JP5749641B2 - 光学検査システム及び方法 - Google Patents

光学検査システム及び方法 Download PDF

Info

Publication number
JP5749641B2
JP5749641B2 JP2011502299A JP2011502299A JP5749641B2 JP 5749641 B2 JP5749641 B2 JP 5749641B2 JP 2011502299 A JP2011502299 A JP 2011502299A JP 2011502299 A JP2011502299 A JP 2011502299A JP 5749641 B2 JP5749641 B2 JP 5749641B2
Authority
JP
Japan
Prior art keywords
beam path
light
dark field
inspection system
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011502299A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011516844A5 (https=
JP2011516844A (ja
Inventor
マルクヴォルト、ラーズ
チヒベール、ラジェシュワー
エッケール、クラウス
ハレント、ノルベルト
Original Assignee
ナンダ テヒノロギーズ ゲーエムベーハー
ナンダ テヒノロギーズ ゲーエムベーハー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ナンダ テヒノロギーズ ゲーエムベーハー, ナンダ テヒノロギーズ ゲーエムベーハー filed Critical ナンダ テヒノロギーズ ゲーエムベーハー
Publication of JP2011516844A publication Critical patent/JP2011516844A/ja
Publication of JP2011516844A5 publication Critical patent/JP2011516844A5/ja
Application granted granted Critical
Publication of JP5749641B2 publication Critical patent/JP5749641B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2011502299A 2008-04-04 2009-04-03 光学検査システム及び方法 Expired - Fee Related JP5749641B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6494908P 2008-04-04 2008-04-04
US61/064,949 2008-04-04
PCT/EP2009/002482 WO2009121628A2 (en) 2008-04-04 2009-04-03 Optical inspection system and method

Publications (3)

Publication Number Publication Date
JP2011516844A JP2011516844A (ja) 2011-05-26
JP2011516844A5 JP2011516844A5 (https=) 2012-05-24
JP5749641B2 true JP5749641B2 (ja) 2015-07-15

Family

ID=41059655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011502299A Expired - Fee Related JP5749641B2 (ja) 2008-04-04 2009-04-03 光学検査システム及び方法

Country Status (7)

