JP3695112B2 - Electronic component observation apparatus and electronic component observation method - Google Patents

Electronic component observation apparatus and electronic component observation method Download PDF

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Publication number
JP3695112B2
JP3695112B2 JP00199898A JP199898A JP3695112B2 JP 3695112 B2 JP3695112 B2 JP 3695112B2 JP 00199898 A JP00199898 A JP 00199898A JP 199898 A JP199898 A JP 199898A JP 3695112 B2 JP3695112 B2 JP 3695112B2
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Prior art keywords
electronic component
bump
light
observation apparatus
component observation
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JPH11205000A (en
Inventor
惠介 藤代
浩 村田
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、バンプ付の電子部品の観察を行う電子部品観察装置および電子部品観察方法に関するものである。
【０００２】
【従来の技術】
電子部品を回路基板に実装する際に、電子部品の位置ずれを補正して実装時の位置精度を向上させる方法として、電子部品観察装置を用いる方法が知られている。この方法は、移載ヘッドに保持された電子部品をカメラで撮像し、画像処理によって電子部品の形状や位置を認識し、実装時の位置ずれ補正に必要な補正量を求めるものである。
【０００３】
ところでＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）などのバンプ付の電子部品について、上述の位置認識を行う場合には、従来のリード付電子部品のような電子部品の本体の外形や本体から延出したリードの位置を求める場合と異り、電子部品の下面に形成された半田バンプが光学的に認識する対象となる。このようなバンプ付の電子部品を観察する電子部品観察装置として、複数のＬＥＤを備えた照明部を有するものが使用されている（特開平８−１５３９９７号公報）。
【０００４】
以下、従来の電子部品観察装置の照明部について図５を参照して説明する。図５は従来の電子部品観察装置の照明部の断面図である。図５において、バンプ付の電子部品１の下面にはバンプ２が形成されている。電子部品１は移載ヘッド（図外）に保持されて、照明部３の上方に位置している。照明ユニット３は本体ブロック４の上面に台形状断面の凹部４ａを設け、凹部４ａの斜面に多数のＬＥＤ５を配置したものである。ＬＥＤ５から発光された光は電子部品１を斜め下方から照明し（矢印ａ）、カメラ６により本体ブロック４の開口部４ｂを介して電子部品４の下面を撮像する。
【０００５】
【発明が解決しようとする課題】
しかしながら、上記従来の照明部３には、下記のような問題点があった。まず、照明対象の電子部品１の半田バンプ２を、所望の斜め下方の角度から照明するためにＬＥＤ５を斜面上に配置していることにより、照明部３全体の径方向の寸法が大きくなり、コンパクト化が難しいことである。また本体ブロック４に台形状の凹部を加工し、その斜面をＬＥＤ５の取付面としていたため、本体ブロックの部品加工やＬＥＤを取り付ける作業などで組立に工数を要し、コストアップの要因となっていた。このように従来のバンプ付の電子部品を対象とした電子部品観察装置では、照明部の構造に由来してコンパクト化、低コスト化が難しいという問題点があった。
【０００６】
そこで本発明は、コンパクト化、低コスト化を図ることができる電子部品観察装置を提供することを目的とする。
【０００７】
【課題を解決するための手段】
請求項１記載の電子部品観察装置は、略球状の金属のバンプが形成されたバンプ付の電子部品のバンプ面を撮像するカメラと、前記撮像時にバンプ面を照明する照明部と、この撮像データに基づき前記バンプの位置を認識する認識部とを備え、前記照明部が、ケースと、このケースの内部に円環状に並列状態で配列された複数のＬＥＤと、これらのＬＥＤの上方にあってＬＥＤの光を集光して同一方向に照射する円環部材と、この円環部材によって集光された光を反射して前記バンプに対して特定方向から照射する反射手段を備え、前記反射手段が前記ケースの上部の内面を鏡面仕上げした逆すり鉢状の傾斜面である。
