JP2948488B2 - Solder appearance inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering visual inspection apparatus for inspecting a soldering state of an electronic component or a discrete component mounted on a substrate.

[0002]

2. Description of the Related Art Conventionally, as an inspection apparatus of this type, a light is radiated from a lighting device arranged at an appropriate position to an inspection target such as a soldered portion of an electronic component, and reflected light at the inspection target is emitted. For example, there is a method of taking an image with a camera such as a CCD (Charge Coupled Device) camera having an axis perpendicular to the substrate. The captured reflected light is grasped as the illuminance distribution of the inspection target portion, so that the external shape of the soldered portion can be recognized. Then, by comparing the illuminance distribution grasped in this way with, for example, the illuminance distribution of a non-defective product, the quality of the soldered portion can be determined.

[0003] Further, as the above-mentioned illuminating device, for example, as disclosed in Japanese Patent Application Laid-Open No. 1-282410, three ring-shaped light-emitting bodies of different diameters each emitting red light, green light and blue light are used. There is something. These light emitters are fixed to the CCD camera with their axes aligned and spaced apart in the axial direction.

According to this illuminating device, the light from each illuminant is made to enter the inspection target at a different angle, so that the light is applied to a curved inspection target such as a soldered portion. In this case, the light is reflected by the CCD camera as reflected light from a different region of the inspection target portion.

[0005]

In the inspection apparatus as described above, the inspection is performed by changing the magnification of the camera in accordance with the size of the inspection range and the difference in the type of the soldered portion to be inspected. It is necessary to do. Methods for changing the magnification of the camera include a method using a zoom lens and a method of preparing a plurality of cameras having different magnifications. However, when a zoom lens is used, it is usually difficult to adjust the amount of light, and there is a problem that an image taken by a camera becomes uneven and an unclear image tends to be formed.

When preparing a plurality of cameras,
Although the above inconvenience is avoided, it is necessary to dispose the illumination device for each camera, which may result in an increase in the size of the inspection device and an increase in product cost. In particular, if the inspection apparatus is of a type that inspects a plurality of soldered parts by moving a camera with respect to a fixed substrate, the weight of the movable part increases with the increase in the number of cameras and lighting devices, and the controllability increases. Therefore, the positioning time and the positioning accuracy will be reduced.

Further, in the case of a lead of an IC component, particularly, a lead which is bent in a J-shape below the IC component main body (so-called J lead), a CCD camera having an axis arranged in the normal direction of the substrate is used. In addition, it is difficult to collect reflected light so that the external shape of the soldered portion can be recognized. That is, as shown in FIG. 9, in the case of shooting the soldering portion 2 of the outer J lead 1 by the CCD camera arranged on the extension of the straight portion 1a of the J lead 1, the light L ₁ from the illumination device The reflected light L _{2 at the} soldered portion 2 is blocked by the straight portion 1 a of the J lead 1 itself.

To avoid such inconveniences, C
It is conceivable to arrange the CD camera so as to avoid interference between the linear portion 1a of the J lead 1 and the optical axis to the CCD camera by inclining the CD camera with respect to the normal line of the substrate 3. However, in the IC component 4, the J lead 1 is often arranged in two or four directions. In such a case,
C in a direction in which the soldered portion 2 of each J lead 1 can be effectively inspected.
The CD camera had to be set up sequentially, which was inconvenient.

When the soldering portion 2 of the J lead 1 is inspected, even if the photographing direction of the CCD camera is set to a desired position in accordance with the direction of the J lead 1, lighting device all J that the biasing unit 2 irradiates the light L ₁
When those single the lead 1, comprising a light L ₁ having a sufficient amount of light is difficult to irradiate each J-lead 1. As a result, the image taken by the CCD camera becomes unclear. Furthermore, there is a light source that is not used for each J lead 1, which may cause a disadvantage that the size of the lighting device is increased.

