JP3783680B2 - Electronic component observation apparatus and electronic component observation method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component observation apparatus and an electronic component observation method suitable for observing bumped electronic components.
[0002]
[Prior art]
The present applicant has previously proposed a technique in which an existing electronic component observation apparatus is improved in accordance with the characteristics of an electronic component with bumps (see, for example, Patent Document 1).
[0003]
The main points of this electronic component observation apparatus will be described below with reference to FIGS.
[0004]
In FIG. 6, reference numeral 1 denotes an electronic component with bumps, 2 of which is a main body part 2 made of a molded body, 3 is a substrate part provided at the lower part of the main body part 2, and 4 is a matrix on the lower surface of the substrate part 3 The bumps 4 are formed individually and serve as terminals of the bumped electronic component 1. The bump 4 has a hemispherical shape, and its surface (curved surface) has a mirror shape.
[0005]
The bumped electronic component 1 is adsorbed and supported by a nozzle 5 provided below the transfer head 6, and a background plate 7 is attached to the transfer head 6 so as to be positioned behind the bumped electronic component 1. ing.
[0006]
Reference numeral 8 denotes a light source unit having a recess 9 in the upper portion thereof. A lens barrel 10 penetrating the center of the light source unit 8 is provided in the lower portion of the recess 9, and a camera 11 connected to the lens barrel 10 is a mirror. The lower surface of the bumped electronic component 1 can be observed from below through the cylinder 10 and the recess 9.
[0007]
A plurality of LEDs 12 are arranged on the inclined surface of the concave portion 9 and emit light from below toward the lower surface of the electronic component 1 with bumps (the arrangement surface of the bumps 4 as terminals). Reference numeral 14 denotes an optical fiber 14 that is connected to the halogen light source 13 and brightly illuminates the background plate 7 behind the electronic component 1 with bumps, as indicated by arrows N1 and N2.
[0008]
By the way, as shown in FIG. 7A, the bump 4 is fixed to the land 15 formed on the lower surface of the substrate portion 3. However, in some cases, the bump 4 is chipped, and the land 15 may be exposed as it is, as shown by part A in FIG. In such a case, the bumped electronic component 1 is defective and must be excluded from the line.
[0009]
[Patent Document 1]
JP-A-8-153997 gazette
[Problems to be solved by the invention]
However, since the land 15 is also made of a metal foil such as copper, and the surface thereof is a horizontal metal surface, it shines brightly when irradiated with light.
[0011]
Therefore, when the image is observed with a conventional electronic component observation apparatus as shown in FIG. 6, an image as shown in FIG. 7B is obtained. In FIG. 7B, the hatched portion indicates a bright portion, and the non-hatched portion indicates a dark portion. Moreover, P1 is a point which shows the corner | angular part 3a of the board | substrate part 3, and S1 and S2 are the images which exist in the A part of Fig.7 (a).
[0012]
That is, it is impossible to distinguish on the image the image S2 of the portion where only the land 15 where the bump 4 does not exist (the bump missing) and the bump 4 exist.
[0013]
Therefore, when this image is recognized by the image processing unit, the bump 4 is not originally present and should be determined as “defective”, but erroneously determined as “good”. Thus, the conventional electronic component observation apparatus has a problem that the reliability of recognition of the electronic component 1 with bumps is low. Further, when a wiring pattern is present near the land 15, it is erroneously recognized as a “bump”, and an electronic component may be mounted on the substrate based on the wrong bump position.
[0014]
Accordingly, an object of the present invention is to provide an electronic component observation apparatus and an electronic component observation method that can correctly recognize bumped electronic components.
[0015]
[Means for Solving the Problems]
The electronic component observation apparatus according to claim 1 is provided on the inclined surface of the concave portion of the light source unit and the transfer surface for holding the electronic component, the camera for observing the electronic component from below, and the arrangement surface of the terminals of the electronic component. A reflection recognition light emitting unit that irradiates light from below and an uppermost stage of the light source unit that is above the reflection recognition light emission unit, and has an acute angle that is almost horizontal with respect to the arrangement surface of the terminals of the electronic component. A bump recognition light emitting unit for irradiating light, and when the terminal is a bump, the bump recognition light emitting unit is turned on and the reflection recognition light emitting unit is turned off .
[0016]
The electronic component observation method according to claim 2 includes a transfer head for holding an electronic component, a observation method according to the electronic component observation apparatus provided with a camera for observing the electronic part from below, the recess of the light source unit The reflection recognition light-emitting unit that is provided on the inclined surface of the electronic component and emits light from below toward the terminal arrangement surface of the electronic component, and is disposed on the uppermost stage of the light source unit that is above the reflection recognition light-emitting unit. A bump recognition light emitting unit that irradiates light at an acute angle that is almost horizontal with respect to the arrangement surface of the component terminals is prepared, and the reflection recognition light emitting unit and the bump recognition light emission are determined according to a bump recognition method and a reflection recognition method. Among the parts, the light emitting part to be turned on is used by switching . When the terminal is a bump, the bump recognition light emitting part is turned on and the reflection recognition light emitting part is turned off .
