CN100527933C - Electronic component identification process and apparatus - Google Patents

Abstract

Provided is a method and a device for recognizing an electronic part by which, even when the suction position of a nozzle is photographed while it is out of the center of a chip, the chip can be recognized accurately. The electronic part mounting device (10) is provided with a lower lighting fitting (25) and a side lighting fitting (27) in addition to coaxial lighting fitting (23) to direct light while changing an angle of lighting, and it also determines based on image recognition processing whether or not the lower surface of the nozzle is photographed, and a projecting area from the chip sucked to the nozzle is reduced without giving an influence to the image recognition processing, and then the photographed image is picked up to generate image recognition data through the image recognition processing.

Description

Electronic device identification method and device

technical field

The invention relates to an electronic device recognition method and device for image recognition of the position of the electronic device based on the image obtained by shooting the electronic device sucked and held on the suction nozzle from below.

Background technique

In the field of electronic device manufacturing, as a method of positioning electronic devices and substrates with high precision, a method of applying image recognition is widely used. This method detects the positions of the substrate mark of the substrate and the electrodes, edges, or centers of gravity of the electronic device by recognizing images obtained by photographing the substrate and the electronic device.

In the position detection of the electronic device by image recognition, the electronic device is sucked and held on the suction nozzle, moved above the imaging device, and photographed with a CCD camera. However, in recent years, higher density and higher precision are required for circuit layout substrates, and chip devices are often used as electronic devices, and the miniaturization of chip devices has also been achieved. Therefore, if the image is taken with the suction position of the nozzle deviated from the center of the chip device, as shown in Fig. 5(a), the lower surface of the nozzle exposed from the chip device is also captured, so image recognition cannot be performed correctly. .

Therefore, black treatment is performed on the adsorption surface of the suction nozzle of the adsorption chip device, and a hard carbon film with a Vickers hardness greater than or equal to 2000kg/mm ² is coated on the black treatment surface. In addition, the above-mentioned hard carbon film is called a DLC film. With the black treatment, the part exposed from the chip device adsorbed on the suction nozzle is not photographed, and the black treatment can be prevented from being worn and peeled off by coating the DLC film (for example, refer to Patent Document 1).

In addition, since the optimal luminance differs depending on the size of the chip device and the distance between the leads, etc. in the imaging for device identification, as a device for obtaining an appropriate image, the adjustment value of the illumination light is stored for each device type. , corresponding to the device adsorbed on the suction nozzle, the stored adjustment value is read out, and the light quantity of illumination is controlled according to the adjustment value (for example, refer to Patent Document 2).

[Patent Document 1] Japanese Patent Laid-Open Publication No. 6-244592

[Patent Document 2] Patent No. 3308228

However, the thickness of the DLC film coating is about 1 μm. During the process of repeated adsorption, holding, and assembly of chip devices up to hundreds of thousands of times, the wear between the chip device and the chip device will cause the coating and the black treatment part to fade. fall off. In addition, the reflected light from the lower surface of the suction nozzle cannot be avoided only by controlling the light quantity of the illumination, so there is a problem that accurate image recognition cannot be performed because the exposed part of the chip device attached to the suction nozzle is photographed.

Contents of the invention

The purpose of the present invention is to provide a method and device for identifying electronic devices, that is, in addition to coaxial lighting, lower lighting and side lighting are also provided, and while switching the lighting angle to irradiate light, it is judged through image recognition processing whether the bottom of the suction nozzle is covered. Taking in and reading the image taken after reducing the portion exposed from the adsorbed chip device to the extent that it does not affect the image recognition process, thereby reducing the occurrence of recognition errors. Therefore, an object of the present invention is to enable accurate and reliable image recognition even if the coating layer and the black-treated portion are rubbed off.

In order to solve the above-mentioned problems, one of the present invention adopts a method of irradiating light to the electronic device and taking pictures under the state that the electronic device is adsorbed and held on the adsorption surface of the suction nozzle, and the image of the electronic device is captured. An electronic component recognition method of an electronic component assembly machine that performs image recognition processing for assembling electronic components, wherein, when the electronic component is a predetermined component, the device is photographed by irradiating light with a lower illumination, Data for shape comparison is generated by performing image recognition processing on an image captured by the lower illumination, and the data for shape comparison is compared with a predetermined value, and if it is within an allowable range, the image recognition data is transmitted, and the The shape comparison data is compared with a predetermined value, and if it is out of the allowable range, light is irradiated with side lighting, the device is photographed again, and image recognition processing is performed on the image captured by the side lighting. Generate shape comparison data, compare the shape comparison data with a pre-specified value, and if it is within the allowable range, transmit image recognition data, compare the shape comparison data with a pre-specified value, if If the value is outside the allowable range, an error is transmitted.

