JP3877495B2 - Electronic component recognition device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component recognition apparatus that irradiates an electronic component sucked by a suction nozzle with light and recognizes the position of the component from a reflected image.
[0002]
[Prior art]
Conventionally, the reflection of the back surface of an electronic component such as a BGA (ball grid array) or CSP (chip size package) in which a part of a hemispherical bump (terminal) protrudes on the bottom surface (back surface). When an image is picked up by a CCD camera and the position of the component is recognized, the emission angle of the LED (from four directions) is set directly so that the projection of the bumps is optimized.
[0003]
[Problems to be solved by the invention]
However, since it is difficult to accurately direct the emission angle, the CCD camera cannot capture a clear image.
[0004]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component recognition apparatus that can supply a balanced light beam to an electronic component, and can be used as illumination with little attenuation of light quantity.
[0005]
[Means for Solving the Problems]
For this reason, the present invention provides a plurality of electronic component recognition apparatuses that irradiate light upwards in an electronic component recognition apparatus that irradiates light to an electronic component that has been attracted and moved by a suction nozzle and recognizes the position of the component from a reflected image. An illumination part in which the light sources are arranged at a predetermined interval, and an inclined reflection surface that is fixed to the upper end part of the illumination part and reflects light from the light source are formed, and the reflected light is adsorbed by the adsorption nozzle. A reflecting member that irradiates the lower surface of the electronic component that has moved , and a limiting portion that is provided at the upper end of the reflecting member and that restricts the amount of light that is reflected from the reflecting surface is irradiated onto the background material. .
[0006]
In the present invention, the limiting portion is bent inward from the reflecting surface and is continuously provided on the reflecting surface .
[0007]
Furthermore, the present invention is such that the illuminating portion is formed in a cylindrical shape and the plurality of light sources are arranged on the circumferential portion at a predetermined interval, and the reflecting member is substantially ring-shaped so that the reflecting surface is entirely formed. It is formed over the circumference.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described below based on the drawings. Reference numeral 1 denotes a suction nozzle for picking up an electronic component 2 of a so-called rotary table type or horizontal movement type electronic component mounting apparatus from a component supply unit or a component supply tray (not shown) and mounting it on a printed circuit board. It is a diffusion plate provided in the nozzle 1. The diffuser plate 3 serves as a background material as described later, but also serves as a reflective diffuser plate for transmission, and a reflective layer (not shown) is provided on the upper surface thereof.
[0009]
Reference numeral 4 denotes a recognition camera (CCD camera) provided at a predetermined position of the electronic component mounting apparatus, which captures a reflection image of the electronic component 2 via a cylindrical illumination unit 5 disposed above the recognition camera. In addition, a large number of, for example, 200 optical fibers 6 (as light sources) are provided at predetermined intervals so as to irradiate light upward to each of the illuminating units 5, and the axial direction thereof is vertically up and down on the circumferential portion thereof. So that it is buried. Although not shown, the multiple optical fibers 6 are bundled and taken out from the side of the illumination unit 5 through a fiber tube, and the end of the optical fiber 6 is supplied with light from a light source (not shown). It is configured to receive. In addition, it may replace with many optical fibers 6, and this may be arrange | positioned in the circumference part of the said illumination part 5 using several LED (Light Emitting Diode), and you may make it irradiate light upwards.
[0010]
7 is a reflective member made of, for example, a stainless material, which is a highly reflective material. The outer shape is generally ring-shaped, the cross-section is generally triangular, and is fixed to the upper end of the illuminating unit 5. An inclined reflecting surface 8 for reflecting the light from 6 is formed over the entire circumference, and the reflected light is applied to the electronic component 2 sucked by the suction nozzle 1. That is, the light from the optical fiber 6 is irradiated from the entire circumference direction mainly on the lower surface (back surface) of the electronic component 2 sucked by the suction nozzle 1 located above the center of the illumination unit 5 when the camera 4 is picked up. Further, the reflecting surface 8 is inclined inward by about 50 degrees.
[0011]
A limiting portion 9 that restricts the amount of light that is reflected from the reflecting surface 8 is applied to the diffusing plate 3 that is a background material is connected to the reflecting surface 8 at the upper end of the reflecting member 7. Yes. That is, the limiting unit 9 is configured to limit the amount of light to the diffusion plate 3 so that the brightness of the diffusion plate 3 is sufficiently darker than that of the bump unit in the same manner as the body unit on the back surface of the electronic component 2.
[0012]