【０００８】
請求項２記載の電子部品観察方法は、請求項１記載の電子部品観察装置を用いて略球状の金属のバンプが形成されたバンプ付の電子部品のバンプ面をカメラで撮像し、撮像データに基づき認識部により前記バンプの位置を認識する電子部品観察方法であって、前記撮像時に、円環状に並列状態で配列された前記複数のＬＥＤから発光された光を前記集光手段により同一方向に集光し、この集光された光を前記反射手段によって反射し、前記バンプに対して特定方向から照射するようにした。
【０００９】
本発明によれば、複数のＬＥＤにより発光された光を集光手段により同一方向に集光し、この集光された光を反射手段によって反射してバンプに対して特定方向から照射することにより、照明部を小型化、低コスト化することができるとともに、バンプの形状や位置を特定する画像を確実に撮像することができる。
【００１０】
【発明の実施の形態】
次に本発明の実施の形態を図面を参照して説明する。図１は本発明の一実施の形態の電子部品観察装置の全体構成図、図２（ａ）は同電子部品観察装置の照明部の断面図、図２（ｂ）は同電子部品観察装置の照明部の部分斜視図、図３は同電子部品観察装置の電子部品の部分拡大図、図４は同電子部品観察装置の画像図である。
【００１１】
まず図１を参照して電子部品観察装置の構成を説明する。図１において、トレー１１に収納されている電子部品１は、移載ヘッド駆動部１４によって駆動される移載ヘッド１３のノズル１２によりピックアップされて照明部２０の上方へ水平移動し（矢印Ｎ１）、そこでカメラ３０により下面のバンプ２が撮像される。その後電子部品１は移載ヘッド１３により基板１５上へ移載される（矢印Ｎ２）。
【００１２】
次に認識部３１について説明する。カメラ３０によって得られた撮像データはＡ／Ｄ変換器によってＡ／Ｄ変換され、画像メモリ３３に格納される。この撮像データはＣＰＵ３４に読み出されて画像処理され、バンプ２の位置が認識され、その結果はメモリ３５に格納される。また、ＣＰＵ３４は、主制御部３６によって制御される。
【００１３】
次に照明部２０について図２（ａ），（ｂ）を参照して説明する。図２（ａ），（ｂ）において、円筒状のケース２１はアルミなどの金属により製作され、上部の内面が逆すり鉢状の傾斜面２１ａとなっており、傾斜面２１ａは鏡面仕上げされている。ケース２１の内部のＬＥＤ２４の上方には、２つの円環部材２２，２３が同軸的に嵌着され、円環部材２２と円環部材２３の隙間の下方には、ＬＥＤ２４が円環状の基板２５上に等間隔に並列の垂直姿勢で円環状に配列されている。ＬＥＤ２４から発光された光は、ＬＥＤ２４の上方の円環部材２２，２３の隙間に導かれて上方に集光される。したがって円環部材２２、２３はＬＥＤ２４の光を同一方向に集光する集光手段となっている。なお、集光手段としては上記に限定されず、例えば、透明体で形成される１つの円環部材をＬＥＤ２４の直上に位置させるものであっても良い。この場合、透明体の側面にアルミ蒸着等で反射膜を形成して反射率を上げたものを使用することにより、更に優れた集光効果を得ることができる。
【００１４】
この集光された光は反射面としての傾斜面２１ａによって反射される。したがって、傾斜面２１ａの傾斜角θを適切に設定することにより、電子部品１のバンプ２に入射する照明光（矢印ｂ）の入射方向を所望の特定方向に設定することができる。照明部２０をこのような構造とすることにより、多数のＬＥＤ２４を並列姿勢で配列することができるため、ケース２１の径を小さくして、照明部２０の小型・コンパクト化を図ることができる。また、ＬＥＤ２４は基板２５に実装された状態で照明部２０に一括して装着されるため、照明部２０の組立工数を削減することができ、低コスト化が実現される。
【００１５】
この電子部品観察装置は上記のように構成され、次に電子部品観察方法について説明する。まず図１において、主制御部３６によって移載ヘッド駆動部１４を制御して、電子部品１を照明部２０の上方に位置させる。そして図２においてＬＥＤ２４を発光させて電子部品１のバンプ２を照明する。このときの照明光の入射状態およびその結果得られる画像について図３、図４を参照して説明する。
【００１６】
図３に示すように、バンプ２に対して斜め下方の特定方向から入射する照明光（矢印ｃで示す）は、バンプ２の表面が略半球状の曲面であるため、各入射点Ｐ１，Ｐ２，Ｐ３，Ｐ４によって異った方向に反射される。これらのうち、入射点Ｐ１，Ｐ２，Ｐ４からの反射光（矢印ｄ，ｅ，ｇ参照）はカメラ３０と異なる方向に反射されカメラ３０によって受光されず、入射点Ｐ３を挟んだある幅（鎖線で示す）の範囲からの反射光のみが下方に反射されてカメラ３０に受光される。なお、図３は一断面のみを示すものであり、実際にはバンプ２は全周方向から照明されており、図３において鎖線で示す幅の範囲の各点からの反射光がカメラ３０によって受光される。
【００１７】