Country Link
US (4) US8072591B2 (https=)
JP (1) JP5749641B2 (https=)
KR (1) KR101697240B1 (https=)
CN (1) CN102016554B (https=)
DE (1) DE112009000832T5 (https=)
TW (1) TWI479583B (https=)
WO (1) WO2009121628A2 (https=)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112009000832T5 (de) * 2008-04-04 2011-07-28 Nanda Technologies GmbH, 85716 System und Verfahren zur optischen Inspektion
CN101963741B (zh) * 2009-07-23 2013-10-09 鸿富锦精密工业（深圳）有限公司 摄像模组及采用该摄像模组的便携式电子装置
EP2339331A1 (en) 2009-12-23 2011-06-29 Nanda Technologies GmbH Inspection and positioning systems and methods
JP2011203245A (ja) * 2010-03-02 2011-10-13 You-Na Tech Corp 半導体ウェハの表面検査システム及び表面検査方法
EP2378548A1 (en) 2010-04-19 2011-10-19 Nanda Technologies GmbH Methods of processing and inspecting semiconductor substrates
EP2381246A1 (en) * 2010-04-26 2011-10-26 Becton Dickinson France Device, kit and method for inspection of an article
CN102269858A (zh) * 2010-06-02 2011-12-07 北京智朗芯光科技有限公司 自动聚焦系统和自动聚焦方法
US9355919B2 (en) 2010-08-24 2016-05-31 Nanda Technologies Gmbh Methods and systems for inspecting bonded wafers
US8501503B2 (en) 2011-04-28 2013-08-06 Nanda Technologies Gmbh Methods of inspecting and manufacturing semiconductor wafers
DE102011051355A1 (de) 2011-06-27 2012-12-27 Hseb Dresden Gmbh Inspektionsvorrichtung
US9213156B2 (en) 2011-08-17 2015-12-15 Source Photonics, Inc. Optical receiver with reduced cavity size and methods of making and using the same
JP2014535056A (ja) * 2011-11-08 2014-12-25 ザ・トラスティーズ・オブ・コロンビア・ユニバーシティ・イン・ザ・シティ・オブ・ニューヨーク トモグラフィのデータを取り込むための同時多方向イメージングに向けたシステムと方法
US10088413B2 (en) 2011-11-21 2018-10-02 Kla-Tencor Corporation Spectral matching based calibration
EP2812746B1 (en) 2012-02-10 2021-04-07 The Board of Trustees of the Leland Stanford Junior University Optical device
TWI460394B (zh) * 2012-07-20 2014-11-11 Test Research Inc 三維影像量測裝置
US9279663B2 (en) * 2012-07-30 2016-03-08 Kla-Tencor Corporation Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate
DE102012111835A1 (de) 2012-12-05 2014-06-05 Hseb Dresden Gmbh Inspektionsvorrichtung
US9810892B2 (en) 2013-03-15 2017-11-07 The Board Of Trustees Of The Leland Stanford Junior University Optical lens fabrication
US9696264B2 (en) * 2013-04-03 2017-07-04 Kla-Tencor Corporation Apparatus and methods for determining defect depths in vertical stack memory
US9176070B2 (en) 2014-04-07 2015-11-03 Hseb Dresden Gmbh Inspection assembly
US20170167986A1 (en) * 2014-04-25 2017-06-15 Gdt, Inc. Cosmetic Evaluation Box for Used Electronics
TWI702386B (zh) * 2014-07-17 2020-08-21 以色列商奧寶科技股份有限公司 遠心亮場與環形暗場無縫融合式照射
US9377596B2 (en) * 2014-07-22 2016-06-28 Unimicron Technology Corp. Optical-electro circuit board, optical component and manufacturing method thereof
WO2016015734A1 (en) * 2014-08-01 2016-02-04 Dfm A/S A scatterometer apparatus
KR101741659B1 (ko) 2014-11-03 2017-05-31 주식회사 엠티엠 카메라 모듈 이물 검사를 위한 광원장치
IL243167B (en) * 2014-12-18 2021-02-28 Gordon Noam Multiple light sources that can be separated by optical inspection
IL243166B2 (en) * 2014-12-18 2023-10-01 Camtek Imaging Tech Suzhou Co Ltd Modification of the optical properties of line-scan illumination depending on the light angle along the line axis
JP6024056B2 (ja) * 2015-01-13 2016-11-09 新一 土坂 球面検査装置
US10309907B2 (en) * 2015-03-04 2019-06-04 Kla-Tencor Corporation All reflective wafer defect inspection and review systems and methods
KR102450005B1 (ko) * 2016-02-03 2022-09-30 케이엘에이 코포레이션 웨이퍼 결함 검사 및 리뷰 시스템
ES2819699T3 (es) 2016-03-07 2021-04-19 Hyla Inc Detección de daño de pantalla para dispositivos
US10281408B2 (en) * 2016-04-12 2019-05-07 Nippon Steel & Sumitomo Metal Corporation Inspection object imaging apparatus, inspection object imaging method, surface inspection apparatus, and surface inspection method
EP3578916B1 (en) * 2017-01-31 2023-07-05 JFE Steel Corporation Steel material shape measuring device and steel material shape correcting device
US10422984B2 (en) * 2017-05-12 2019-09-24 Applied Materials, Inc. Flexible mode scanning optical microscopy and inspection system
US11777603B2 (en) * 2019-01-16 2023-10-03 X Development Llc High magnification afocal telescope with high index field curvature corrector
JP7175214B2 (ja) * 2019-02-13 2022-11-18 リコーインダストリアルソリューションズ株式会社 検査装置
EP4032017B1 (en) 2019-09-16 2025-11-12 Assurant, Inc. Method, apparatus, and computer program product for utilizing machine learning to process an image of a mobile device to determine a mobile device integrity status
US11580627B2 (en) 2020-01-06 2023-02-14 Assurant, Inc. Systems and methods for automatically grading pre-owned electronic devices
WO2021216032A1 (en) * 2020-04-20 2021-10-28 Applied Materials, Inc. Methods and apparatus for correcting lithography systems
US12339235B2 (en) 2021-11-18 2025-06-24 Onto Innovation Inc. Simultaneous back and/or front and/or bulk defect detection
KR102830664B1 (ko) * 2023-11-08 2025-07-07 (주)뮤텍코리아 반도체 웨이퍼의 나노급 파티클 검사를 위한 광학 시스템
CN120314303B (zh) * 2025-03-13 2025-12-23 飞测思凯浦(上海)半导体科技有限公司 一种成像调节装置和光学检测设备

