KR101697240B1 - 광학 검사 시스템 및 방법 - Google Patents
광학 검사 시스템 및 방법 Download PDFInfo
- Publication number
- KR101697240B1 KR101697240B1 KR1020107022152A KR20107022152A KR101697240B1 KR 101697240 B1 KR101697240 B1 KR 101697240B1 KR 1020107022152 A KR1020107022152 A KR 1020107022152A KR 20107022152 A KR20107022152 A KR 20107022152A KR 101697240 B1 KR101697240 B1 KR 101697240B1
- Authority
- KR
- South Korea
- Prior art keywords
- delete delete
- image
- beam path
- wafer
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
- G01N2021/8825—Separate detection of dark field and bright field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US6494908P | 2008-04-04 | 2008-04-04 | |
| US61/064,949 | 2008-04-04 | ||
| PCT/EP2009/002482 WO2009121628A2 (en) | 2008-04-04 | 2009-04-03 | Optical inspection system and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110000560A KR20110000560A (ko) | 2011-01-03 |
| KR101697240B1 true KR101697240B1 (ko) | 2017-01-17 |
Family
ID=41059655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107022152A Expired - Fee Related KR101697240B1 (ko) | 2008-04-04 | 2009-04-03 | 광학 검사 시스템 및 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US8072591B2 (https=) |
| JP (1) | JP5749641B2 (https=) |
| KR (1) | KR101697240B1 (https=) |
| CN (1) | CN102016554B (https=) |
| DE (1) | DE112009000832T5 (https=) |
| TW (1) | TWI479583B (https=) |
| WO (1) | WO2009121628A2 (https=) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112009000832T5 (de) * | 2008-04-04 | 2011-07-28 | Nanda Technologies GmbH, 85716 | System und Verfahren zur optischen Inspektion |
| CN101963741B (zh) * | 2009-07-23 | 2013-10-09 | 鸿富锦精密工业(深圳)有限公司 | 摄像模组及采用该摄像模组的便携式电子装置 |
| EP2339331A1 (en) | 2009-12-23 | 2011-06-29 | Nanda Technologies GmbH | Inspection and positioning systems and methods |
| JP2011203245A (ja) * | 2010-03-02 | 2011-10-13 | You-Na Tech Corp | 半導体ウェハの表面検査システム及び表面検査方法 |
| EP2378548A1 (en) | 2010-04-19 | 2011-10-19 | Nanda Technologies GmbH | Methods of processing and inspecting semiconductor substrates |
| EP2381246A1 (en) * | 2010-04-26 | 2011-10-26 | Becton Dickinson France | Device, kit and method for inspection of an article |
| CN102269858A (zh) * | 2010-06-02 | 2011-12-07 | 北京智朗芯光科技有限公司 | 自动聚焦系统和自动聚焦方法 |
| US9355919B2 (en) | 2010-08-24 | 2016-05-31 | Nanda Technologies Gmbh | Methods and systems for inspecting bonded wafers |
| US8501503B2 (en) | 2011-04-28 | 2013-08-06 | Nanda Technologies Gmbh | Methods of inspecting and manufacturing semiconductor wafers |
| DE102011051355A1 (de) | 2011-06-27 | 2012-12-27 | Hseb Dresden Gmbh | Inspektionsvorrichtung |
| US9213156B2 (en) | 2011-08-17 | 2015-12-15 | Source Photonics, Inc. | Optical receiver with reduced cavity size and methods of making and using the same |
| JP2014535056A (ja) * | 2011-11-08 | 2014-12-25 | ザ・トラスティーズ・オブ・コロンビア・ユニバーシティ・イン・ザ・シティ・オブ・ニューヨーク | トモグラフィのデータを取り込むための同時多方向イメージングに向けたシステムと方法 |
| US10088413B2 (en) | 2011-11-21 | 2018-10-02 | Kla-Tencor Corporation | Spectral matching based calibration |
| EP2812746B1 (en) | 2012-02-10 | 2021-04-07 | The Board of Trustees of the Leland Stanford Junior University | Optical device |
| TWI460394B (zh) * | 2012-07-20 | 2014-11-11 | Test Research Inc | 三維影像量測裝置 |
