JP2001304829A - Electronic part recognizing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic part recognizing apparatus capable of supplying totally balanced light beams to an electronic part to be used as illumination having little attenuation of quantity of light. SOLUTION: The electronic part 2 is sucked and taken out from a part feeding unit or the like by a suction nozzle 1 and moved above an illuminating part 5, and light from a number of optical fibers 6 is applied to the lower surface of the part 2 in full-arc direction. Light from the optical fiber 6 is reflected by a reflecting surface 8, and the reflected light is applied to the lower surface of the electronic part 2 obliquely from the lower side. By a limiting part 9 of a reflecting part 7, quantity of light transmitted through a diffusing plate 3 as a background material is decreased to become dark, and the reflected light of the electronic part 2 through the reflecting surface 8 becomes bright. Accordingly, a wiring 12 connected to a bump 10 is not reflected on a recognition camera 4, a central part 11 (smaller circle than the bump 10) of the bump 10 becomes a dark image, and its periphery becomes a light image, so that the position of an arbitrary bump 10 can be recognized accurately so as to recognize the position of the electronic part 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component recognizing apparatus for irradiating an electronic component sucked by a suction nozzle with light and recognizing a position of the component by a reflected image.

[0002]

2. Description of the Related Art Conventionally, electronic parts such as a BGA (Ball Grid Array) and a CSP (Chip Size Chip) have a part of a hemispherical bump (terminal) projecting from the lower surface (back surface).
When the reflected image of the back surface of an electronic component such as a package) is picked up by a CCD camera and the position of the component is recognized, the LED (from four directions) is used to optimize the reflection of the bump.
The injection angle was set.

[0003]

However, since it is difficult to accurately set the direction of the exit angle, the CCD camera cannot capture a clear image.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component recognition apparatus which supplies a light beam which is well-balanced as a whole to an electronic component and which can be used as illumination with less attenuation of light quantity.

[0005]

SUMMARY OF THE INVENTION Accordingly, the present invention provides an electronic component recognizing apparatus which irradiates an electronic component sucked by a suction nozzle with light and recognizes the position of the component based on a reflected image.
A lighting unit in which a plurality of light sources are arranged at predetermined intervals so as to irradiate light upward, respectively, and an inclined reflecting surface fixed to an upper end of the lighting unit and reflecting light from the light source is provided. And a reflection member for irradiating the formed electronic component with the reflected light to the electronic component sucked by the suction nozzle.

Further, according to the present invention, a limiting portion is provided at an upper end portion of the reflecting member for limiting an amount of light emitted from the reflecting surface to the background material.

Further, according to the present invention, the illuminating portion is formed in a cylindrical shape, and the plurality of light sources are arranged on a circumferential portion of the illuminating portion at a predetermined interval. The surface is formed over the entire circumference.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. Reference numeral 1 denotes a suction nozzle for picking up an electronic component 2 of a so-called rotary table type or horizontally moving type electronic component mounting device from a component supply unit or a component supply tray (not shown) and mounting the same on a printed circuit board. This is a diffusion plate provided in the nozzle 1. The diffusion plate 3 serves as a background material as will be described later, but also serves as a reflection diffusion plate for transmission, and a reflection layer (not shown) is provided on the upper surface thereof.

Reference numeral 4 denotes a recognition camera (CCD camera) provided at a predetermined position of the electronic component mounting apparatus, which picks up a reflected image of the electronic component 2 via a cylindrical illumination unit 5 disposed at a position above the recognition camera. . In addition, a large number of, for example, 200 optical fibers 6 (as light sources) are arranged at predetermined intervals so as to irradiate the illumination unit 5 with light upward, and the axial direction of the optical fiber 6 is up and down at a circumferential portion thereof. As buried. Although not shown, the plurality of optical fibers 6 are bundled and taken out from the side of the illumination unit 5 through a fiber tube, and an end of the optical fiber 6 is supplied with light from a light source (not shown). Configuration. Note that a plurality of LEDs (Light) are used instead of the large number of optical fibers 6.
This may be disposed around the circumference of the illumination unit 5 using an emitting diode, and light may be emitted upward.

Reference numeral 7 denotes a reflecting member made of a high-reflective material, for example, a stainless steel material. The reflecting member has a substantially ring shape and a substantially triangular cross section, and is fixed to the upper end of the illuminating section 5, and has an inner surface. In addition, an inclined reflecting surface 8 for reflecting light from the optical fiber 6 is formed over the entire circumference, and the reflected light is applied to the electronic component 2 sucked by the suction nozzle 1. That is, when the camera 4 captures an image, the light from the optical fiber 6 is radiated from all directions around the lower surface (back surface) of the electronic component 2 sucked by the suction nozzle 1 located above the center of the illumination unit 5. In addition, the reflection surface 8 is inclined about 50 degrees inward.