[0010] Here, a fluorescent lamp and a light emitting diode (hereinafter abbreviated as LED) are considered as a light source of the illuminating device. When a fluorescent lamp is employed, the outer diameter becomes large. In addition, there is an inconvenience that frequent maintenance work is required because the life is short. For this reason, it is desirable to use such an inconvenient LED as a light source.

However, the maximum brightness of an LED alone is limited, and it is necessary to secure a large installation space. For this reason, if the LEDs are arranged to constitute a single illuminating device capable of providing illumination to all the J-leads, there is a disadvantage that the illuminating device eventually becomes large.
In addition, the distance of the light source from the inspection target location increases, and the amount of light at the inspection target location decreases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described circumstances, and aims at reducing the size and weight of an illumination device and providing a light source having an optimal direction and light amount according to a portion to be inspected with a simple configuration. It is another object of the present invention to provide a soldering appearance inspection apparatus capable of realizing, at the same time, determining whether a part to be inspected such as a soldered portion of a J-lead is good or not.

[0013]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention is an apparatus for inspecting a soldering state of an electronic component or the like mounted on a board, and obtains an image of a portion to be inspected. An imaging device, comprising: a determination device that determines the quality of a soldering state based on a taken image; and the illumination device that irradiates the imaging device with light toward a portion to be inspected; and an imaging unit having a camera for capturing the reflected light in the inspection target portion of the light, and moving means for causing relative movement in a direction intersecting the axis of the camera to these means, the illumination means, the imaging means To
There has been proposed a soldering visual inspection device including a plurality of types of light sources in a relative movement direction .

In the above-mentioned soldering appearance inspection apparatus, it is effective if the imaging means is provided with a plurality of cameras having different magnifications in the direction of relative movement with respect to the illumination means .

Further, in the above solder appearance inspection apparatus, the imaging means includes a camera for photographing the reflected light at the inspection target portion, a refraction member disposed between the camera and the inspection target portion for refracting the reflected light, Refraction member rotating means for rotating the refraction member around the axis of the camera; illumination means including a light source for irradiating light to a portion to be inspected from a direction inclined with respect to the camera axis; Alternatively, the illumination means may be configured to include illumination rotation means for rotating the illumination means around the axis of the camera.

[0016]

According to the soldering visual inspection device of the present invention, the image of the inspection target portion is collected by the operation of the imaging device.
By the operation of the determination device, the quality of the soldered state is determined from the image. In the imaging device, light emitted from the illumination unit is reflected at the inspection target location, and an image is collected by capturing the reflected light with the imaging unit. In this case, the illumination unit and the imaging unit are relatively moved in a direction intersecting the axis of the camera by the operation of the moving unit. Accordingly, it is possible to arrange the position of the illumination unit with respect to the imaging unit at an optimum position for capturing an image.

[0017] In the above soldering appearance inspection apparatus,
If the imaging means is provided with a plurality of cameras having different magnifications in the direction of relative movement with respect to the lighting means, the lighting means can be shared by the plurality of cameras. This makes it possible to appropriately set the illumination means for each camera by operating the moving means.

Further, in the above-mentioned soldering appearance inspection apparatus, if the illumination means is provided with a plurality of types of light sources in the direction of relative movement with respect to the imaging means, the operation of the movement means causes each inspection to be performed on the imaging means. An optimal light source for inspection of a target portion can be appropriately selected.

According to the third aspect of the present invention, the illumination means is rotated around the axis of the camera by the operation of the moving means. Since the illuminating means is provided with the light source so as to emit light from a direction inclined with respect to the axis of the camera, the light is emitted from the light source set at an angle optimal for the inspection of the inspection target portion. Then, the irradiated light is reflected at the inspection target location.

In this case, of the reflected light, the reflected light reflected in the predetermined inclination angle direction is refracted by the refraction member and photographed by the camera. The refraction member is rotated about the axis of the camera by the operation of the refraction member rotation means, and refracts reflected light from an arbitrary radiation direction about the axis of the camera toward the camera. As a result, it is possible to photograph the inspection target portion from a direction inclined with respect to the axis without changing the angle of the axis of the camera, and to perform the inspection in an optimal state using the light from the light source to the maximum. It becomes possible to collect an image of the target location.

