KR101718271B1 - 복사 방출 반도체칩 - Google Patents

복사 방출 반도체칩 Download PDF

Info

Publication number
KR101718271B1
KR101718271B1 KR1020157022923A KR20157022923A KR101718271B1 KR 101718271 B1 KR101718271 B1 KR 101718271B1 KR 1020157022923 A KR1020157022923 A KR 1020157022923A KR 20157022923 A KR20157022923 A KR 20157022923A KR 101718271 B1 KR101718271 B1 KR 101718271B1
Authority
KR
South Korea
Prior art keywords
layer
semiconductor chip
structured
structural elements
refractive index
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020157022923A
Other languages
English (en)
Korean (ko)
Other versions
KR20150104637A (ko
Inventor
알프레드 렐
크리스토프 아이츠러
크리스챤 룸볼즈
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오스람 옵토 세미컨덕터스 게엠베하 filed Critical 오스람 옵토 세미컨덕터스 게엠베하
Publication of KR20150104637A publication Critical patent/KR20150104637A/ko
Application granted granted Critical
Publication of KR101718271B1 publication Critical patent/KR101718271B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • H01L33/44
    • H01L33/10
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2004Confining in the direction perpendicular to the layer structure
    • H01S5/2018Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers
    • H01S5/2022Absorbing region or layer parallel to the active layer, e.g. to influence transverse modes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2218Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2218Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties
    • H01S5/222Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties having a refractive index lower than that of the cladding layers or outer guiding layers

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
KR1020157022923A 2007-09-28 2008-08-27 복사 방출 반도체칩 Active KR101718271B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102007046497 2007-09-28
DE102007046497.7 2007-09-28
DE102007060204.0A DE102007060204B4 (de) 2007-09-28 2007-12-14 Strahlung emittierender Halbleiterchip
DE102007060204.0 2007-12-14
PCT/DE2008/001423 WO2009039811A2 (de) 2007-09-28 2008-08-27 Strahlung emittierender halbleiterchip

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020107009391A Division KR101567613B1 (ko) 2007-09-28 2008-08-27 복사 방출 반도체칩

Publications (2)

Publication Number Publication Date
KR20150104637A KR20150104637A (ko) 2015-09-15
KR101718271B1 true KR101718271B1 (ko) 2017-03-20

Family

ID=40435571

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020107009391A Active KR101567613B1 (ko) 2007-09-28 2008-08-27 복사 방출 반도체칩
KR1020157022923A Active KR101718271B1 (ko) 2007-09-28 2008-08-27 복사 방출 반도체칩

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020107009391A Active KR101567613B1 (ko) 2007-09-28 2008-08-27 복사 방출 반도체칩

Country Status (9)

Country Link
US (1) US8340146B2 (enExample)
EP (2) EP2193556B1 (enExample)
JP (2) JP2010541215A (enExample)
KR (2) KR101567613B1 (enExample)
CN (1) CN101809772B (enExample)
DE (2) DE102007063957B3 (enExample)
PL (1) PL2193556T3 (enExample)
TW (1) TWI385827B (enExample)
WO (1) WO2009039811A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011100175B4 (de) 2011-05-02 2021-12-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Laserlichtquelle mit einer Stegwellenleiterstruktur und einer Modenfilterstruktur
DE102012103549B4 (de) 2012-04-23 2020-06-18 Osram Opto Semiconductors Gmbh Halbleiterlaserlichtquelle mit einem kantenemittierenden Halbleiterkörper und Licht streuenden Teilbereich
DE102013216527A1 (de) * 2013-08-21 2015-02-26 Osram Opto Semiconductors Gmbh Laserbauelement und Verfahren zum Herstellen eines Laserbauelements
KR20160034534A (ko) 2014-09-19 2016-03-30 삼성전자주식회사 반도체 발광 소자
KR101689468B1 (ko) * 2015-05-19 2016-12-26 주식회사 솔탑 라이다식 운고계 장치 및 라이다식 운고계 장치 구현 방법
DE102016106495A1 (de) * 2016-04-08 2017-10-12 Osram Opto Semiconductors Gmbh Halbleiterlaser
JP7222217B2 (ja) 2018-10-30 2023-02-15 Tdk株式会社 積層コイル部品
CN115775859A (zh) * 2022-11-09 2023-03-10 华灿光电(浙江)有限公司 改善光串扰的发光二极管及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168387A (ja) * 1999-09-29 2001-06-22 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体素子
JP2007123449A (ja) * 2005-10-26 2007-05-17 Matsushita Electric Works Ltd 光学部品の製造方法及び発光素子
JP2007134445A (ja) * 2005-11-09 2007-05-31 Nichia Chem Ind Ltd 窒化物半導体レーザ素子