| US9279663B2 (en) * | 2012-07-30 | 2016-03-08 | Kla-Tencor Corporation | Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate |
| DE102012111835A1 (de) | 2012-12-05 | 2014-06-05 | Hseb Dresden Gmbh | Inspektionsvorrichtung |
| US9810892B2 (en) | 2013-03-15 | 2017-11-07 | The Board Of Trustees Of The Leland Stanford Junior University | Optical lens fabrication |
| US9696264B2 (en) * | 2013-04-03 | 2017-07-04 | Kla-Tencor Corporation | Apparatus and methods for determining defect depths in vertical stack memory |
| US9176070B2 (en) | 2014-04-07 | 2015-11-03 | Hseb Dresden Gmbh | Inspection assembly |
| US20170167986A1 (en) * | 2014-04-25 | 2017-06-15 | Gdt, Inc. | Cosmetic Evaluation Box for Used Electronics |
| TWI702386B (zh) * | 2014-07-17 | 2020-08-21 | 以色列商奧寶科技股份有限公司 | 遠心亮場與環形暗場無縫融合式照射 |
| US9377596B2 (en) * | 2014-07-22 | 2016-06-28 | Unimicron Technology Corp. | Optical-electro circuit board, optical component and manufacturing method thereof |
| WO2016015734A1 (en) * | 2014-08-01 | 2016-02-04 | Dfm A/S | A scatterometer apparatus |
| KR101741659B1 (ko) | 2014-11-03 | 2017-05-31 | 주식회사 엠티엠 | 카메라 모듈 이물 검사를 위한 광원장치 |
| IL243167B (en) * | 2014-12-18 | 2021-02-28 | Gordon Noam | Multiple light sources that can be separated by optical inspection |
| IL243166B2 (en) * | 2014-12-18 | 2023-10-01 | Camtek Imaging Tech Suzhou Co Ltd | Modification of the optical properties of line-scan illumination depending on the light angle along the line axis |
| JP6024056B2 (ja) * | 2015-01-13 | 2016-11-09 | 新一 土坂 | 球面検査装置 |
| US10309907B2 (en) * | 2015-03-04 | 2019-06-04 | Kla-Tencor Corporation | All reflective wafer defect inspection and review systems and methods |
| KR102450005B1 (ko) * | 2016-02-03 | 2022-09-30 | 케이엘에이 코포레이션 | 웨이퍼 결함 검사 및 리뷰 시스템 |
| ES2819699T3 (es) | 2016-03-07 | 2021-04-19 | Hyla Inc | Detección de daño de pantalla para dispositivos |
| US10281408B2 (en) * | 2016-04-12 | 2019-05-07 | Nippon Steel & Sumitomo Metal Corporation | Inspection object imaging apparatus, inspection object imaging method, surface inspection apparatus, and surface inspection method |
| EP3578916B1 (en) * | 2017-01-31 | 2023-07-05 | JFE Steel Corporation | Steel material shape measuring device and steel material shape correcting device |
| US10422984B2 (en) * | 2017-05-12 | 2019-09-24 | Applied Materials, Inc. | Flexible mode scanning optical microscopy and inspection system |
| US11777603B2 (en) * | 2019-01-16 | 2023-10-03 | X Development Llc | High magnification afocal telescope with high index field curvature corrector |
| JP7175214B2 (ja) * | 2019-02-13 | 2022-11-18 | リコーインダストリアルソリューションズ株式会社 | 検査装置 |
| EP4032017B1 (en) | 2019-09-16 | 2025-11-12 | Assurant, Inc. | Method, apparatus, and computer program product for utilizing machine learning to process an image of a mobile device to determine a mobile device integrity status |
| US11580627B2 (en) | 2020-01-06 | 2023-02-14 | Assurant, Inc. | Systems and methods for automatically grading pre-owned electronic devices |
| WO2021216032A1 (en) * | 2020-04-20 | 2021-10-28 | Applied Materials, Inc. | Methods and apparatus for correcting lithography systems |
| US12339235B2 (en) | 2021-11-18 | 2025-06-24 | Onto Innovation Inc. | Simultaneous back and/or front and/or bulk defect detection |