Thus, it is possible to avoid photographing the inspection target portion from directly above the electronic component mounted on the board, and to reliably and clearly capture the inspection target portion disposed between the electronic component and the board. It is possible to do. As a result, the determination of the quality of the soldered state is made reliable.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a soldering visual inspection apparatus according to the present invention will be described below with reference to FIGS. As shown in FIG. 1, a soldering appearance inspection device 10 according to the present embodiment includes an imaging device 12 mounted on a gantry 11 and a soldering state at a location to be inspected based on an image taken by the imaging device 12. And a judging device 13 for judging pass / fail.

The imaging device 12 has a transport mechanism 16 for mounting a substrate 15 on which electronic components 14 are mounted and moving it in two horizontal directions, and a space above the substrate 15 mounted on the transport mechanism 16 The lighting unit 17 includes an illuminating unit 17 disposed, an imaging unit 18 disposed above the illuminating unit 17, and a moving unit 19 for moving the illuminating unit 17 in a horizontal direction.

The transport mechanism 16 comprises a slider 20 for mounting the substrate 15 in a positioning state, and a linear moving mechanism 21 for displacing the slider 20 in two orthogonal horizontal directions, for example, the X direction and the Y direction. I have. As shown in FIG. 1, the linear movement mechanism 21
Slider 22 arranged at a parallel interval below the middle
And two sets of guide rails 23 and 24 disposed above and below the intermediate slider 22, ball screws 25 and 26, and servomotors 27 and 28. The guide rails 23 and 24 and the ball screws 25 and 26 are arranged so as to be orthogonal to the X and Y directions.
Nos. 7 and 28 can rotate the ball screws 25 and 26 to which the servomotors 27 and 28 are connected around their axes.

As shown in FIG. 2, for example, the illumination means 17 includes a plurality of LEDs 3 inside a disk-shaped cap member 29.
0 are arranged, and a disc-shaped smoke plate 31 made of, for example, a translucent milky white glass is provided below the 0. The peripheral edge portion of the shade member 29, the diffusion reflective plate 32 is provided over the entire circumference, the inspection target portion are disposed radially inwardly with diffuse light L ₁ emitted from each LED30 It is made to reflect toward.

The cap member 29 and the smoke plate 3
The through holes 29a and 31a are respectively provided at the center of 1. The through-holes 29a · 31a is reflected light L ₂ from the soldering portion 33 of the inspection target portion serving electronic components 14 on the board 15 is provided to transmit upwards, passed through the through holes 29a · 31a The reflected light L ₂ is photographed by the imaging means 18 disposed above the illumination means 17.

The image pickup means 18 is constituted, for example, by arranging two CCD cameras 18a and 18b having axes in the vertical direction at a parallel interval in the horizontal direction. In FIG. 1, reference numerals 18c and 18d denote lenses. These CCD cameras 18a and 18b are set at different magnifications so that the photographing ranges on the substrate 15 can be made different. Each of the CCD cameras 18a and 18b is set to be in an optimum exposure state.

The moving means 19 includes, for example, the lighting means 1.
7, a mounting rod 19b fixed to the mounting plate 19a, a horizontal support rod 19b fixed to the mounting plate 19a,
A guide bearing 19c is slidably fitted to the outside and fixed to the gantry 11, and a cylinder 34 is also fixed to the gantry 11 and has the tip of a cylinder rod 34a fixed to the mounting plate 19a. The support rod 19
b and the cylinder 34, the CCD camera 18a
8b are provided along the arrangement direction.

As a result, when the cylinder 34 is operated, the cylinder rod 34a is moved to the CCD camera 18a / 1.
8b along the arrangement direction of the mounting plate 1b.
9a and illumination means 1 fixed to the mounting plate 19a
7 is moved in the arrangement direction of the CCD cameras 18a and 18b. That is, the illuminating means 17 arranged below one CCD camera 18a is arranged below the other CCD camera 18b by the operation of the cylinder 34, and one of the two CCD cameras 18a and 18b becomes one. The lighting means 17 can be shared.

When the soldering portion 33 of the electronic component 14 mounted on the board 15 is to be inspected by the soldering visual inspection apparatus 10 of the present embodiment having the above-described configuration, first, the transporting means 16 is operated. Slider 2 on which the substrate 15 is mounted
0 is disposed below the CCD camera 18a and the illumination means 17. And, while activating the lighting means 17,
Actuating the imaging means 18, the reflected light L ₂ of the light L ₁ irradiated to the inspection target portion from the illuminating means 17 captured by the CCD camera 18a.

Next, the collected image is transferred to the determination device 13 and subjected to appropriate image processing. For example, the image is compared with an image of a non-defective soldered portion, so that the soldered portion 33 of the inspection target portion is inspected. Pass / fail judgment is made. When photographing is performed by another CCD camera 18b having a different magnification, the transport unit 16 is operated to place the inspection target portion of the substrate 15 below the CCD camera 18 and the moving unit 19 is operated. As shown by a chain line in FIG. 3, the illuminating means 17 is moved and disposed between the CCD camera 18b and the inspection target portion.

[0032] Thus, the CCD camera 18b, the reflected light L ₂ in the inspection target portion of the irradiated light L ₁ from the illumination means 17 is captured, and transfers the image to the determination unit 13 as above The soldering state 3
3 is easily determined.

Therefore, according to the soldering appearance inspection apparatus 10 according to the present embodiment, the single illuminating means 17 is shared for photographing by the two CCD cameras 18a and 18b having different magnifications. The installation space can be saved, and the size and weight of the imaging device 10 can be reduced.
Also, two CCD cameras 1 with optimal exposure adjustment
Since images are taken by 8a and 18b, a clearer image can be obtained as compared with the conventional case in which the magnification is changed by a zoom lens, and the quality of the soldered portion 33 can be accurately determined.

In the above-described embodiment, the system in which the CCD cameras 18a and 18b are fixed and the substrate 15 is moved is adopted. However, the CCD cameras 18a and 18b are moved above the fixed substrate 15 instead. It is also possible to adopt a method of causing the above. In this case, it is necessary to move the illumination means 17 simultaneously with the CCD cameras 18a and 18b.
If the illuminating means 17 is commonly used for 8a and 18b, the movable portion can be reduced in size and weight, so that controllability can be improved, vibration can be prevented, and positioning accuracy can be improved.

Further, CCD cameras 18a having different magnifications are used.
18b, but instead of this, 3
The illumination means 17 may be shared by more than one kind of CCD camera.

Next, a second embodiment of the soldering appearance inspection apparatus according to the present invention will be described with reference to FIGS. The same reference numerals are given to portions having the same configuration as that of the soldering appearance inspection apparatus 10 of the first embodiment shown in FIGS. 1 to 3 to simplify the description.

[0037] Apparatus 40 for visual inspection of soldering according to the present embodiment.
Also includes an imaging device 12 and a determination device 13. The imaging device 12 has a first configuration in a schematic configuration including the transporting unit 16, the illumination unit 41, the imaging unit 42, and the moving unit 43.
This is common to the embodiment. However, the soldering appearance inspection apparatus 40 of this embodiment is mainly used when inspecting the soldering portion 46 of the J lead 45 of the IC component 44, and includes the illumination unit 41, the imaging unit 42, and the moving unit. Means 43
In this embodiment, the second embodiment is different from the first embodiment.

The illuminating means 41 is, as shown in FIG.
A light source 49 in which a plurality of LEDs 48 are arranged on a plate 47 set at a predetermined inclination angle with respect to a horizontally arranged substrate 15, and an illumination rotating means for rotating the light source 49 around a normal line of the substrate 15. 50. The light source 49 on the lower surface of the rotating member to be described later, are disposed in two places in the V-shape which opens downward, so as to irradiate light L ₁ obliquely downward. The two light sources 49 are arranged
Light L _{1 is} simultaneously applied to the J lead 45 from two different directions.
This makes it possible to characteristically illuminate the external shape of the soldered portion 46 of the J lead 45.

The illumination rotating means 50 includes, for example, a rotating member 51 which is supported rotatably horizontally and has an outer peripheral surface formed in a pulley shape, and a driving pulley 52 arranged beside the rotating member 51. A timing belt 53 stretched around the rotating member 51 and the driving pulley 52;
Servo motor 54 for horizontally rotating drive pulley 52
It is composed of A through hole 55 through which the reflected light L ₂ from the inspection target portion at the center thereof in the vertical direction is provided on the rotary member 51. The illumination rotating unit 50 constitutes a moving unit 43 for moving the illumination unit 41 in the horizontal direction.

The imaging means 42 includes a CCD camera 56 arranged concentrically with the rotation axis of the rotation member 51,
The arranged vertically below the CCD camera 56, and a refractive member such as a prism 57 for directing the CCD camera 56 by refracting the reflected light L ₂ from the inspection target portion. The prism 57 is fixed on the upper surface of the rotating member 51, and is horizontally rotated with the rotation of the illumination means 41. Thus, the illumination rotating means 41 constitutes the prism rotating means 58.

When inspecting the J-lead 45 with the solder appearance inspection apparatus 40 configured as described above, the servo pulley 52, the timing belt 53, and the rotation The light source 49 is horizontally rotated via the member 51. And J
The light source 49 is horizontally moved to an optimum position for inspecting the soldered portion 46 of the lead 45.

At this time, the prism 57 is attached to the rotating member 51.
Is fixed, so that the illumination means 41 rotates,
The prism 57 is also rotated, and the J lead 4
The reflected light L ₂ from the soldering part 46 of 5 is adjusted to the optimal rotation angle for refraction. Thus, as shown in FIG. 4, of the reflected light L ₂ in soldering section 46 of the light L ₁ from the illumination means 41, the reflected light L ₂ to be reflected in a direction inclined with respect to the vertical direction, the prism 57 The light is refracted when passing through, and is directed to the CCD camera 56.

As a result, an image of the J-lead 45 viewed obliquely from above is captured by the CCD camera 56, and the external shape of the soldered portion 46 that is not revealed by the linear portion 45a of the J-lead 45 when captured from above. Can be surely grasped.

When the soldering portion 46 of the J-lead 45 is inspected by the soldering appearance inspection apparatus according to the present embodiment, images as shown in FIGS. 5 to 8 are collected depending on the soldering state of the soldering portion 46. Is done. That is, FIG. 5A shows the soldering portion 46 in a normal soldering state, and FIG. 5B shows an image example at that time. The shaded parts in the figure are
It is a partial look shining the reflected light L ₂ in soldering section 46 of the light L ₁ from the illumination means 49. According to this, when the soldering state is normal, the central portion of the soldered portion 46 looks shiny.

FIG. 6A shows the soldered portions 46 and J
In this case, a so-called floating occurs between the lead 45 and the solder 45, and the soldering state is to be determined to be abnormal. In this case, as shown in FIG. 5B, an image having a portion that shines in front of the soldering portion 46 is collected, and the difference from the normal soldering state in FIG. 5 is clarified. Can be recognized.

FIG. 7A shows a state in which no solder is applied to the portion of the substrate 15 to be soldered, as in the case of FIG. is there. In this case, as shown in FIG. 7B, an image having no shining area on the soldered portion 46 is obtained, and the difference from the normal state is apparent.

FIG. 8A shows a case where the amount of solder is small and the soldered portion 46 is formed small. Also in this case, it is conceivable that a contact failure between the J-lead and the substrate may occur, so that the soldering state should be determined to be abnormal. In this case,
The image captured by the CCD camera 56 is shown in FIG.
As shown in FIG. 5, the image of the back side of the soldered portion 46 looks shiny, and can be clearly distinguished from the normal image of FIG.