And the second aspect of the present invention is that, in the image recognition method of an electronic device assembly machine according to the first aspect of the present invention, if the electronic device is not a pre-designated device, coaxial lighting is used to irradiate light, and the electronic device is photographed. A device for performing image recognition processing on the image captured by using the coaxial illumination, and transmitting image recognition data.

In addition, in order to solve the above-mentioned problems, the third aspect of the present invention constitutes a method for photographing the electronic device by irradiating light to the electronic device while the electronic device is being sucked and held on the suction surface of the suction nozzle. An electronic device recognition device for an electronic device assembly machine for performing image recognition processing on an image of an electronic device, which includes: a lighting unit having a coaxial lighting unit that irradiates light to the electronic device, a lower lighting unit, and a side lighting unit. part; an illumination switching unit that switches the driving of the illumination part of the illumination unit; an image storage unit that stores captured images; a data storage unit that extracts image data required for image recognition processing from the image storage unit storage; the recognition operation unit performs image recognition processing on the image data stored in the data storage unit to generate data for shape comparison; the shape comparison unit compares the data for shape comparison with a pre-specified value; The unit transmits the image recognition data processed by the recognition operation unit, or controls the illumination switching unit according to the comparison result of the shape comparison unit.

According to the image recognition method and device of the electronic device assembly machine of the present invention, in the case that the electronic device to be adsorbed is a pre-designated device (such as a chip device), first, the chip device is irradiated with light from the lower side to take pictures, and the image is captured. Recognition processing. Then, it is judged whether the shape of the captured image is within a predetermined range. If it is outside the specified range, the chip device is irradiated with light from the side illuminator to take pictures, and image recognition processing is performed. It is then judged whether the shape of the captured image is within a pre-specified range. In this way, only the part of the suction nozzle exposed from the chip device in the suction state that is captured does not affect the image recognition process, and the image is subjected to image recognition processing, and then the image recognition data is sent to the main control of the electronic device assembly machine unit, which can greatly reduce the recognition error.

In addition, coaxial lighting is also provided. For large electronic devices other than pre-designated devices (such as chip devices), coaxial lighting can be used to irradiate light to electronic devices for photographing and image recognition processing. Therefore, the image recognition time can be reduced, and the image recognition data free from recognition errors can be transmitted to the main control unit of the electronic device mounting machine.

Description of drawings

FIG. 1 is a perspective view of an electronic component assembly machine equipped with an electronic component identification device.

Fig. 2 is a diagram showing a lighting unit of the electronic device identification device.

Fig. 3 is a block diagram showing the system configuration.

FIG. 4 is a flowchart showing an electronic device recognition operation using image processing.

5 is a view showing an image of a chip device and a portion where a suction nozzle for sucking the chip device is exposed from the chip device.

In the figure: 10-electronic device assembly machine; 11-assembly head; 12-XY transmission part; 13-substrate conveying road; 14-electronic device supply device; 15-electronic device identification device; 18-designated device in advance ( Such as chip device); 19-substrate; 20-illumination device; 23-coaxial illumination unit; 25-bottom illumination unit; 27-side illumination unit; 29-CCD camera; 31-A/D conversion unit; 32-image storage unit; 33-data storage unit; 34-recognition operation unit; 35-shape comparison unit; 36-control unit; 37-lighting switching unit; 38-main control unit.

Detailed ways

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting machine equipped with an identification device as one embodiment of the present invention. 2 is a lighting unit of the electronic device identification device, FIG. 3 is a block diagram showing the system configuration, FIG. 4 is a flow chart showing the operation of the electronic device identification device using image processing, and FIG. Image diagram of the portion of the suction nozzle exposed from the chip device.