| KR102830664B1 (ko) * | 2023-11-08 | 2025-07-07 | (주)뮤텍코리아 | 반도체 웨이퍼의 나노급 파티클 검사를 위한 광학 시스템 |
| CN120314303B (zh) * | 2025-03-13 | 2025-12-23 | 飞测思凯浦(上海)半导体科技有限公司 | 一种成像调节装置和光学检测设备 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003028621A (ja) | 2001-07-11 | 2003-01-29 | Nikon Corp | 表面欠陥検査装置 |
| JP2006514308A (ja) | 2003-02-26 | 2006-04-27 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 同軸狭角暗視野照明 |
| JP2008026306A (ja) | 2006-06-20 | 2008-02-07 | Hoya Corp | パターン欠陥検査方法、パターン欠陥検査装置、フォトマスク製品の製造方法、及び表示デバイス用基板の製造方法 |
| JP2008064759A (ja) | 2006-09-07 | 2008-03-21 | Dr Schenk Gmbh Industriemesstechnik | 基板の表面エラーを光学的に検出する装置および方法 |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US2313460A (en) * | 1940-01-23 | 1943-03-09 | Kapella Ltd | Compound microscope and lens system therefor |
| US2398276A (en) * | 1945-02-05 | 1946-04-09 | Eastman Kodak Co | Variable power telescope |
| US2441036A (en) * | 1945-02-14 | 1948-05-04 | Eastman Kodak Co | Lens system for telescopes |
| US2600805A (en) * | 1951-02-08 | 1952-06-17 | Eastman Kodak Co | Telecentric objective of the reversed telephoto type |
| DE1012763B (de) * | 1954-07-21 | 1957-07-25 | Leitz Ernst Gmbh | Mikroskopobjektiv fuer UEbersichtsbilder |
| US2952180A (en) | 1958-06-02 | 1960-09-13 | Eastman Kodak Co | Visual optical instrument having a combined reticle and field flattening element |
| US3176563A (en) * | 1962-02-02 | 1965-04-06 | Better Packages Inc | Tape serving machine |
| US4009945A (en) * | 1963-09-05 | 1977-03-01 | Walter Klein | Microscope objective |
| US3437395A (en) * | 1965-09-03 | 1969-04-08 | Bausch & Lomb | Optical system for inverted microscope |
| JPH07119888B2 (ja) * | 1987-05-08 | 1995-12-20 | 株式会社ニコン | 再結像光学系 |
| US5058982A (en) * | 1989-06-21 | 1991-10-22 | Orbot Systems Ltd. | Illumination system and inspection apparatus including same |
| JPH0816765B2 (ja) * | 1989-07-10 | 1996-02-21 | オリンパス光学工業株式会社 | 変倍ファインダー光学系 |
| JPH03249550A (ja) * | 1990-02-28 | 1991-11-07 | Mitsubishi Electric Corp | パターン欠陥検査装置 |
| JPH0493911A (ja) * | 1990-08-06 | 1992-03-26 | Nikon Corp | 無限系結像光学系 |
| JPH07306150A (ja) * | 1994-05-10 | 1995-11-21 | Kobe Steel Ltd | 逆反射スクリーンによる表面検査装置 |
| JP3386269B2 (ja) * | 1995-01-25 | 2003-03-17 | 株式会社ニュークリエイション | 光学検査装置 |
| US5804386A (en) * | 1997-01-15 | 1998-09-08 | Incyte Pharmaceuticals, Inc. | Sets of labeled energy transfer fluorescent primers and their use in multi component analysis |
| US5909276A (en) * | 1997-03-31 | 1999-06-01 | Microtherm, Llc | Optical inspection module and method for detecting particles and defects on substrates in integrated process tools |
| JP3169857B2 (ja) * | 1997-05-20 | 2001-05-28 | 島田理化工業株式会社 | 異物検出方法およびその装置 |
| JPH10333033A (ja) * | 1997-06-02 | 1998-12-18 | Olympus Optical Co Ltd | 実像式変倍ファインダー |
| JP3664593B2 (ja) * | 1998-11-06 | 2005-06-29 | 信越半導体株式会社 | 半導体ウエーハおよびその製造方法 |
| US6999183B2 (en) * | 1998-11-18 | 2006-02-14 | Kla-Tencor Corporation | Detection system for nanometer scale topographic measurements of reflective surfaces |
| DE19903486C2 (de) * | 1999-01-29 | 2003-03-06 | Leica Microsystems | Verfahren und Vorrichtung zur optischen Untersuchung von strukturierten Oberflächen von Objekten |