このような照明光によって撮像されたバンプ２は、図４に示す斜線部の部分を明像２’とする円環状の画像として表れる。すなわち、画像上でこのような特定された形状の明像部分を得ることにより、バンプ２の位置を認識することができる。この明像の形状は、電子部品１の下面に存在する異物などにより発生する画像上のノイズと明瞭に区別されるため、精度のよい位置認識を行うことができる。
【００１８】
こうしてバンプ２の位置が認識され、この認識結果に基づいてバンプ２の位置ずれ量が検出される。その後電子部品１は基板１５上に移動し、移載ヘッド１３の駆動を前記位置ずれ量だけ補正した後に基板１５に移載される。
【００１９】
【発明の効果】
本発明によれば、複数のＬＥＤにより発光された光を集光手段により同一方向に集光し、この集光された光を反射手段によって反射してバンプに対して特定方向から照射することにより、バンプを特定する画像を確実に撮像することができる。また複数のＬＥＤを並列状態で配列することができるため、ＬＥＤの装着スペースが小さい簡単な構造が実現でき、照明部を小型化、低コスト化することができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態の電子部品観察装置の全体構成図
【図２】（ａ）本発明の一実施の形態の電子部品観察装置の照明部の断面図
（ｂ）本発明の一実施の形態の電子部品観察装置の照明部の部分斜視図
【図３】本発明の一実施の形態の電子部品観察装置の電子部品の部分拡大図
【図４】本発明の一実施の形態の電子部品観察装置の画像図
【図５】従来の電子部品観察装置の照明部の断面図
【符号の説明】
１ 電子部品
２ バンプ
２０ 照明部
２１ ケース
２２、２３ 円環部材
２４ ＬＥＤ
２５ 基板
３０ カメラ
３１ 認識部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component observation apparatus and an electronic component observation method for observing electronic components with bumps.
[0002]
[Prior art]
A method of using an electronic component observation apparatus is known as a method for correcting positional displacement of an electronic component to improve the positional accuracy during mounting when mounting the electronic component on a circuit board. In this method, an electronic component held by a transfer head is imaged by a camera, the shape and position of the electronic component are recognized by image processing, and a correction amount necessary for correction of misalignment at the time of mounting is obtained.
[0003]
By the way, when the above-mentioned position recognition is performed for an electronic component with a bump such as a BGA (Ball Grid Array), the outer shape of the main body of the electronic component such as a conventional electronic component with a lead and the position of the lead extending from the main body. Unlike the case of obtaining the above, the solder bump formed on the lower surface of the electronic component is an object to be optically recognized. As an electronic component observation apparatus for observing such an electronic component with a bump, an apparatus having an illumination unit including a plurality of LEDs is used (Japanese Patent Laid-Open No. Hei 8-153997).