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2313460A (en) * 1940-01-23 1943-03-09 Kapella Ltd Compound microscope and lens system therefor
US2398276A (en) * 1945-02-05 1946-04-09 Eastman Kodak Co Variable power telescope
US2441036A (en) * 1945-02-14 1948-05-04 Eastman Kodak Co Lens system for telescopes
US2600805A (en) * 1951-02-08 1952-06-17 Eastman Kodak Co Telecentric objective of the reversed telephoto type
DE1012763B (de) * 1954-07-21 1957-07-25 Leitz Ernst Gmbh Mikroskopobjektiv fuer UEbersichtsbilder
US2952180A (en) 1958-06-02 1960-09-13 Eastman Kodak Co Visual optical instrument having a combined reticle and field flattening element
US3176563A (en) * 1962-02-02 1965-04-06 Better Packages Inc Tape serving machine
US4009945A (en) * 1963-09-05 1977-03-01 Walter Klein Microscope objective
US3437395A (en) * 1965-09-03 1969-04-08 Bausch & Lomb Optical system for inverted microscope
JPH07119888B2 (ja) * 1987-05-08 1995-12-20 株式会社ニコン 再結像光学系
US5058982A (en) * 1989-06-21 1991-10-22 Orbot Systems Ltd. Illumination system and inspection apparatus including same
JPH0816765B2 (ja) * 1989-07-10 1996-02-21 オリンパス光学工業株式会社 変倍ファインダー光学系
JPH03249550A (ja) * 1990-02-28 1991-11-07 Mitsubishi Electric Corp パターン欠陥検査装置
JPH0493911A (ja) * 1990-08-06 1992-03-26 Nikon Corp 無限系結像光学系
JPH07306150A (ja) * 1994-05-10 1995-11-21 Kobe Steel Ltd 逆反射スクリーンによる表面検査装置
JP3386269B2 (ja) * 1995-01-25 2003-03-17 株式会社ニュークリエイション 光学検査装置
US5804386A (en) * 1997-01-15 1998-09-08 Incyte Pharmaceuticals, Inc. Sets of labeled energy transfer fluorescent primers and their use in multi component analysis
US5909276A (en) * 1997-03-31 1999-06-01 Microtherm, Llc Optical inspection module and method for detecting particles and defects on substrates in integrated process tools
JP3169857B2 (ja) * 1997-05-20 2001-05-28 島田理化工業株式会社 異物検出方法およびその装置
JPH10333033A (ja) * 1997-06-02 1998-12-18 Olympus Optical Co Ltd 実像式変倍ファインダー
JP3664593B2 (ja) * 1998-11-06 2005-06-29 信越半導体株式会社 半導体ウエーハおよびその製造方法
US6999183B2 (en) * 1998-11-18 2006-02-14 Kla-Tencor Corporation Detection system for nanometer scale topographic measurements of reflective surfaces
DE19903486C2 (de) * 1999-01-29 2003-03-06 Leica Microsystems Verfahren und Vorrichtung zur optischen Untersuchung von strukturierten Oberflächen von Objekten
JP2000338048A (ja) * 1999-05-31 2000-12-08 Hamamatsu Photonics Kk 表面検査方法及び検査装置
US6853446B1 (en) * 1999-08-16 2005-02-08 Applied Materials, Inc. Variable angle illumination wafer inspection system
JP5288672B2 (ja) * 2001-07-11 2013-09-11 株式会社ニコン 表面欠陥検査装置
US7130039B2 (en) * 2002-04-18 2006-10-31 Kla-Tencor Technologies Corporation Simultaneous multi-spot inspection and imaging
US7312432B2 (en) * 2002-07-08 2007-12-25 Dmetrix, Inc. Single axis illumination for multi-axis imaging system
US6788404B2 (en) * 2002-07-17 2004-09-07 Kla-Tencor Technologies Corporation Inspection system with multiple illumination sources
DE10239548A1 (de) * 2002-08-23 2004-03-04 Leica Microsystems Semiconductor Gmbh Vorrichtung und Verfahren zur Inspektion eines Objekts
US20040207836A1 (en) * 2002-09-27 2004-10-21 Rajeshwar Chhibber High dynamic range optical inspection system and method
JP2004163240A (ja) * 2002-11-13 2004-06-10 Silicon Technology Co Ltd 表面評価装置
US6870949B2 (en) * 2003-02-26 2005-03-22 Electro Scientific Industries Coaxial narrow angle dark field lighting
US7130036B1 (en) 2003-09-16 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for inspection of an entire wafer surface using multiple detection channels
US20050146719A1 (en) 2003-09-26 2005-07-07 Rajeshwar Chhibber Method and apparatus for illuminating a substrate during inspection
US7351980B2 (en) * 2005-03-31 2008-04-01 Kla-Tencor Technologies Corp. All-reflective optical systems for broadband wafer inspection
US7345825B2 (en) * 2005-06-30 2008-03-18 Kla-Tencor Technologies Corporation Beam delivery system for laser dark-field illumination in a catadioptric optical system
US7898524B2 (en) * 2005-06-30 2011-03-01 Logitech Europe S.A. Optical displacement detection over varied surfaces
US7725024B2 (en) * 2005-07-08 2010-05-25 Electro Scientific Industries, Inc. Optimizing use and performance of optical systems implemented with telecentric on-axis dark field illumination
JP4723362B2 (ja) 2005-11-29 2011-07-13 株式会社日立ハイテクノロジーズ 光学式検査装置及びその方法
JP4949928B2 (ja) 2006-06-20 2012-06-13 Ｈｏｙａ株式会社 パターン欠陥検査方法、パターン欠陥検査装置、フォトマスク製品の製造方法、及び表示デバイス用基板の製造方法
DE102006042117A1 (de) * 2006-09-07 2008-03-27 Dr. Schenk Gmbh Industriemesstechnik Vorrichtung zur optischen Detektion eines Oberflächenfehlers eines Substrats
CN101021490B (zh) * 2007-03-12 2012-11-14 3i系统公司 平面基板自动检测系统及方法
US7782452B2 (en) 2007-08-31 2010-08-24 Kla-Tencor Technologies Corp. Systems and method for simultaneously inspecting a specimen with two distinct channels
DE112009000832T5 (de) * 2008-04-04 2011-07-28 Nanda Technologies GmbH, 85716 System und Verfahren zur optischen Inspektion

