JPH1117392A - Electronic component/mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component/mounting device that does not produce any noise, which is observed by a camera, even when a nozzle projects from the electronic component in a transfer head for sucking, with vacuum, the electronic component to the lower end of the nozzle and transferring and mounting it to a substrate. SOLUTION: A lower end 12 of a nozzle 10 of a transfer head 1 is formed by a transparent body such as ruby and sapphire. A first light source 6A or a second light source 6B lights up, and an electronic component 4 which is sucked, through vacuum, at the lower end of the nozzle 10 is observed by a lower camera 5. Even when the lower surface of the nozzle 10 projects from the electronic component 4, it cannot be observed by the camera 5 since the lower end 12 is a transparent body, thus accurately recognizing only the electronic component 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for transferring and mounting electronic components on a substrate.

[0002]

2. Description of the Related Art There are various types of electronic component mounting apparatuses. In any of these, an electronic component is vacuum-adsorbed and held at a lower end portion of a nozzle of a transfer head, and is transferred and mounted at a predetermined coordinate position on a substrate. It has become. FIG. 5 is a side view of a transfer head of a conventional electronic component mounting apparatus. The transfer head 1 includes a nozzle 2 at a lower portion thereof, and a back plate 3 as a light diffusing plate is provided at a lower surface thereof. The nozzle 2 holds the electronic component 4 at its lower end by vacuum suction. A camera 5 and a light source 6 indicated by a solid line are provided on the moving path of the transfer head 1, and the light of the light source 6 is emitted toward a back plate 3 as a light diffusion plate provided above the nozzle 2 ( Arrow L1), the black silhouette of the electronic component 4 is lowered by illuminating the light diffusing plate 3 brightly.
To observe.

FIG. 6A is an image diagram of a field of view of a camera of a conventional electronic component mounting apparatus, where A is a field of view and 4 ′ is a silhouette image of the electronic component 4. The electronic component 4 is small, so that the lower surface of the nozzle 2 protrudes from the electronic component 4 and is observed as a black silhouette 2 ′ in a light background.

[0005] Alternatively, a light source 6 is provided at a lower position indicated by a chain line in FIG. 5, and the light of the light source 6 is applied to the electronic component 4 vacuum-adsorbed to the lower end of the nozzle 2 (arrow L).
2) The electronic component 4 was observed with the camera 5 below. FIG. 6B shows an image at this time. Since the lower surface of the electronic component 4 is a mirror surface that strongly reflects light, the electronic component 4 is observed brightly against a dark background.

[0005]

When the electronic component 4 is observed using the back plate 3 which is a light diffusion plate, FIG.
If the electronic component 4 is small as shown in FIG.
Is easily exposed from the electronic component 4, and the silhouette 4 'of the electronic component 4 and the silhouette 2' of the nozzle 2 are integrated and observed by the camera 5, so that the silhouette 2 'of the nozzle 2 becomes noise and There is a problem that it is difficult to recognize the position of No. 4.

When observing the electronic component 4 by irradiating the electronic component 4 with light L2, as shown in FIG.
Since the lower surface of the nozzle strongly reflects light, the electronic component 4 and the nozzle 2
The lower surface of the electronic component 4 is observed as an integral part, and also has a problem that the nozzle 2 becomes noise and it is difficult to recognize the position of the electronic component 4.

In order to solve such a problem, the diameter of the nozzle 2 may be reduced.
There is a limit in processing technology to reduce the diameter of the nozzle 2, and when the size of the nozzle 2 is reduced, the strength of the nozzle 2 is reduced to cause bending, and a new problem such as easy wear of the lower surface occurs. Incidentally, the conventional nozzle 2 is made of a hard metal such as stainless steel.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component mounting apparatus which can solve the above-mentioned problems of the conventional nozzle and can accurately recognize the position of an electronic component vacuum-adsorbed to the lower end of the nozzle. And

[0009]

According to the present invention, an electronic component is vacuum-adsorbed to a lower end of a nozzle provided in a transfer head and transferred toward a substrate. An electronic component mounting apparatus that mounts an electronic component on a substrate after observing the electronic component and performing position recognition of the electronic component by providing a light diffusing plate above the nozzle and at least the camera of the nozzle. A first light source for irradiating light to the light diffusing plate and a second light source for irradiating light to an electronic component vacuum-adsorbed at a lower end of the nozzle; Is provided.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention having the above structure, when observing an electronic component as a black silhouette, light is emitted from the first light source toward the light diffusing plate, and when observing the electronic component directly. And irradiate light from the second light source to the electronic component. In this case, since at least a portion of the nozzle located in the focus range of the camera is made of a transparent material, the nozzle is not observed by the camera even if the lower surface of the nozzle protrudes from the electronic component, and only the electronic component can be accurately recognized. .

Next, an embodiment of the present invention will be described with reference to the drawings. 1 is an overall view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the transfer head, FIG. 3 is a cross-sectional view of a nozzle of the transfer head, and FIG. It is an image figure of a visual field.

In FIG. 1, reference numeral 1 denotes a transfer head, which has a nozzle 10 below the transfer head, and a back plate 3 as a light diffusion plate is mounted above the nozzle 10. The transfer head 1 has an X table 9A and a Y table 9B.
The electronic component 4 provided in the parts feeder 7 is transferred to and mounted on a predetermined coordinate position of the substrate 8 by being driven by the moving means composed of. A camera 5 and a ring-shaped first light source 6A and a second light source 6B are provided below the moving path of the transfer head 1. As a method of moving the transfer head, the X table 9 is used.
In addition to the method using the A and Y tables 9B, a method of rotating and moving along a rotary head is also frequently used.