[0004]
Hereinafter, the illumination part of the conventional electronic component observation apparatus will be described with reference to FIG. FIG. 5 is a cross-sectional view of an illumination unit of a conventional electronic component observation apparatus. In FIG. 5, bumps 2 are formed on the lower surface of the electronic component 1 with bumps. The electronic component 1 is held by a transfer head (not shown) and is located above the illumination unit 3. The illumination unit 3 is provided with a concave portion 4a having a trapezoidal cross section on the upper surface of a main body block 4, and a large number of LEDs 5 are arranged on the slope of the concave portion 4a. The light emitted from the LED 5 illuminates the electronic component 1 obliquely from below (arrow a), and the camera 6 images the lower surface of the electronic component 4 through the opening 4 b of the main body block 4.
[0005]
[Problems to be solved by the invention]
However, the conventional illumination unit 3 has the following problems. First, by arranging the LED 5 on the slope in order to illuminate the solder bump 2 of the electronic component 1 to be illuminated from a desired obliquely lower angle, the radial dimension of the entire illumination unit 3 is increased. It is difficult to make it compact. In addition, since the trapezoidal concave portion is machined in the main body block 4 and its slope is used as the mounting surface of the LED 5, it takes man-hours for assembling the parts of the main body block and the work of attaching the LED, which is a factor of cost increase. It was. As described above, the conventional electronic component observation apparatus for bumped electronic components has a problem that it is difficult to reduce the size and cost due to the structure of the illumination unit.
[0006]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component observation apparatus that can be reduced in size and cost.
[0007]
[Means for Solving the Problems]
The electronic component observation apparatus according to claim 1, a camera that images a bump surface of an electronic component with a bump on which a substantially spherical metal bump is formed, an illumination unit that illuminates the bump surface during the imaging, and the imaging data A recognizing unit for recognizing the position of the bump based on the case, and the lighting unit is above the case, a plurality of LEDs arranged in a ring in parallel inside the case, and above the LEDs. An annular member for condensing the LED light and irradiating it in the same direction; and a reflecting means for reflecting the light collected by the annular member and irradiating the bump from a specific direction , the reflecting means Is an inverted mortar-shaped inclined surface in which the inner surface of the upper part of the case is mirror-finished .
[0008]
According to a second aspect of the present invention, there is provided an electronic component observation method in which a bump surface of a bumped electronic component on which a substantially spherical metal bump is formed is imaged with a camera using the electronic component observation apparatus according to the first aspect. an electronic component observation method recognizes the position of the bump by the recognition unit based, at the imaging, the light emitted from the plurality of LED arranged in juxtaposition annularly same direction by said condensing means condensed, it reflects the collected light by the reflecting means and to irradiate from a specific direction with respect to the bumps.
[0009]
According to the present invention, the light emitted from the plurality of LEDs is condensed in the same direction by the condensing means, and the condensed light is reflected by the reflecting means and irradiated to the bumps from a specific direction. The illumination unit can be reduced in size and cost, and an image for specifying the shape and position of the bump can be reliably captured.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an overall configuration diagram of an electronic component observation apparatus according to an embodiment of the present invention, FIG. 2A is a cross-sectional view of an illumination unit of the electronic component observation apparatus, and FIG. FIG. 3 is a partial enlarged view of an electronic component of the electronic component observation apparatus, and FIG. 4 is an image view of the electronic component observation apparatus.
[0011]
First, the configuration of the electronic component observation apparatus will be described with reference to FIG. In FIG. 1, the electronic component 1 housed in the tray 11 is picked up by the nozzle 12 of the transfer head 13 driven by the transfer head drive unit 14 and horizontally moves above the illumination unit 20 (arrow N1). Therefore, the lower bump 2 is imaged by the camera 30. Thereafter, the electronic component 1 is transferred onto the substrate 15 by the transfer head 13 (arrow N2).