The electronic component 2 is an electronic component in which a part of a plurality of hemispherical bumps 10 (terminals) protrudes from the lower surface (back surface), such as BGA (ball grid array), CSP (chip size package), etc. The reflected image of the lower surface (back surface) of the electronic component is picked up by the recognition camera 4 and the position of the component 2 is recognized. That is, the wiring 12 is connected to the bump 10, but as described above, the wiring 12 does not appear in the recognition camera 4, as described above. Reflected light is applied to the lower surface of the electronic component 2, and the central portion 11 (smaller circle than the bump 10) of each bump 10 becomes a dark image, and its surroundings become a bright image. The position of the electronic component 2 can be recognized.
[0013]
With the above configuration, the operation will be described below. First, the electronic component 2 of the electronic component mounting apparatus is picked up and taken out by the suction nozzle 1 from a component supply unit or a component supply tray (not shown), above the recognition camera 4 and the illumination unit 5 disposed above the recognition camera 4. The light from a large number of optical fibers 6 is applied to the lower surface of the electronic component 2 from the entire circumferential direction.
[0014]
At this time, the light from the optical fiber 6 is reflected by the reflecting surface 8 as shown in FIG. 2, and the reflected light is applied to the lower surface (back surface) of the electronic component 2 sucked by the suction nozzle 1 from obliquely below. Further, the limiting portion 9 of the reflecting member 7 is configured so that the amount of transmitted light of the electronic component 2 through the diffusion plate 3 that is the background material is small and the reflected light of the electronic component 2 through the reflecting surface 8 becomes bright. Is done. Therefore, as shown in FIG. 3, the wiring 12 connected to the bump 10 and the missing bump 13 are not reflected in the recognition camera 4, and the central portion 11 of each bump 10 (smaller circle than the bump 10) is dark. It becomes an image and its surroundings become a bright image, the position of the arbitrary bump 10 can be accurately recognized, and the position of the electronic component 2 is recognized.
[0015]
When the electronic component 2 is subsequently mounted, the amount of movement of the suction nozzle 1 and / or the amount of movement of the printed circuit board is corrected by the amount of deviation, and the electronic component 2 is accurately mounted on the printed circuit board.
[0016]
【The invention's effect】
As described above, according to the present invention, there is provided an electronic component recognizing device that can supply light beams that are well balanced to the lower surface of an electronic component that has been moved by being sucked by a suction nozzle, and can be used as illumination with little attenuation of light quantity. Can be provided. In addition, the reflected image of the electronic component becomes clear and a more accurate position can be recognized. Furthermore, because the limiting unit is configured so that the amount of transmitted light of the electronic component through the background material is small and the reflected light of the electronic component through the reflective surface becomes bright, particularly in an electronic component having a bump, The wiring connected to the bumps and the missing bumps are not reflected in the recognition camera, and the center of each bump becomes a dark image and the surrounding area becomes a bright image, so that the position of any bump can be recognized accurately. The exact position of the electronic component can be recognized.
[Brief description of the drawings]
FIG. 1 is a side view of an electronic component recognition apparatus according to the present invention.
FIG. 2 is a side view of a main part in which only a reflecting member of an illumination unit is vertically cut.
FIG. 3 is a diagram illustrating an image obtained by imaging an electronic component.
[Explanation of symbols]
1 Adsorption nozzle 2 Electronic component 3 Diffusion plate (background material)
4 Recognition Camera 5 Illumination Unit 6 Optical Fiber 7 Reflecting Member 8 Reflecting Surface 9 Limiting Unit 10 Bump

Claims (3)

In an electronic component recognition apparatus that irradiates light to an electronic component that has been attracted and moved by a suction nozzle and recognizes the position of the component by a reflected image, a plurality of light sources are arranged at predetermined intervals so as to irradiate light upward. And an electronic part that has been moved by being adsorbed by the suction nozzle and formed with an inclined reflection surface that is fixed to the upper end of the illumination part and reflects light from the light source. An electronic component recognition apparatus comprising: a reflecting member that irradiates a lower surface ; and a limiting unit that is provided at an upper end portion of the reflecting member and restricts the amount of light that is reflected from the reflecting surface to the background material . The electronic component recognition apparatus according to claim 1, wherein the restricting portion is bent inward from the reflecting surface and is continuously provided on the reflecting surface .   The illumination part is formed in a cylindrical shape, and the plurality of light sources are arranged on the circumferential part with a predetermined interval, and the reflection member is formed in a ring shape to form the reflection surface over the entire circumference. The electronic component recognition apparatus according to claim 1, wherein

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