First, with reference to FIG. 1 , the overall configuration of an electronic component mounting machine 10 will be described. In FIG. 1, 13 is a board|substrate conveyance path. The substrate 19 conveyed by the substrate conveyance path 13 is held near the center portion of the substrate conveyance path 13 . The assembly head 11 is supported on the XY transfer unit 12 and can move horizontally. The assembly head 11 is provided with a suction nozzle for absorbing and holding electronic components. The assembly head 11 is vacuum-adsorbed with electronic components (chip components) 18 for supplying to the electronic component supply position of the electronic component supply device (filter) 14 at the lower end of the suction nozzle, and is carried out above the electronic component identification device 15. XY movement. The electronic device recognition device 15 photographs the bottom surface of the chip device, calculates the adsorption offset (XY error, angle error) of the chip device that is adsorbed and held according to the image recognition processing, and performs position correction with respect to the regular arrangement position of the substrate 19, and arranges it in the on the substrate 19.

Referring to FIG. 2 , the structure of the lighting unit 20 of the electronic device identification device 15 will be described. FIG. 2 shows a lighting unit 20 including a coaxial lighting unit 23 , a lower lighting unit 25 , and a side lighting unit 27 .

In the coaxial illuminating unit 23 , a plurality of LEDs 21 are arranged two-dimensionally (planar), and the coaxial illuminating unit is mounted on the frame 22 which is a vertical flat plate so that the arrangement plane of the LEDs 21 is vertical. The frame body 22 shows the left and right parts in the figure, but actually it is arranged also in the front and back, and constitutes the structure surrounding the lighting unit. A diffuser plate 24 is arranged on the light collecting surface of the coaxial illuminating part 23 so as to form uniform illuminating light.

A half mirror 28 forming an angle of 45 degrees with respect to the coaxial illuminating unit 23 is disposed at the intersection of the vertical centerline of the space surrounded by the housing 22 and the horizontal central line of the coaxial illuminating unit 23 . The illuminating light transmitted through the diffusion plate 24 is reflected upward by the half mirror 28 , and the chip device 18 sucked and held on the suction nozzle 16 is irradiated with light from directly below. And the light reflected downward by the chip device 18 passes through the half mirror 28 , and the chip device 18 is photographed by the CCD camera 29 .

In the lower lighting unit 25 , a plurality of LEDs 21 are arranged two-dimensionally (planar). The lower lighting unit 25 in the figure shows the left and right parts, but actually it is arranged also in the front and back, and constitutes a structure surrounding the lighting unit. In addition, the inner edge portion (the side opposite to the edge portion close to the housing 22 ) of each lower illuminating unit 25 is formed in such a size that it does not enter the field of view of the CCD camera 29 . On the upper surface of the lower illuminating part 25 is disposed a uniform illumination light diffusion plate 26 , and the illumination light transmitted through the diffusion plate 2 irradiates the chip 18 sucked and held on the suction nozzle 16 from obliquely downward. And the light reflected downward by the chip device 18 passes through the half mirror 28 , and the chip device 18 is photographed by the CCD camera 29 .

In the side lighting part 27, a plurality of LEDs 21 are arranged two-dimensionally (planar), and the side lighting part is arranged on the frame body 22 in a state in which the arrangement plane of the LEDs 21 is vertical, and is positioned above the lower lighting part 25. Although the side lighting part 27 shows the left and right parts in the drawing, it is actually arranged also in the front and rear, and constitutes a structure surrounding the lighting part. In addition, in order not to interfere with the illumination of the lower lighting unit 25 , the side lighting unit 27 is disposed outside the arrangement of the LEDs 21 of the lower lighting unit 25 (on the side closer to the housing 22 ). Illumination light is irradiated obliquely from below onto the chip device 18 sucked and held on the suction nozzle 16 . And the light reflected downward by the chip device 18 passes through the half mirror 28 , and the chip device 18 is photographed by the CCD camera 29 .

Next, the configuration of the control system of the electronic device identification device 10 will be described with reference to FIG. 3 .

In FIG. 2 , a CCD camera 29 photographs the electronic device 18 , and transmits the image data to the image storage unit 32 via the A/D conversion unit 31 . The image storage unit 32 stores A/D-converted image data. And in order to shorten the image recognition processing time, the data of the image processing part is extracted from the image storage unit 32 and stored in the data storage unit 33 .

