KR101690223B1 - 기판 보지 장치 - Google Patents

기판 보지 장치 Download PDF

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Publication number
KR101690223B1
KR101690223B1 KR1020120025434A KR20120025434A KR101690223B1 KR 101690223 B1 KR101690223 B1 KR 101690223B1 KR 1020120025434 A KR1020120025434 A KR 1020120025434A KR 20120025434 A KR20120025434 A KR 20120025434A KR 101690223 B1 KR101690223 B1 KR 101690223B1
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KR
South Korea
Prior art keywords
pad
suction
holding member
circumferential groove
substrate
Prior art date
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KR1020120025434A
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English (en)
Korean (ko)
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KR20120106586A (ko
Inventor
신이치 하야시
수구루 에노키다
나루아키 이이다
히데키 가지와라
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20120106586A publication Critical patent/KR20120106586A/ko
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Publication of KR101690223B1 publication Critical patent/KR101690223B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020120025434A 2011-03-18 2012-03-13 기판 보지 장치 Active KR101690223B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-060716 2011-03-18
JP2011060716A JP5345167B2 (ja) 2011-03-18 2011-03-18 基板保持装置

Publications (2)

Publication Number Publication Date
KR20120106586A KR20120106586A (ko) 2012-09-26
KR101690223B1 true KR101690223B1 (ko) 2017-01-09

Family

ID=46827834

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120025434A Active KR101690223B1 (ko) 2011-03-18 2012-03-13 기판 보지 장치

Country Status (4)

Country Link
US (1) US8720873B2 (enExample)
JP (1) JP5345167B2 (enExample)
KR (1) KR101690223B1 (enExample)
TW (1) TWI490974B (enExample)