In FIG. 2, the light L1 of the first light source 6A is radiated toward the back plate 3,
Is brightly illuminated, and the silhouette of the electronic component 4 is observed dark by the camera 5 below. The second light source 6B
Is directly radiated to the electronic component 4 vacuum-adsorbed to the lower end of the nozzle 10 and reflected by the lower surface, which is a mirror surface of the electronic component 4, so that the camera 5 below places the electronic component 4 in a dark background. Observe brightly.

2 and 3, the nozzle 10 has an upper end 11 and a lower end 12 attached to the upper end 11. As shown in FIG. The diameter of the upper end 11 is considerably larger than the diameter of the lower end 12, and is made of a hard metal such as stainless steel. On the other hand, the lower end portion 12 is made of a transparent body that transmits light and diffuses the light to the outside. As a material of the lower end portion 12, a material having high strength and abrasion resistance and excellent in workability is desirable, and specifically, ruby and sapphire are desirable.

In FIG. 1, the transfer head 1 picks up the electronic component 4 of the parts feeder 7 by vacuum suction at the lower end portion of the nozzle 10 and transfers it to the substrate 8. 5, the electronic component 4 is observed from below, and its position is recognized. Then, the displacement of the electronic component 4 is corrected according to the result of the position recognition, and the electronic component 4 is mounted at a predetermined coordinate position on the substrate 8.

FIG. 4A shows the field of view A of the camera 5 when the light L1 is emitted from the first light source 6A to the back plate 3.
FIG. Since the lower end portion 12 of the nozzle 10 is transparent, it is not observed by the camera 5, but only the electronic component 4 is observed in black on a bright background, and its silhouette 4 'is obtained. Therefore, the lower end 12 of the nozzle 10 does not generate noise, and the position of the electronic component 4 can be accurately recognized.

FIG. 4B is an image diagram when the light L2 is directly irradiated from the second light source 6B to the electronic component 4.
Also in this case, since the lower end portion 12 of the nozzle 10 is transparent, it is not observed by the camera 5, but only the mirror-reflecting electronic component 4 that reflects light is brightly observed in a dark background, and its position can be accurately recognized. . The first light source 6A and the second light source 6B are selectively turned on to perform the above observation.

In FIG. 2, the upper end 1 of the nozzle 10
Reference numeral 1 denotes a non-transparent body, and when the upper end portion 11 is observed by the camera 5, it becomes noise. Therefore, only the lower end portion 12 which is a transparent body is positioned in the focal range F of the camera 5 (FIG. 2), and the upper end portion 11 is out of the focal range so as not to be observed. Since the lower end 12 is not recognized by the camera 5 even if the lower surface protrudes from the electronic component 4, the outer diameter D of the lower end 12 is increased as shown in FIG. 3 to increase the strength and wear resistance. You can also. Also the lower end 1
By making the diameter d of the hole 2 relatively small, increasing the outer diameter D and increasing the thickness E of the lower end portion 11, not only the strength of the nozzle 10 is increased, but also the size of the small electron. Since not only the component 4 but also a large-sized electronic component can be vacuum-sucked on the lower surface of a wide area, the frequency of replacement of the nozzle 10 when the type of the electronic component is changed can be reduced.

[0019]

According to the present invention, since at least the portion of the nozzle located in the focal range of the camera is made of a transparent material, even if the lower surface of the nozzle protrudes from the electronic component, it is not observed by the camera, and the electronic component is not observed. Only can be accurately recognized.
In addition, since noise does not occur even if the nozzle protrudes from the electronic component, the outer diameter and thickness of the nozzle can be increased to increase strength and wear resistance.

[Brief description of the drawings]

FIG. 1 is an overall view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a side view of a transfer head of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 3 is a sectional view of a nozzle of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 4 is an image diagram of a field of view of a camera of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 5 is a side view of a transfer head of a conventional electronic component mounting apparatus.

FIG. 6 is an image diagram of a field of view of a camera of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transfer head 4 Electronic component 5 Camera 6A 1st light source 6B 2nd light source 8 Substrate 10 Nozzle 12 Lower end part

Claims (2)

[Claims] An electronic component is vacuum-adsorbed to a lower end of a nozzle provided in a transfer head and transferred toward a substrate. During the transfer, the electronic component is observed by a camera below and the position of the electronic component is determined. After performing the recognition, an electronic component mounting apparatus for mounting the electronic component on a substrate, wherein a light diffusing plate is provided above the nozzle, and at least a portion of the nozzle located in a focal range of the camera is made of a transparent material. An electronic component mounting, comprising: a first light source formed and irradiating light to the light diffusion plate; and a second light source irradiating light to an electronic component vacuum-adsorbed at a lower end portion of the nozzle. apparatus. 2. An electronic component is vacuum-adsorbed to a lower end of a nozzle provided in a transfer head and transferred toward a substrate. During the transfer, the electronic component is observed by a camera below and the position of the electronic component is determined. After performing the recognition, an electronic component mounting apparatus for mounting the electronic component on a substrate, wherein a light diffusing plate is provided above the nozzle, and at least a portion of the nozzle located in a focal range of the camera is made of a transparent material. An electronic component mounting apparatus comprising: a light source that is formed and irradiates light to the light diffusion plate.