[0018]
According to the present invention, when observing an electronic component with bumps according to the above-described configuration, a ring-shaped image can be obtained for a portion having a bump by turning on the bump recognition light emitting unit. As a result, it is possible to clearly distinguish from the case where the land is exposed as it is without bumps, and it is possible to reduce erroneous recognition and improve the reliability of recognition.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. 1 is a side view of an electronic component observation apparatus according to an embodiment of the invention, FIG. 2 is a control block diagram of the electronic component observation apparatus according to an embodiment of the invention, and FIG. 3 is an electronic component observation according to an embodiment of the invention. FIG. 4A is a side view of a bumped electronic component according to an embodiment of the invention, FIG. 4B is an illustration of an image according to an embodiment of the invention, and FIG. ) Is an enlarged view of the vicinity of a bump in one embodiment of the invention, FIG. 5A is a side view of an electronic component suitable for a transmission recognition system in one embodiment of the invention, and FIG. FIG. 5C is a side view of an electronic component suitable for a reflection recognition system according to an embodiment of the invention, and FIG. 5D is an image of the image according to the embodiment of the invention. It is an illustration figure. In addition, about the component similar to FIG. 6, FIG. 7 which shows a prior art, the description is abbreviate | omitted by attaching | subjecting the same code | symbol.
[0020]
In FIG. 1, reference numeral 16 denotes a light source unit having a recess 17. The inclined surface of the concave portion 17 is provided with a reflection recognition light emitting unit 18 (comprising a large number of LEDs) that emits light from below toward the lower surface of the electronic component 1 with bumps (an arrangement surface of the bumps 4 as terminals). It has been.
[0021]
In addition, a transmission recognition light emitting unit 19 (comprising an optical fiber) connected to the halogen light source 13 and irradiating light to the background plate 7 is provided on the upper stage, and further, the arrangement surface is provided on the uppermost stage. On the other hand, a bump recognition light emitting unit 20 (comprising a halogen lamp) that irradiates light at an acute angle (nearly horizontal) is disposed.
[0022]
These light-emitting units 18, 19, and 20 are switched and used according to the recognition method (bump recognition method, transmission recognition method, reflection recognition method) by the control block shown in FIG.
[0023]
In FIG. 2, 21 is a main control unit for controlling the whole, 22 is a storage unit for storing the recognition method and shape data for each electronic component, and 23 is a transfer head drive for driving the transfer head 6 in the XYZθ directions. Part.
[0024]
Reference numeral 24 denotes an illumination control unit which inputs information on the recognition method from the main control unit 21 and switches on / off the light emitting units 18, 19 and 20 in the manner described later.
[0025]
On the other hand, analog image information obtained from the camera 11 is converted into a digital signal by the A / D converter 25 and temporarily stored in the image memory 26.
[0026]
Then, the image processing unit 27 recognizes the presence / absence of positional deviation and the presence / absence of the bump 4 for the bumped electronic component 1 based on the image of the image memory 26, and the bump position information and “good” or “bad”. The recognition result is output to the main control unit 21. The main control unit 21 controls the transfer head driving unit 23 based on the recognition result to transfer the electronic component held by the transfer head 6 to a substrate not shown in the figure, or to transfer a defective electronic component to a predetermined unit. Or dispose of in position.
[0027]
The electronic component observation apparatus according to the present embodiment has the above-described configuration. Next, the operation of the electronic component observation apparatus will be described with reference to FIGS.
[0028]
First, in step 1, an electronic component is picked up by a transfer head 6 from a supply unit (not shown), and is transferred above the electronic component observation apparatus. In step 2, the recognition method of the electronic component currently sucked by the nozzle 5 is acquired from the storage unit 22.
[0029]
If this recognition method is a bump recognition method, the illumination control unit 24 turns on the bump recognition light emitting unit 20 and the transmission recognition light emitting unit 19 and turns off the reflection recognition light emitting unit 18.
[0030]
At this time, the transmission recognition light-emitting unit 19 may be turned off. However, when the bump recognition light-emitting unit 20 and the transmission recognition light-emitting unit 19 are turned on, the corners of the substrate unit 3 can be easily found in the image, and the bump 4 Since the approximate position can be obtained, the recognition can be speeded up, which is convenient.
[0031]
Now, the observation by this bump recognition method will be described with reference to FIG. Here, as in FIG. 7A relating to the prior art, when the bump 4 is missing in the portion A, the image of the camera 11 is as shown in FIG. 4B.
[0032]
That is, in the part where the bump 4 is not present and the land 15 is exposed as it is, the land 15 is a horizontal metal surface, so even if light is irradiated at an acute angle by the bump recognizing light emitting unit 20, the reflected light is directly below the camera. It does not face 11 side. Therefore, like the image S2, this portion is observed darkly.
[0033]
On the other hand, when the bump 4 is fixed to the land 15, the light emitted from the bump recognition light emitting unit 20 to the bump 4 is reflected as shown in FIG.