Also Published As

Publication number Publication date
US8368881B2 (en) 2013-02-05
TW200952102A (en) 2009-12-16
DE112009000832T5 (de) 2011-07-28
US20120133760A1 (en) 2012-05-31
US20100231902A1 (en) 2010-09-16
TWI479583B (zh) 2015-04-01
US20110043798A1 (en) 2011-02-24
KR20110000560A (ko) 2011-01-03
US20110043796A1 (en) 2011-02-24
US8072591B2 (en) 2011-12-06
WO2009121628A2 (en) 2009-10-08
CN102016554B (zh) 2013-01-30
KR101697240B1 (ko) 2017-01-17
CN102016554A (zh) 2011-04-13
US8102521B2 (en) 2012-01-24
JP2011516844A (ja) 2011-05-26
US8345232B2 (en) 2013-01-01
WO2009121628A9 (en) 2009-11-26

Similar Documents

Publication Publication Date Title
JP5749641B2 (ja) 光学検査システム及び方法
KR102013083B1 (ko) Euv 이미징을 위한 장치 및 이의 이용 방법
US9588421B2 (en) Pellicle inspection apparatus
KR102835353B1 (ko) 비원형 퓨필을 가진 검사 시스템
JP6470188B2 (ja) 拡大結像光学ユニット及びそのような結像光学ユニットを有するｅｕｖマスク検査系
US20150192459A1 (en) Extreme ultra-violet (euv) inspection systems
JP2006080437A (ja) マスク・ブランクス検査方法及びマスク・ブランク検査ツール
EP2972226B1 (en) Segmented mirror apparatus for imaging and method of using the same
EP3213342A1 (en) All reflective wafer defect inspection and review systems and methods
US9151718B2 (en) Illumination system with time multiplexed sources for reticle inspection

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120330

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120330

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120330

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130724

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131003

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20131224

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140107

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140203

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140826

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141120

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150416

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150514

R150 Certificate of patent or registration of utility model

Ref document number: 5749641

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees