JPH09191195A - Electronic component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting device equipped with a transfer head for vacuum clamping an electronic component at the lower end of a nozzle which does not cause a noise of observation by a camera when it extends off the component. SOLUTION: A lower end 12 of a nozzle 10 of a transfer head 1 is formed by a transparent body such as ruby or sapphire. An electronic component 4 vacuum clamped by the lower end of the nozzle 10 is observed by a camera 5 below. Even if the lower face of the nozzle 10 extends off the component 4, the lower end 12 is not observed by a camera since it is made of a transparent body. The camera can accurately recognizes only the silhouette of the electronic component 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for transferring and mounting electronic components on a substrate.

[0002]

2. Description of the Related Art An electronic component mounting apparatus is adapted to vacuum-hold and hold an electronic component at a lower end portion of a nozzle of a transfer head, and transfer and mount the electronic component at a predetermined coordinate position on a substrate. FIG. 5 is a side view of a transfer head of a conventional electronic component mounting apparatus. The transfer head 1 is provided with a nozzle 2 at its lower portion, and a back plate 3 is provided on the lower surface thereof. The nozzle 2 holds the electronic component 4 by vacuum suction at its lower end. A camera 5 and a light source 6 are provided on the moving path of the transfer head 1, and the light of the light source 6 is emitted toward the back plate 3 so that the silhouette of the electronic component 4 can be observed by the lower camera 5. ing.

FIG. 6 is an image view of a field of view of a camera of a conventional electronic component mounting apparatus, and 4'is a silhouette image of the electronic component 4. Since the electronic component 4 is small, the lower surface of the nozzle 2 is projected from the electronic component 4 and is observed as a black silhouette image 2 '.

[0004]

As shown in FIG. 6, when the electronic component 4 is small, the lower surface of the nozzle 2 is easily projected from the electronic component 4, and the silhouette image 4'of the electronic component 4 and the silhouette of the nozzle 2 are formed. Since the image 2'is integrally observed by the camera 5, the silhouette image 2'of the nozzle 2 becomes noise, which makes it difficult to recognize the position of the electronic component 4. In order to solve such problems,
It suffices to reduce the diameter of the nozzle 2, but there is a limit in processing technology to reduce the diameter of the nozzle 2,
Further, when the nozzle 2 becomes smaller, its strength is lowered and bending occurs, and new problems occur such that its lower surface is easily worn. Incidentally, the conventional nozzle 2 is made of a hard metal such as stainless steel.

Therefore, it is an object of the present invention to provide an electronic component mounting apparatus which can solve the problems of the conventional nozzle.

[0006]

To this end, according to the present invention, at least the focal range of the camera of the nozzle provided in the transfer head is formed of a transparent body such as ruby or sapphire.

[0007]

According to the present invention, since at least the portion of the nozzle located in the focal range of the camera is made transparent, even if the lower surface of the nozzle is protruding from the electronic component, it is not observed by the camera, The silhouette of only electronic parts can be accurately recognized.

Next, an embodiment of the present invention will be described with reference to the drawings. 1 is an overall view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the transfer head, FIG. 3 is a sectional view of a nozzle of the transfer head, and FIG. 4 is a view of the camera. It is an image figure of a visual field.

In FIG. 1, reference numeral 1 is a transfer head, which has a nozzle 10 in its lower portion, and a back plate 3 is attached to the lower surface thereof. The transfer head 1 is driven by a moving means composed of an X table 9A and a Y table 9B to move between a parts feeder 7 and a board 8, and the electronic component 4 provided in the parts feeder 7 is moved to a predetermined coordinate position of the board 8. It is transferred to and mounted on. A camera 5 and a light source 6 are provided below the moving path of the transfer head 1.

2 and 3, the nozzle 10 comprises an upper end 11 and a lower end 12 mounted on the upper end 11. The diameter of the upper end portion 11 is considerably larger than the diameter of the lower end portion 12, and is made of a hard metal such as stainless steel. On the other hand, the lower end 12 is made of a transparent body that transmits light and diffuses it to the outside. The material of the lower end portion 12 is preferably one having high strength and wear resistance and excellent workability, and specifically, ruby, sapphire or the like is desirable.

In FIG. 1, the transfer head 1 vacuum-sucks the electronic component 4 of the parts feeder 7 to the lower end of the nozzle 10 and picks it up and transfers it toward the substrate 8. The electronic component 4 is observed from below by 5 and its position is recognized. Then, the positional deviation of the electronic component 4 is corrected according to the result of the position recognition, and the electronic component 4 is mounted at a predetermined coordinate position on the substrate 8. FIG. 4 is an image view of the field of view A of the camera 5. Since the lower end portion 12 of the nozzle 10 is a transparent body, it is not observed by the camera 5, but only the electronic component 4 is observed and the silhouette image 4 ′ is obtained. Therefore, the lower end 12 of the nozzle 10 does not cause noise, and the position of the electronic component 4 can be accurately recognized.

In FIG. 2, the upper end portion 1 of the nozzle 10 is
Reference numeral 1 is a non-transparent body, and when this upper end 11 is observed by the camera 5, it becomes noise. Therefore, only the lower end 12 which is a transparent body is positioned in the focal range F (FIG. 2) of the camera 5, and the upper end 11 is out of the focal range so as not to be observed. Further, since the lower surface of the lower end portion 12 is not recognized by the camera 5 even if the lower surface thereof protrudes from the electronic component 4, the outer diameter D of the lower end portion 12 is increased to increase its strength and wear resistance as shown in FIG. You can also Also the lower end 1
The hole diameter d of 2 is made relatively small, the outer diameter D is made large, and the thickness E of the lower end portion 12 is made thick so that not only the strength of the nozzle 10 is increased but also a small electronic Since not only the component 4 but also a large electronic component can be vacuum-sucked on the lower surface of a large area, the frequency of replacement of the nozzle 10 due to the change of the type of electronic component can be reduced.

[0013]

According to the present invention, since at least the portion of the nozzle located in the focal range of the camera is made transparent, even if the lower surface of the nozzle is projected from the electronic component, it is not observed by the camera and the electronic component is not observed. You can accurately recognize only the silhouette. Further, even if the nozzle is projected from the electronic component, it does not cause noise, so that it is possible to increase the outer diameter of the nozzle and increase the wall thickness to increase strength and wear resistance.
Furthermore, since not only small electronic components but also large electronic components can be vacuum-sucked, it is possible to reduce the frequency of replacement of nozzles due to a change in the type of electronic components.

[Brief description of the drawings]

FIG. 1 is an overall view of an electronic component mounting apparatus according to an embodiment of the present invention

FIG. 2 is a side view of the transfer head of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 3 is a sectional view of a nozzle of a transfer head of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 4 is an image view of a field of view of a camera of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 5 is a side view of a transfer head of a conventional electronic component mounting apparatus.

FIG. 6 is an image view of a field of view of a camera of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 1 Transfer Head 4 Electronic Component 5 Camera 8 Substrate 10 Nozzle 12 Lower End

Claims (1)

[Claims] 1. An electronic component is vacuum-sucked to a lower end portion of a nozzle provided in a transfer head and transferred toward a substrate. During the transfer, the electronic component is observed by a lower camera to position the electronic component. After recognizing, an electronic component mounting apparatus for mounting an electronic component on a substrate, wherein at least a portion of the nozzle located in a focal range of the camera is formed of a transparent body.