[0034]
That is, as indicated by the arrow N3, the light incident on the vicinity of the top of the bump 4 is reflected almost in parallel with the substrate 3 and is not directed to the camera 11 side. Therefore, a dark image is formed near the top of the bump 4. However, as indicated by the arrow N4, the light incident near the middle of the bump 4 is reflected substantially perpendicularly to the substrate unit 3 and faces the camera 11 side.
[0035]
As a result, when the bumps 4 are present, a bright ring-shaped image is obtained like the image S1 in FIG. Therefore, the image processing unit 27 can prepare a ring-shaped pattern (which may be either binary or multi-valued), perform pattern matching, and specify the position of the bump 4.
[0036]
Here, as shown in FIG. 4B, the presence or absence of the bump 4 can be clearly distinguished by the images S1 and S2. Here, unlike the prior art, when there is no bump 4 and the land 15 is exposed as it is, there is no erroneous determination as “good”. For this reason, the reliability of recognition can be improved.
[0037]
Next, in step 2 of FIG. 3, when the recognition method is the transmission recognition method, only the transmission recognition light emitting unit 19 is turned on, and the reflection recognition light emitting unit 18 and the bump recognition light emitting unit 20 are turned off.
[0038]
As shown in FIG. 5A, lead-type electronic components such as the square chip 28, QFP, and SOP are suitable for this transmission recognition method.
[0039]
According to this method, as shown in FIG. 5B, the background plate 7 is brightly illuminated, and the electronic component is observed as a dark silhouette in the background plate 7. In this embodiment, as shown in FIG. 1, the background plate 7 is illuminated from the lower side by the transmission recognition light emitting unit 19, but the background plate 7 may be illuminated from the upper side.
[0040]
If the recognition method is the reflection recognition method in step 2 of FIG. 3, the reflection recognition light emitting unit 18 is turned on (step 5). In addition, the transmission recognition light emitting unit 19 may be turned on.
[0041]
The transparent recognition method is applied to a J lead component 29 having a J lead 29a bent inward as shown in FIG. 5C. At this time, as shown in FIG. 5D, only the J lead 29a is observed as bright images S4 and S5.
[0042]
3, the analog image of the camera 11 is digitized by the A / D converter 25 and stored in the image memory 26. Then, the image processing unit 27 recognizes misalignment or the like according to the electronic component recognition method (step 7), and obtains a recognition result. If the recognition result is “good”, the electronic component is mounted on the substrate based on the detected position of the bump 4 (step 9). If it is defective, the electronic component is discarded (step 10). Then, it is confirmed whether or not all the electronic components have been mounted (step 11). If not completed, the process returns to step 1 to pick up the next electronic component, and if completed, the process is terminated.
[0043]
【The invention's effect】
Since the present invention is configured as described above, highly reliable recognition can be performed for bumped electronic components, including determination of the presence or absence of bumps.
[Brief description of the drawings]
FIG. 1 is a side view of an electronic component observation apparatus according to an embodiment of the invention. FIG. 2 is a control block diagram of the electronic component observation apparatus according to an embodiment of the invention. FIG. 4A is a side view of an electronic component with bumps according to an embodiment of the invention. FIG. 4B is an illustration of an image according to an embodiment of the invention. FIG. 4C is a bump according to an embodiment of the invention. FIG. 5A is a side view of an electronic component suitable for a transmission recognition system in an embodiment of the invention; FIG. 5B is an exemplary view of an image in the embodiment of the invention; and FIG. 5C is an embodiment of the invention. FIG. 6 is a side view of an image according to an embodiment of the invention. FIG. 6 is a side view of a conventional electronic component observation apparatus. FIG. 7 is a side view of a conventional electronic component. Bumped electricity by observation equipment Side view of the component (b) illustration of a conventional image by electronic component viewing device [Description of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component with bump 4 Bump 6 Transfer head 7 Background board 11 Camera 18 Reflection recognition light emission part 19 Transmission recognition light emission part 20 Bump recognition light emission part

Claims (2)

Reflection-recognition light emission that is provided on the inclined surface of the concave portion of the light source unit and emits light from below toward the arrangement surface of the terminals of the electronic component, and a transfer head that holds the electronic component, a camera that observes the electronic component from below And a bump recognition light-emitting unit that is disposed on the uppermost stage of the light source unit that is above the reflection-recognition light-emitting unit and that irradiates light at an acute angle that is almost horizontal with respect to the arrangement surface of the terminals of the electronic component. When the terminal is a bump, the bump recognition light emitting unit is turned on and the reflection recognition light emitting unit is turned off . An observation method by an electronic component observation apparatus comprising a transfer head for holding an electronic component and a camera for observing the electronic component from below,
A reflection recognition light-emitting unit that is provided on the inclined surface of the concave portion of the light source unit and emits light from below toward the arrangement surface of the terminals of the electronic component, and the uppermost stage of the light source unit that is above the reflection recognition light-emitting unit And a bump recognition light emitting unit that irradiates light at an acute angle that is almost horizontal with respect to the arrangement surface of the terminals of the electronic component. Among the bump recognition light emitting units, a light emitting unit to be turned on is used by switching , and when the terminal is a bump, the bump recognition light emitting unit is turned on and the reflection recognition light emitting unit is turned off. Part observation method.

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