[0012]
Next, the recognition unit 31 will be described. Imaging data obtained by the camera 30 is A / D converted by the A / D converter and stored in the image memory 33. This imaged data is read out by the CPU 34 and subjected to image processing, the position of the bump 2 is recognized, and the result is stored in the memory 35. The CPU 34 is controlled by the main control unit 36.
[0013]
Next, the illumination part 20 is demonstrated with reference to FIG. 2 (a), (b). 2A and 2B, the cylindrical case 21 is made of a metal such as aluminum, and the upper inner surface is an inverted mortar-shaped inclined surface 21a, and the inclined surface 21a is mirror-finished. . The LED24 over the inner portion of the case 21, two annular members 22, 23 are coaxially fitted, below the gap annular member 22 and the circular member 23, the substrate LED24 is annular 25 are arranged in an annular shape in a vertical posture in parallel at equal intervals. The light emitted from the LED 24 is guided to the gap between the annular members 22 and 23 above the LED 24 and condensed upward. Therefore, the annular members 22 and 23 are condensing means for condensing the light of the LED 24 in the same direction. In addition, as a condensing means, it is not limited to the above, For example, you may position one annular member formed with a transparent body directly on LED24. In this case, a further excellent light collecting effect can be obtained by using a transparent body that has a reflective film formed on the side surface of the transparent body by vapor deposition or the like to increase the reflectance.
[0014]
The condensed light is reflected by the inclined surface 21a as a reflecting surface. Therefore, by appropriately setting the inclination angle θ of the inclined surface 21a, the incident direction of the illumination light (arrow b) incident on the bump 2 of the electronic component 1 can be set to a desired specific direction. With the illumination unit 20 having such a structure, a large number of LEDs 24 can be arranged in a parallel posture, so that the diameter of the case 21 can be reduced, and the illumination unit 20 can be reduced in size and size. Further, since the LEDs 24 are mounted on the illumination unit 20 in a state of being mounted on the substrate 25, the number of assembling steps of the illumination unit 20 can be reduced, and the cost can be reduced.
[0015]
This electronic component observation apparatus is configured as described above. Next, an electronic component observation method will be described. First, in FIG. 1, the transfer head driving unit 14 is controlled by the main control unit 36 to place the electronic component 1 above the illumination unit 20. In FIG. 2, the LED 24 emits light to illuminate the bumps 2 of the electronic component 1. The incident state of the illumination light and the resulting image will be described with reference to FIGS.
[0016]
As shown in FIG. 3, illumination light (indicated by an arrow c) incident on the bump 2 from a specific direction obliquely below has a substantially hemispherical curved surface. , P3 and P4 are reflected in different directions. Among these, the reflected light (see arrows d, e, and g) from the incident points P1, P2, and P4 is reflected in a direction different from that of the camera 30 and is not received by the camera 30, and has a certain width (dashed line) across the incident point P3. Only the reflected light from the range (shown in FIG. 4) is reflected downward and received by the camera 30. FIG. 3 shows only one cross section. Actually, the bump 2 is illuminated from the entire circumference, and reflected light from each point in the range of the width shown by the chain line in FIG. Is done.
[0017]
The bump 2 imaged by such illumination light appears as an annular image in which the hatched portion shown in FIG. 4 is a bright image 2 ′. That is, the position of the bump 2 can be recognized by obtaining a bright image portion having such a specified shape on the image. Since the shape of the bright image is clearly distinguished from the noise on the image generated by a foreign matter or the like existing on the lower surface of the electronic component 1, accurate position recognition can be performed.