That is, according to the visual inspection apparatus for soldering according to the present embodiment, the light source 49 can be moved to the optimum position in accordance with the photographing direction of the J-lead 45 by setting the rotation angle of the prism 57. In this way, an appropriate amount of light can always be secured, and a clear image can be obtained.

Further, by employing the illumination rotating means 50, the photographing is performed by moving the minimum light source 49 horizontally, so that unnecessary light sources not used at the time of photographing can be eliminated. Thereby, there is an advantage that the light source 49 and its installation space can be saved, and the size and weight can be reduced.

In this embodiment, for the sake of simplicity, the rotary member 51 is formed in a disk shape in FIG. 4; however, in actuality, a shape for supporting by a bearing, for example, a prism 57 is housed. What is necessary is just to make it the structure which is formed in the cylindrical shape which does, and which is rotatably supported by the bearing fitted externally to the outer peripheral surface. The rotating member 51, the driving pulley 5
2. Although the illumination rotation unit 50 is configured by the timing belt 53 and the servomotor 54, another rotation mechanism, for example, a mechanism using gears, or the like may be employed instead.

Although the prism rotating means 58 for rotating the prism 57 is simultaneously realized by the illumination rotating means 50 for rotating the light source 49, separate rotating means may be provided instead. Furthermore, although using the prism 57 as a refracting means for refracting the reflected light L ₂ from the inspection target portion, instead of this, it is also possible to employ a reflecting mirror. Further, depending on the installation posture of the CCD camera 56, the prism 57 and the reflecting mirror may be used in combination.

When the IC component 44 having the J-lead 45 and other electronic components are provided side by side on the same substrate 15, the first embodiment and the second embodiment are applied in combination. You may do it. That is, the illuminating means 17 of the first embodiment is attached to the mounting plate 19a of the first embodiment.
The illumination means 41 having the prism 57 of the embodiment is mounted. When inspecting the J-lead 45, the image is taken by the illumination means 41 of the second embodiment, and when inspecting other electronic components, the image is taken by the illumination means 17 of the first embodiment. In this case, the number of CCD cameras 56 may be one, or two or more.

With such a configuration, a plurality of types of illumination means 17.4 are provided for one CCD camera 56.
1 can be applied. Therefore, it is possible to apply the optimum illumination means 17 and 41 according to the type of the inspection target portion, to improve the efficiency of the inspection, and to obtain a clear image for every inspection target portion. There is an advantage that can be.

[0054]

As described above in detail, according to the soldering appearance inspection apparatus according to the present invention, an image pickup apparatus for collecting an image of a portion to be inspected, and whether the soldering state is good or bad based on the collected image. An imaging device comprising: a illuminating unit for irradiating light to an inspection target location; an imaging unit having a camera for capturing reflected light of the light at the inspection target location; And moving means for causing relative movement in a direction intersecting the axis of the camera, so that a clear image can be obtained by arranging the illuminating means with respect to the camera at an optimum position. As a result, it is possible to improve the accuracy of the determination of the quality of the soldering state in the determination device.

In the above-mentioned soldering appearance inspection apparatus,
If the imaging means is configured to include a plurality of cameras having different magnifications in the direction of relative movement with respect to the illumination means, the illumination means for each camera can be switched by the operation of the movement means, and by sharing the illumination means, The lighting device and its installation space can be saved, and the size and weight can be reduced and the product cost can be reduced.
In this case, when a plurality of cameras having different magnifications are separately installed, an optimal exposure state can be easily achieved for each camera, and thus a clear image can be obtained.

Further, if the illumination means is provided with a plurality of types of light sources in the direction of relative movement with respect to the imaging means,
It is possible to select and apply a light source capable of achieving the optimum light amount and irradiation direction for the inspection target portion or the camera. As a result, there is an effect that the quality of the image to be collected can be improved and the determination accuracy can be further improved.