| JP2000338048A (ja) * | 1999-05-31 | 2000-12-08 | Hamamatsu Photonics Kk | 表面検査方法及び検査装置 |
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| JP2004163240A (ja) * | 2002-11-13 | 2004-06-10 | Silicon Technology Co Ltd | 表面評価装置 |
| US7130036B1 (en) | 2003-09-16 | 2006-10-31 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of an entire wafer surface using multiple detection channels |
| US20050146719A1 (en) | 2003-09-26 | 2005-07-07 | Rajeshwar Chhibber | Method and apparatus for illuminating a substrate during inspection |
| US7351980B2 (en) * | 2005-03-31 | 2008-04-01 | Kla-Tencor Technologies Corp. | All-reflective optical systems for broadband wafer inspection |
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| JP4723362B2 (ja) | 2005-11-29 | 2011-07-13 | 株式会社日立ハイテクノロジーズ | 光学式検査装置及びその方法 |
| CN101021490B (zh) * | 2007-03-12 | 2012-11-14 | 3i系统公司 | 平面基板自动检测系统及方法 |
| US7782452B2 (en) | 2007-08-31 | 2010-08-24 | Kla-Tencor Technologies Corp. | Systems and method for simultaneously inspecting a specimen with two distinct channels |
| DE112009000832T5 (de) * | 2008-04-04 | 2011-07-28 | Nanda Technologies GmbH, 85716 | System und Verfahren zur optischen Inspektion |
-
2009
- 2009-04-03 DE DE112009000832T patent/DE112009000832T5/de not_active Withdrawn
- 2009-04-03 KR KR1020107022152A patent/KR101697240B1/ko not_active Expired - Fee Related
- 2009-04-03 TW TW098111147A patent/TWI479583B/zh not_active IP Right Cessation
- 2009-04-03 JP JP2011502299A patent/JP5749641B2/ja not_active Expired - Fee Related
- 2009-04-03 WO PCT/EP2009/002482 patent/WO2009121628A2/en not_active Ceased
- 2009-04-03 CN CN2009801160931A patent/CN102016554B/zh not_active Expired - Fee Related
-
2010
- 2010-03-01 US US12/715,246 patent/US8072591B2/en active Active
- 2010-10-29 US US12/916,336 patent/US8102521B2/en not_active Expired - Fee Related
- 2010-10-29 US US12/916,315 patent/US8345232B2/en not_active Expired - Fee Related
-
2011
- 2011-10-20 US US13/277,986 patent/US8368881B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003028621A (ja) | 2001-07-11 | 2003-01-29 | Nikon Corp | 表面欠陥検査装置 |
| JP2006514308A (ja) | 2003-02-26 | 2006-04-27 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 同軸狭角暗視野照明 |
| JP2008026306A (ja) | 2006-06-20 | 2008-02-07 | Hoya Corp | パターン欠陥検査方法、パターン欠陥検査装置、フォトマスク製品の製造方法、及び表示デバイス用基板の製造方法 |
| JP2008064759A (ja) | 2006-09-07 | 2008-03-21 | Dr Schenk Gmbh Industriemesstechnik | 基板の表面エラーを光学的に検出する装置および方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US8368881B2 (en) | 2013-02-05 |
| TW200952102A (en) | 2009-12-16 |
| DE112009000832T5 (de) | 2011-07-28 |
| US20120133760A1 (en) | 2012-05-31 |
| US20100231902A1 (en) | 2010-09-16 |
| TWI479583B (zh) | 2015-04-01 |
| JP5749641B2 (ja) | 2015-07-15 |
| US20110043798A1 (en) | 2011-02-24 |
| KR20110000560A (ko) | 2011-01-03 |
| US20110043796A1 (en) | 2011-02-24 |
| US8072591B2 (en) | 2011-12-06 |
| WO2009121628A2 (en) | 2009-10-08 |
| CN102016554B (zh) | 2013-01-30 |
| CN102016554A (zh) | 2011-04-13 |
| US8102521B2 (en) | 2012-01-24 |
| JP2011516844A (ja) | 2011-05-26 |
| US8345232B2 (en) | 2013-01-01 |
| WO2009121628A9 (en) | 2009-11-26 |
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