[0018]
In this way, the position of the bump 2 is recognized, and the positional deviation amount of the bump 2 is detected based on the recognition result. Thereafter, the electronic component 1 moves onto the substrate 15 and is transferred onto the substrate 15 after correcting the driving of the transfer head 13 by the amount of displacement.
[0019]
【The invention's effect】
According to the present invention, the light emitted from the plurality of LEDs is condensed in the same direction by the condensing means, and the condensed light is reflected by the reflecting means and irradiated to the bumps from a specific direction. Thus, it is possible to reliably capture an image specifying the bump. In addition, since a plurality of LEDs can be arranged in parallel, a simple structure with a small LED mounting space can be realized, and the illumination unit can be reduced in size and cost.
[Brief description of the drawings]
FIG. 1 is an overall configuration diagram of an electronic component observation apparatus according to an embodiment of the present invention. FIG. 2 (a) is a cross-sectional view of an illumination unit of the electronic component observation apparatus according to an embodiment of the present invention. FIG. 3 is a partial perspective view of an illumination part of the electronic component observation apparatus according to the embodiment of the present invention. FIG. 3 is a partial enlarged view of the electronic component of the electronic component observation apparatus according to the embodiment of the present invention. Fig. 5 is a cross-sectional view of an illumination part of a conventional electronic component observation apparatus.
DESCRIPTION OF SYMBOLS 1 Electronic component 2 Bump 20 Illumination part 21 Case 22, 23 Ring member 24 LED
25 Substrate 30 Camera 31 Recognition unit

Claims (2)

略球状の金属のバンプが形成されたバンプ付の電子部品のバンプ面を撮像するカメラと、前記撮像時にバンプ面を照明する照明部と、この撮像データに基づき前記バンプの位置を認識する認識部とを備え、前記照明部が、ケースと、このケースの内部に円環状に並列状態で配列された複数のＬＥＤと、これらのＬＥＤの上方にあってＬＥＤの光を集光して同一方向に照射する円環部材と、この円環部材によって集光された光を反射して前記バンプに対して特定方向から照射する反射手段を備え、前記反射手段が前記ケースの上部の内面を鏡面仕上げした逆すり鉢状の傾斜面であることを特徴とする電子部品観察装置。A camera for imaging a bump surface of an electronic component with a bump on which a substantially spherical metal bump is formed, an illumination unit for illuminating the bump surface during the imaging, and a recognition unit for recognizing the position of the bump based on the imaging data And the lighting unit includes a case, a plurality of LEDs arranged in parallel in an annular shape inside the case, and the LED light above the LEDs and condensing the light of the LEDs in the same direction. An irradiating annular member and a reflecting means for reflecting the light collected by the annular member and irradiating the bump from a specific direction are provided , and the reflecting means mirror-finishes the upper inner surface of the case An electronic component observation apparatus characterized by being an inverted mortar-shaped inclined surface . 請求項１記載の電子部品観察装置を用いて略球状の金属のバンプが形成されたバンプ付の電子部品のバンプ面をカメラで撮像し、撮像データに基づき認識部により前記バンプの位置を認識する電子部品観察方法であって、前記撮像時に、円環状に並列状態で配列された前記複数のＬＥＤから発光された光を前記集光手段により同一方向に集光し、この集光された光を前記反射手段によって反射し、前記バンプに対して特定方向から照射することを特徴とする電子部品観察方法。A bump surface of a bumped electronic component on which a substantially spherical metal bump is formed is imaged with a camera using the electronic component observation apparatus according to claim 1, and the position of the bump is recognized by a recognition unit based on the imaging data. an electronic component observation method, during the imaging, focused in the same direction the light emitted from the plurality of LED arranged in juxtaposition to the ring by the condensing means, the condensed light A method of observing an electronic component, wherein the electronic device is reflected by the reflecting means and irradiates the bump from a specific direction.
JP00199898A 1998-01-08 1998-01-08 Electronic component observation apparatus and electronic component observation method Expired - Fee Related JP3695112B2 (en)

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