JP6461311B2 - ワイヤボンディング装置及びワイヤボンディング方法 - Google Patents
ワイヤボンディング装置及びワイヤボンディング方法 Download PDFInfo
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- JP6461311B2 JP6461311B2 JP2017509838A JP2017509838A JP6461311B2 JP 6461311 B2 JP6461311 B2 JP 6461311B2 JP 2017509838 A JP2017509838 A JP 2017509838A JP 2017509838 A JP2017509838 A JP 2017509838A JP 6461311 B2 JP6461311 B2 JP 6461311B2
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- 238000000034 method Methods 0.000 title claims description 38
- 238000003384 imaging method Methods 0.000 claims description 155
- 230000003287 optical effect Effects 0.000 claims description 34
- 230000008859 change Effects 0.000 claims description 31
- 238000001514 detection method Methods 0.000 claims description 29
- 238000012937 correction Methods 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 11
- 230000003647 oxidation Effects 0.000 claims description 9
- 238000007254 oxidation reaction Methods 0.000 claims description 9
- 239000002184 metal Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 238000010586 diagram Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 13
- 230000004048 modification Effects 0.000 description 11
- 238000012986 modification Methods 0.000 description 11
- 238000005259 measurement Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- B23K1/00—Soldering, e.g. brazing, or unsoldering
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Description
向として説明する。
0とのオフセットが経時的に変化しておらず、前回測定のオフセットのままであると、ボンディングツール18をリファレンス部材50の方向へ移動させると、ボンディングツール18の軸心18aは、ボンディングツール18の移動前の第1撮像部30の光軸30aと一致することになる。しかしながら、現実には、ワイヤボンディングの処理を行い続けることに伴う様々な要因により、このオフセットは経時的に変化するため、両者は互いに一致せず、ずれて配置されることになり、オフセットの変化がもたらされることになる。
ース252の外縁258(ベース252の上面の辺又は頂点)は第2マークとして機能する。第2撮像部からのボール状先端部22への光路は、ベース252の略中央部の厚さa3を通過するように構成されている。なお、第1マークであるテーパ面254は、図示するように、ベース252の下面がその上面に比べて面積が小さくなる向きの順テーパであってもよいし、あるいはそれとは反対の逆テーパであってもよい。
Claims (14)
- 基準面上のボンディング対象の位置を検出する第1撮像部と、 前記第1撮像部から離間して設けられたボンディングツールと、 前記ボンディングツール及び前記第1撮像部を前記基準面に平行な方向に一体的に移動させる移動機構と、 リファレンス部材と、 前記基準面に対して前記ボンディングツール及び前記第1撮像部とは反対側に配置された第2撮像部と、 前記ボンディングツールと前記第1撮像部との間のオフセットを測定する制御部と、を備え、 前記ボンディングツールには、ワイヤが挿通され、当該ワイヤのボール状先端部が延出されており、 前記第1撮像部は、前記リファレンス部材の位置に対する前記第1撮像部の光軸の位置を検出し、 前記第2撮像部は、予め記憶されたオフセット値に従って前記ボンディングツールを前記リファレンス部材の上方に移動させたとき、前記リファレンス部材の位置を検出するとともに、前記ワイヤの前記ボール状先端部の位置を検出し、 前記制御部は、前記第1撮像部及び前記第2撮像部による各検出結果に基づいて、前記ボンディングツールと前記第1撮像部との間のオフセットの変化を測定し、 前記リファレンス部材は、前記第1撮像部によって検出される第1マークと、前記第2撮像部によって検出される第2マークとを有する、 ワイヤボンディング装置。
- 前記第1マークは、前記リファレンス部材のテーパ面である、請求項1記載のワイヤボンディング装置。
- 前記第1マークは、前記リファレンス部材の段差である、請求項1記載のワイヤボンディング装置。
- 前記リファレンス部材は、前記テーパ面によって囲まれた開口底部を有し、 前記第2マークは、前記開口底部に形成された、請求項2に記載のワイヤボンディング装置。
- 前記リファレンス部材は、前記段差によって囲まれた開口底部を有し、 前記第2マークは、前記開口底部に形成された、請求項3に記載のワイヤボンディング装置。
- 前記ワイヤの前記ボール状先端部に、前記ボンディングツールとは反対側から、前記基準面に平行なXY軸方向の各スリット光を照射する照射部をさらに含み、 前記制御部は、前記XY軸方向の各スリット光に基づいて、前記ボンディングツールと前記第1撮像部との間のオフセットの変化を測定する、請求項1から5のいずれか一項に記載のワイヤボンディング装置。
- 前記制御部は、前記ボンディングツールから延出した前記ワイヤの前記ボール状先端部の径及び形状の少なくとも1つを測定する、請求項6記載のワイヤボンディング装置。
- 前記リファレンス部材は、光路長補正部を有し、 前記第2撮像部は、前記リファレンス部材の前記光路長補正部を介して前記ワイヤの前記ボール状先端部の位置を検出する、請求項1から請求項7のいずれか一項に記載のワイヤボンディング装置。
- 前記制御部は、測定した前記オフセットの変化をフィードバックし、次のワイヤボンディングに反映させる、請求項1から請求項8のいずれか一項に記載のワイヤボンディング装置。
- 前記予め記憶されたオフセット値は、前記制御部によって前回測定したオフセット値である、請求項9記載のワイヤボンディング装置。
- 前記制御部は、前記第2撮像部の検出結果に基づいて前記ワイヤの前記ボール状先端部の酸化レベルを測定する、請求項1から請求項10のいずれか一項に記載のワイヤボンディング装置。
- 前記制御部は、測定した前記酸化レベルが高い場合、ボンディングパラメータにフィードバックし、次のワイヤボンディングに反映させる、請求項11記載のワイヤボンディング装置。
- 前記第2撮像部は、前記ボンディングツールを前記基準面に対して垂直方向に移動したときの、前記ワイヤの前記ボール状先端部の移動に伴う変化を検出する、請求項11記載のワイヤボンディング装置。
- 基準面上のボンディング対象の位置をワイヤボンディングする方法であって、 ワイヤボンディング装置を準備する工程であって、基準面上のボンディング対象の位置を検出する第1撮像部と、前記第1撮像部から離間して設けられたボンディングツールと、前記ボンディングツール及び前記第1撮像部を前記基準面に平行な方向に一体的に移動させる移動機構と、前記基準面に対して前記ボンディングツール及び前記第1撮像部とは反対側に配置された第2撮像部と、前記第1撮像部によって検出される第1マーク及び前記第2撮像部によって検出される第2マークとを有するリファレンス部材と、前記ボンディングツールと前記第1撮像部との間のオフセットを測定する制御部とを備える、ワイヤボンディング装置を準備する工程と、 前記ボンディングツールから延出されたワイヤにボール状先端部を形成する工程と、 前記第1撮像部を前記リファレンス部材の上方に移動させた後、前記第1撮像部によって前記リファレンス部材の位置に対する前記第1撮像部の光軸の位置を検出する第1検出工程と、 予め記憶されたオフセット値に従って前記ボンディングツールを前記リファレンス部材の上方に移動させた後、前記第2撮像部によって、前記リファレンス部材の位置を検出するとともに、前記ワイヤの前記ボール状先端部の位置を検出する第2検出工程と、 前記第1及び第2検出工程の各検出結果に基づいて、前記ボンディングツールと前記第1撮像部との間のオフセットの変化を測定する工程と、
を含む、ワイヤボンディング方法。
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WO2020184338A1 (ja) * | 2019-03-08 | 2020-09-17 | 株式会社新川 | ワイヤボンディング装置 |
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