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61108176A (ja) * 1984-11-01 1986-05-26 Fuji Electric Co Ltd 粗面化方法
JP2755357B2 (ja) * 1991-08-30 1998-05-20 シャープ株式会社 半導体レーザ素子
JP3448441B2 (ja) * 1996-11-29 2003-09-22 三洋電機株式会社 発光装置
DE69730872T2 (de) 1997-01-27 2005-09-29 International Business Machines Corp. Laservorrichtung
JP5019664B2 (ja) * 1998-07-28 2012-09-05 アイメック 高効率で光を発するデバイスおよびそのようなデバイスの製造方法
US6515305B2 (en) * 2000-09-18 2003-02-04 Regents Of The University Of Minnesota Vertical cavity surface emitting laser with single mode confinement
JP4117778B2 (ja) * 2002-09-27 2008-07-16 日本電信電話株式会社 半導体光素子
CN100379105C (zh) * 2003-06-27 2008-04-02 日亚化学工业株式会社 具有电流狭窄层的氮化物半导体激光器元件及其制造方法
TWI330413B (en) * 2005-01-25 2010-09-11 Epistar Corp A light-emitting device
JP4830315B2 (ja) * 2004-03-05 2011-12-07 日亜化学工業株式会社 半導体レーザ素子
KR100674836B1 (ko) 2005-02-28 2007-01-26 삼성전기주식회사 고출력 단일모드 반도체 레이저소자 및 그 제조방법
US20060204865A1 (en) * 2005-03-08 2006-09-14 Luminus Devices, Inc. Patterned light-emitting devices
JP4959203B2 (ja) * 2006-02-17 2012-06-20 昭和電工株式会社 発光素子及びその製造方法、並びにランプ
DE102006017573A1 (de) * 2006-04-13 2007-10-18 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und Verfahren zu dessen Herstellung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168387A (ja) * 1999-09-29 2001-06-22 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体素子
JP2007123449A (ja) * 2005-10-26 2007-05-17 Matsushita Electric Works Ltd 光学部品の製造方法及び発光素子
JP2007134445A (ja) * 2005-11-09 2007-05-31 Nichia Chem Ind Ltd 窒化物半導体レーザ素子

Also Published As

Publication number Publication date
WO2009039811A3 (de) 2009-09-03
DE102007060204B4 (de) 2019-02-28
CN101809772A (zh) 2010-08-18
JP2014057113A (ja) 2014-03-27
US8340146B2 (en) 2012-12-25
TWI385827B (zh) 2013-02-11
TW200917534A (en) 2009-04-16
CN101809772B (zh) 2012-09-05
EP3206239A1 (de) 2017-08-16
EP2193556B1 (de) 2017-07-26
EP2193556A2 (de) 2010-06-09
KR20150104637A (ko) 2015-09-15
PL2193556T3 (pl) 2017-12-29
WO2009039811A2 (de) 2009-04-02
KR20100089833A (ko) 2010-08-12
DE102007060204A1 (de) 2009-04-16
EP3206239B1 (de) 2021-06-30
DE102007063957B3 (de) 2022-10-27
US20100278203A1 (en) 2010-11-04
JP2010541215A (ja) 2010-12-24
KR101567613B1 (ko) 2015-11-09

Similar Documents

Publication Publication Date Title
KR101718271B1 (ko) 복사 방출 반도체칩
US8227818B2 (en) Horizontal emitting, vertical emitting, beam shaped, distributed feedback (DFB) lasers fabricated by growth over a patterned substrate with multiple overgrowth
JP4824293B2 (ja) フォトニック結晶発光デバイス
JP5379434B2 (ja) 発光素子用サファイア基板の製造方法
KR101424312B1 (ko) 반도체칩 및 반도체칩의 제조 방법
US20120018755A1 (en) Light emitting devices with embedded void-gap structures through bonding of structured materials on active devices
KR100345452B1 (ko) 상부거울층 양단부에 확산영역을 구비하는 장파장표면방출 레이저 소자 및 그 제조 방법
JP2006054473A (ja) 複数の格子を有するフォトニック結晶発光装置
JP2013080985A (ja) Ledおよびledの組立方法
JP2008072126A (ja) オプトエレクトロニクス半導体チップ
US8995490B2 (en) Edge-emitting semiconductor laser diode and method for producing the same
JP2010267871A (ja) 半導体レーザおよびその製造方法
TW200849753A (en) Semiconductor laser diode and its fabrication process
CN101390263B (zh) 半导体激光装置
US20040245534A1 (en) Gan semiconductor laser device, and optical disk information system using the laser device
WO2011026033A1 (en) Light emitting devices with embedded void-gap structures through bonding of structured materials on active devices
CN115085010B (zh) 可调谐面发射激光器阵列及制作方法
KR20070012930A (ko) 반도체 발광소자 및 그 제조방법
KR100900644B1 (ko) 미세패턴 형성방법 및 이를 이용한 반도체 발광소자제조방법
KR20060052616A (ko) 반도체 레이저
US20070158662A1 (en) Two-dimensional photonic crystal LED
JP4497606B2 (ja) 半導体レーザ装置
EP2709171B1 (en) LED array
KR20100061134A (ko) 질화물 반도체 발광소자의 제조방법 및 이 방법에 의해 제조된 질화물 반도체 발광소자
JP2006303052A (ja) 半導体レーザ装置及び半導体レーザ装置の製造方法

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20150824

Application number text: 1020107009391

Filing date: 20100428

PA0201 Request for examination
PG1501 Laying open of application
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20151008

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20160826

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20151008

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

Patent event date: 20161128

Comment text: Request for Trial against Decision on Refusal

Patent event code: PJ02012R01D

Patent event date: 20160826

Comment text: Decision to Refuse Application

Patent event code: PJ02011S01I

Appeal kind category: Appeal against decision to decline refusal

Decision date: 20170119

Appeal identifier: 2016101006712

Request date: 20161128

AMND Amendment
PB0901 Examination by re-examination before a trial

Comment text: Amendment to Specification, etc.

Patent event date: 20161220

Patent event code: PB09011R02I

Comment text: Request for Trial against Decision on Refusal

Patent event date: 20161128

Patent event code: PB09011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 20160408

Patent event code: PB09011R02I

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

Patent event date: 20170119

Comment text: Decision to Grant Registration

Patent event code: PB07012S01D

Patent event date: 20161230

Comment text: Transfer of Trial File for Re-examination before a Trial

Patent event code: PB07011S01I

PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20170314

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20170314

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20200305

Year of fee payment: 4

PR1001 Payment of annual fee

Payment date: 20200305

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20210305

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20220303

Start annual number: 6

End annual number: 6