-03-07 1997-12-10 山形カシオ株式会社 電子部品搭載機における部品吸着判定方法
JPH088592A (ja) * 1994-06-22 1996-01-12 Matsushita Electric Ind Co Ltd 電子部品装着装置
JP3784739B2 (ja) * 2002-03-18 2006-06-14 シャープ株式会社 ダイボンド装置
JP3949511B2 (ja) * 2002-05-21 2007-07-25 芝浦メカトロニクス株式会社 物品認識装置、ペレットボンディング装置
EP2221866B1 (fr) * 2004-01-07 2020-08-12 Nikon Corporation Appareil d'empilement et procédé pour empiler des éléments de circuits intégrés
JP2007115851A (ja) * 2005-10-19 2007-05-10 Toshiba Corp 半導体部品の位置検査方法、位置検査装置および半導体装置の製造方法
JP4674220B2 (ja) * 2007-03-05 2011-04-20 ヤマハ発動機株式会社 部品移載装置、表面実装機、及び電子部品検査装置
JP5059518B2 (ja) * 2007-08-10 2012-10-24 Ｊｕｋｉ株式会社 電子部品実装方法及び装置
JP5596929B2 (ja) * 2009-02-12 2014-09-24 富士機械製造株式会社 突き上げピンの位置決め方法およびその方法を用いた電子部品供給装置
JP5443938B2 (ja) * 2009-10-19 2014-03-19 Ｊｕｋｉ株式会社 電子部品実装装置

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH1117392A (ja) * 1997-06-23 1999-01-22 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2004172465A (ja) * 2002-11-21 2004-06-17 Fuji Mach Mfg Co Ltd 電子回路部品像取得装置および方法
JP2013098341A (ja) * 2011-10-31 2013-05-20 Panasonic Corp 部品実装装置

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TWI492317B (zh) 2015-07-11
TW201413838A (zh) 2014-04-01
JP2014022385A (ja) 2014-02-03
JP6047723B2 (ja) 2016-12-21
KR101739833B1 (ko) 2017-06-08
KR20140128357A (ko) 2014-11-05
CN104137241A (zh) 2014-11-05

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