According to the third aspect of the present invention, the imaging means includes a camera for photographing the reflected light at the inspection target, a refraction member for refracting the reflected light, and a refraction member for the camera. Refracting member rotating means for rotating about an axis, the illuminating means includes a light source for irradiating light to a portion to be inspected from a direction inclined with respect to the axis of the camera, and the moving means includes an illuminating means for the camera. The camera is fixed to an inspection target where it is difficult to collect an image of the external shape from the normal direction of the board, such as a soldered portion of a J-lead, because it is composed of an illumination rotation unit that rotates around the axis. Can take a picture. Moreover, by operating the illumination rotating means in response to a change in the imaging direction due to the operation of the refraction member rotating means, it is possible to irradiate the inspection target with the optimal amount of light for imaging and the light in the irradiation direction. There is an effect that it is possible to improve the certainty of the quality judgment of the attached state.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of a soldering appearance inspection apparatus according to the present invention.

FIG. 2 is a longitudinal sectional view showing an illuminating means of the soldering appearance inspection apparatus of FIG. 1;

FIG. 3 is a perspective view showing moving means in the soldering appearance inspection apparatus of FIG. 1;

FIG. 4 is a perspective view for explaining a second embodiment of the soldering appearance inspection apparatus according to the present invention.

FIG. 5 is a view for explaining an example of an image obtained by the soldering appearance inspection apparatus of FIG. 4 when the soldering state is normal.

FIG. 6 is a diagram for explaining an example of an image similar to FIG. 5 in a case where floating occurs in soldering.

FIG. 7 is a diagram for explaining an example of an image similar to FIG. 5 when soldering is not performed.

FIG. 8 is a diagram for explaining an example of an image similar to FIG. 5 when the amount of solder is small.

FIG. 9 is a perspective view showing a soldered state of an IC component having a J-lead.

[Explanation of symbols]

L ₁ light L ₂ reflected light 10 ・ 40 Solder appearance inspection device 12 Imaging device 13 Judgment device 14 ・ 44 Electronic component 15 Substrate 17 Illumination means 18 Imaging means 18a ・ 18b ・ 56 CCD camera (camera) 19 Moving means 30 ・ 48 Light source 50 Illumination rotating means 57 Prism (refraction member) 58 Prism rotation means (refraction member rotation means)

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-129700 (JP, A) JP-A-64-72540 (JP, A) JP-A-64-15643 (JP, A) JP-A-59-129 226852 (JP, A) JP-A-64-57153 (JP, A) JP-A-5-256785 (JP, A) JP-A-5-45511 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) G01N 21/84-21/90

Claims (3)

(57) [Claims] 1. An apparatus for inspecting a soldering state of an electronic component or the like mounted on a substrate, comprising: an imaging device for acquiring an image of a portion to be inspected; and a quality of a soldering state based on the acquired image. And an imaging device, wherein the imaging device has illumination means for irradiating light to the inspection target location, and a camera for capturing reflected light of the light from the illumination means at the inspection target location. Moving means for causing relative movement of the means in a direction intersecting the axis of the camera , wherein the illuminating means includes a plurality of moving means for moving relative to the imaging means.
An appearance inspection device for soldering, comprising: several kinds of light sources . 2. The soldering visual inspection apparatus according to claim 1, wherein the imaging means includes a plurality of cameras having different magnifications in a direction of relative movement with respect to the illumination means. 3. An imaging device, comprising: a camera for photographing reflected light at an inspection target portion; a refraction member disposed between the camera and the inspection target portion for refracting reflected light; Refraction member rotating means for rotating the illumination means, the illumination means comprises a light source for irradiating light to a portion to be inspected from a direction inclined with respect to the axis of the camera, moving means, the illumination means to the axis of the camera 2. The lighting device according to claim 1, further comprising an illumination rotating means for rotating the lighting device.
The soldering visual inspection device according to claim 2 .