The recognition operation unit 34 performs image recognition processing on the image data stored in the data storage unit 33 , and detects the positions and angles of electrodes, edges, or centers of gravity of electronic devices. The image recognition processing is performed by a method specified in advance according to the type and size of the device, such as a pattern matching method and a binarization method. Here, when the electronic device is a chip device, shape comparison data for determining whether or not the suction nozzle is read as an image is generated. The method of generating data can be specified in advance, if it is a pattern matching method, calculate the highest matching rate; if it is a contour tracking method, calculate the contour length of the image; if it is an area method, calculate the area of the image.

The shape comparison unit 35 receives the data for shape comparison calculated by the recognition operation unit 34 , and transmits a determination result of OK or NG to the control unit 36 . In the case of the highest matching rate, if the shape comparison data is larger than a predetermined value, it is OK, and if it is small, it is NG. In the case of the outline length, if the shape comparison data is within the predetermined range, it is OK, and if it is outside the specified range, it is NG. In the case of the area, if the shape comparison data is within the predetermined range, it is OK, and if it is outside the predetermined range, it is NG.

The control unit 36 is a part that controls the entire electronic device identification device 15, but only the part related to the present invention will be described. If it is not a chip device, the control unit 36 acquires the image data of the position and angle of the electrodes, edges or center of gravity of the electronic device from the recognition operation unit 34 and sends it to the main control unit 38 of the electronic device assembly machine 10 . In the case of a chip device, if the judgment result of the comparison unit 35 is OK, the image recognition data of the position and angle of the center of gravity are acquired from the recognition operation unit 34, and are sent to the main control unit 38 of the electronic device mounting machine 10. . If the judgment result of the shape comparison unit 35 is NG, the control signal for lighting switching is sent to the lighting switching unit 37 and the imaging signal is sent to the CCD camera.

According to the control signal of the control unit 36, the lighting switching unit 37 makes any one of the coaxial lighting part 23, the lower lighting part 25, and the side lighting part 27 act for lighting, or make a combined action for lighting, or adjust the brightness of the lighting. Lower for lighting.

Here, images corresponding to OK and NG will be described with reference to FIG. 5 . An image captured by a CCD camera is a two-dimensional array of m×n pixels, and each pixel has a pixel value, usually 0 to 255. The pixel value of the portion where the CCD is irradiated with strong light is high, and the pixel value of the portion where the CCD is irradiated with weak light is low. The figure is represented by two colors of black and white, and the pixel value cannot be represented, so the part with more black is represented as a part with high pixel value, and the part with less black is represented as a part with low pixel value. In FIG. 5( a ), 32 is an image of the chip device, and 31 is an image of the exposed underside of the suction nozzle. Both 31 and 32 have high pixel values (more black parts). In this case, 31 and 32 cannot be distinguished, and the part where 31 and 32 merge is regarded as a chip for image recognition, so it is judged as NG in the shape comparison. In FIG. 5( b ), 31 is an image under the exposed suction nozzle, and is a part with low pixel value (less black). Since the part of 31 can be distinguished from the part with high pixel value (more black) of 32, only 32 is recognized as a chip device, and it is judged as OK in the shape comparison. By switching the illumination unit, an image as shown in FIG. 5(b) can be generated for image recognition.

The configuration of the electronic device identification device 15 is as described above, and its operation will be described below. First, the assembly head 11 adsorbs the electronic component on the suction nozzle and performs XY movement so that the electronic component is located above the electronic component identification device 15 (imaging position). In FIG. 4 , it is judged whether the electronic device adsorbed on the suction nozzle is a chip device (step ST1 ). If it is not a chip device, the coaxial illuminating unit is operated to irradiate light to image the electronic device (step ST9). Through the image recognition process, the positions and angles of electrodes, edge portions, center of gravity, etc. of the electronic component are transmitted to the main control unit 38 of the electronic component mounting machine 10 (step ST11).

If it is a chip device, the lower illuminator is operated to emit light, and the chip device is photographed (step ST2). Through the image recognition processing, shape comparison data for judging whether or not the suction nozzle has been read as an image is generated (step ST3). Next, it is judged whether the shape is an acceptable shape (step ST4). If the shape is acceptable, the image recognition data of the position and angle of the center of gravity of the chip device are transmitted to the main control unit 38 of the electronic device device 10 (step ST11).