At the upper end of the reflection member 7, a limiter 9 is connected to the reflection surface 8 for limiting the amount of light reflected from the reflection surface 8 to the diffusion plate 3 as a background material. Has been established. In other words, the limiting portion 9 limits the amount of light to the diffusion plate 3 so that the brightness of the diffusion plate 3 becomes sufficiently darker than the bump portion, similarly to the body portion on the back surface of the electronic component 2.

The electronic component 2 has a plurality of hemispherical bumps 10 (terminals) protruding from the lower surface (back surface), such as BGA (ball grid array) and CS.
An electronic component such as a P (chip size package) or the like, and a reflection image of the lower surface (back surface) of the electronic component is captured by the recognition camera 4 to recognize the position of the component 2. That is, the bump 10
Is connected to the electronic component, so that the wiring 12 is not reflected from the recognition camera 4 but from the side (actually, obliquely below) instead of directly below as described above. 2 is applied to the lower surface of each of the bumps 1
The central part 11 of 0 (a smaller circle than the bump 10) becomes a dark image and the surrounding area becomes a bright image, so that any position of the bump 10 can be accurately recognized, and the position of the electronic component 2 is recognized. .

The operation of the above configuration will be described below. First, the suction nozzle 1 picks up the electronic component 2 of the electronic component mounting apparatus and the component supply unit or the component supply tray (not shown).
The optical component 6 moves upward from the recognition camera 4 and the illuminating unit 5 disposed above the recognition camera 4, so that light from a large number of optical fibers 6 irradiates the lower surface of the electronic component 2 from all directions.

At this time, the light from the optical fiber 6 is reflected by the reflecting surface 8 as shown in FIG. 2, and the reflected light irradiates the lower surface (back surface) of the electronic component 2 sucked by the suction nozzle 1 from obliquely below. Is done. Further, the limiting portion 9 of the reflecting member 7
Thus, the amount of light transmitted through the electronic component 2 through the diffusion plate 3 as a background material is reduced, and the amount of light transmitted through the electronic component 2 is reduced. Therefore,
As shown in FIG. 3, the wiring 12 connected to the bump 10 and the missing bump 13 are not reflected on the recognition camera 4, and the central portion 11 (small circle than the bump 10) of each bump 10 becomes a dark image. The surrounding area is a bright image, and the position of any bump 10 can be accurately recognized.
The position of the electronic component 2 is recognized.

When the electronic component 2 is subsequently mounted, the amount of movement of the suction nozzle 1 and / or the amount of movement of the printed circuit board are corrected by the deviation, and the electronic component 2 is accurately mounted on the printed circuit board.

[0016]

As described above, according to the present invention,
It is possible to provide an electronic component recognizing device that supplies a light beam that is well-balanced as a whole to the electronic component and that can be used as illumination with less attenuation of light quantity. In addition, the reflected image of the electronic component becomes clear, and a more accurate position can be recognized.

[Brief description of the drawings]

FIG. 1 is a side view of an electronic component recognition device of the present invention.

FIG. 2 is a side view of a main part in which only a reflection member of an illumination unit is longitudinally cut.

FIG. 3 is a diagram illustrating an image obtained by imaging an electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Suction nozzle 2 Electronic component 3 Diffusion plate (background material) 4 Recognition camera 5 Illumination part 6 Optical fiber 7 Reflection member 8 Reflection surface 9 Restriction part 10 Bump

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2F065 AA01 AA51 CC25 FF01 FF04 GG07 GG13 JJ03 JJ26 LL03 LL49 PP11 UU01 2G051 AA73 BA01 BB11 BB17 BB20 CA04 DA01

Claims (3)

[Claims] An electronic component recognizing device that irradiates an electronic component sucked by a suction nozzle with light and recognizes the position of the component based on a reflected image includes a plurality of light sources that emit light upward. An illumination unit disposed at a predetermined interval, and an electronic component having an inclined reflection surface fixed to an upper end of the illumination unit and reflecting light from the light source, and the reflected light being absorbed by the suction nozzle Electronic component recognizing device comprising: a reflecting member for irradiating light to the electronic component. 2. The electronic component recognition device according to claim 1, wherein a limiting portion is provided at an upper end portion of the reflecting member to limit an amount of light reflected from the reflecting surface to a background material. apparatus. 3. The illumination section is formed in a cylindrical shape, and the plurality of light sources are arranged at a predetermined interval on a circumferential portion thereof. 2. The electronic component recognition device according to claim 1, wherein the electronic component recognition device is formed over the circumference.