If it is an unacceptable shape, the side illuminator is operated to emit light, and the chip device is photographed (step ST5). Data for shape comparison for judging whether the suction nozzle is read as an image is generated by image recognition processing (step ST6). Next, it is judged whether it is an allowable shape (step ST7). If it is a permissible shape, the image recognition data of the position and angle of the center of gravity of the chip device are transmitted to the main control unit 38 of the electronic device device 10 (step ST11).

If it is an unacceptable shape, an error is sent to the main control unit 38 of the electronic device device 10 (step ST8).

In addition, in the case of a chip device, the following operations may be inserted before step ST1 proceeds to step ST2: make the bottom lighting and side lighting operate to irradiate light, and take a picture of the chip device; Data for shape comparison of whether the suction nozzle is read as an image; whether it is an acceptable shape is judged.

In addition, before proceeding from step ST4 to step ST5, the following operations may be inserted: operate the lower lighting to make its brightness about 1/2, and make the side lighting operate to irradiate light, and take pictures of the chip device; Generate shape comparison data for judging whether the suction nozzle is read as an image; judge whether it is an acceptable shape.

In addition, the so-called pre-designated device is a device designated based on the relationship between the shape of the suction nozzle and the size of the device, and is not limited to a chip device.

As another field of application, for example, by recognizing the shape of the laser diode chip, the laser diode chip can be positioned on a sub mount and mounted in chip bonding technology.

Claims (3)

1. the electronic component identification process of an electronic device assembly machine, be adsorbed and remain at electronic device under the state on the adsorption plane of suction nozzle, by to described electronic device irradiates light and take, image to described electronic device carries out image recognition processing, carry out the assembling of electronic device, it is characterized in that, at described electronic device is under the situation of preassigned electronic device, come to described electronic device irradiates light with the below illumination, take described electronic device, generate and be used for judging that whether suction nozzle relatively use data as the shape that image is read by the image that utilizes the illumination of described below to take being carried out image recognition processing, described shape is relatively compared with data and preassigned value, if within permissible range, transmitted image recognition data then, if outside permissible range, then come to described electronic device irradiates light with side illumination, take described electronic device once more, generate another shape and relatively use data by the image that utilizes described side illumination to take being carried out image recognition processing, described another shape is relatively compared with data and preassigned value, if within permissible range, transmitted image recognition data then, if outside permissible range, then transmit mistake.

2. the electronic component identification process of electronic device assembly machine according to claim 1 is characterized in that,

If described electronic device is not preassigned device, then come irradiates light with coaxial-illuminating, take described electronic device, the image that utilizes described coaxial-illuminating to take is carried out image recognition processing, and the transmitted image recognition data.

3. the electronic device recognition device of an electronic device assembly machine, be adsorbed and remain at electronic device under the state on the adsorption plane of suction nozzle, by to described electronic device irradiates light and take, image to described electronic device carries out image recognition processing, carry out the assembling of electronic device, it is characterized in that, comprising:

Lighting unit has coaxial-illuminating portion, below Lighting Division, side illumination portion to described electronic device irradiates light;

The illumination switch unit, any one party in described coaxial-illuminating portion, described below Lighting Division, the described side illumination portion is moved throws light on, described coaxial-illuminating portion, described below Lighting Division, the combination action of described side illumination portion are thrown light on, the brightness of the illumination of described coaxial-illuminating portion, described below Lighting Division, described side illumination portion is reduced throw light on;

Store the image storage unit of captured image;

Data storage cell is extracted the needed view data of image recognition processing out and is stored from described image storage unit;

The identification arithmetic element is carried out image recognition processing to the view data that is stored in the described data storage cell, generates to be used for judging that the shape whether suction nozzle is read as image relatively uses data;

The shape comparing unit relatively compares described shape with data and preassigned value;

Control unit, comparative result according to described shape comparing unit, if within permissible range, then transmit the handled image recognition data of described identification arithmetic element, if outside permissible range, then control described illumination switch unit and make described coaxial-illuminating portion, described below Lighting Division, any one party in the described side illumination portion is moved and is thrown light on, perhaps make described coaxial-illuminating portion, described below Lighting Division, the combination action of described side illumination portion is thrown light on, and perhaps makes described coaxial-illuminating portion, described below Lighting Division, the brightness of the illumination of described side illumination portion reduces throws light on.

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