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US9364925B2 (en) * 2012-04-30 2016-06-14 Globalfoundries Inc. Assembly of electronic and optical devices
JP6186124B2 (ja) * 2012-12-14 2017-08-23 東京応化工業株式会社 搬送アーム、搬送装置および搬送方法
KR20140102782A (ko) * 2013-02-14 2014-08-25 삼성전자주식회사 웨이퍼 이송용 블레이드 및 이를 포함하는 웨이퍼 이송 장치
TWI583605B (zh) * 2013-04-16 2017-05-21 xi-cong Lin A glass panel capture device and a method of capturing a glass panel thereof
SG10201402399RA (en) * 2013-05-23 2014-12-30 Asm Tech Singapore Pte Ltd A transfer device for holding an object using a gas flow
JP6127728B2 (ja) * 2013-05-30 2017-05-17 三星ダイヤモンド工業株式会社 脆性材料基板の搬送ヘッド
JP5861677B2 (ja) * 2013-07-08 2016-02-16 株式会社安川電機 吸着構造、ロボットハンドおよびロボット
JP2015013357A (ja) * 2013-07-08 2015-01-22 株式会社安川電機 吸着構造、ロボットハンドおよびロボット
JP2015013358A (ja) * 2013-07-08 2015-01-22 株式会社安川電機 吸着構造、ロボットハンドおよびロボット
JP5929947B2 (ja) * 2014-02-28 2016-06-08 株式会社安川電機 吸着パッド、ロボットハンドおよびロボット
US9991152B2 (en) * 2014-03-06 2018-06-05 Cascade Microtech, Inc. Wafer-handling end effectors with wafer-contacting surfaces and sealing structures
JP6726473B2 (ja) * 2016-02-15 2020-07-22 株式会社ディスコ チャックテーブル機構
JP6298099B2 (ja) * 2016-05-18 2018-03-20 キヤノントッキ株式会社 基板搬送装置
CN106252058A (zh) * 2016-08-22 2016-12-21 泰州新源电工器材有限公司 一种撑条台阶的加工设备及其加工方法
CN106737619B (zh) * 2016-12-27 2023-06-13 高维智控机器人科技(苏州)有限公司 机械手爪
NL2018243B1 (en) * 2017-01-27 2018-08-07 Suss Microtec Lithography Gmbh Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector
JP6442563B1 (ja) * 2017-05-30 2018-12-19 キヤノン株式会社 搬送ハンド、搬送装置、リソグラフィ装置、物品の製造方法及び保持機構
CN107718568A (zh) * 2017-10-19 2018-02-23 深圳市深精电科技有限公司 高周波热压自动上下料设备
CN108461574A (zh) * 2018-01-23 2018-08-28 无锡奥特维科技股份有限公司 电池片堆叠装置及方法
US11600580B2 (en) * 2019-02-27 2023-03-07 Applied Materials, Inc. Replaceable end effector contact pads, end effectors, and maintenance methods
EP3772089B1 (en) * 2019-07-30 2021-05-26 Semsysco GmbH Substrate handling device for a wafer
JP7497150B2 (ja) * 2019-12-03 2024-06-10 キヤノン株式会社 搬送装置、リソグラフィ装置及び物品の製造方法
EP3851916A1 (en) 2020-01-17 2021-07-21 ASML Netherlands B.V. Suction clamp, object handler, stage apparatus and lithographic apparatus
CN111498496A (zh) * 2020-05-07 2020-08-07 杭州赴戎科技有限公司 一种利用吸盘吸力对于主板进行出厂检测的装置
KR102826478B1 (ko) 2020-08-25 2025-06-30 주식회사 제우스 기판처리장치 및 기판처리방법
KR102556368B1 (ko) * 2020-10-30 2023-07-18 세메스 주식회사 반송 핸드 및 기판 처리 장치
CN112606031A (zh) * 2020-12-21 2021-04-06 昀智科技（北京）有限责任公司 真空吸附式环形末端夹持器
JP7720185B2 (ja) 2021-07-15 2025-08-07 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
US12337467B2 (en) 2022-12-09 2025-06-24 Formfactor, Inc. Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors
JP7716828B2 (ja) * 2023-11-30 2025-08-01 平田機工株式会社 ハンド、搬送装置、及び被搬送物の搬送方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001341090A (ja) 2000-06-05 2001-12-11 Shinano Electronics:Kk 真空把持装置及びｉｃテストハンドラ
JP2007053313A (ja) 2005-08-19 2007-03-01 Yaskawa Electric Corp 基板吸着装置とそれを用いた基板搬送装置
US7669903B2 (en) 2007-10-11 2010-03-02 Crossing Automation, Inc. Ultra low contact area end effector
JP2011029388A (ja) 2009-07-24 2011-02-10 Tokyo Electron Ltd 真空吸着パッド、搬送アーム及び基板搬送装置

Family Cites Families (9)

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JPH08143147A (ja) * 1994-11-18 1996-06-04 Metsukusu:Kk 薄板状ワークの吸着装置
JP3122590B2 (ja) 1994-12-28 2001-01-09 株式会社三協精機製作所 吸着パッド
US6652362B2 (en) * 2000-11-23 2003-11-25 Samsung Electronics Co., Ltd. Apparatus for polishing a semiconductor wafer and method therefor
US6942265B1 (en) * 2002-10-23 2005-09-13 Kla-Tencor Technologies Corporation Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto
JP4614455B2 (ja) * 2006-04-19 2011-01-19 東京エレクトロン株式会社 基板搬送処理装置
KR101534357B1 (ko) * 2009-03-31 2015-07-06 도쿄엘렉트론가부시키가이샤 기판 지지 장치 및 기판 지지 방법
JP5338777B2 (ja) * 2010-09-02 2013-11-13 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5490741B2 (ja) * 2011-03-02 2014-05-14 東京エレクトロン株式会社 基板搬送装置の位置調整方法、及び基板処理装置
USD674761S1 (en) * 2011-10-20 2013-01-22 Tokyo Electron Limited Wafer holding member

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001341090A (ja) 2000-06-05 2001-12-11 Shinano Electronics:Kk 真空把持装置及びｉｃテストハンドラ
JP2007053313A (ja) 2005-08-19 2007-03-01 Yaskawa Electric Corp 基板吸着装置とそれを用いた基板搬送装置
US7669903B2 (en) 2007-10-11 2010-03-02 Crossing Automation, Inc. Ultra low contact area end effector
JP2011029388A (ja) 2009-07-24 2011-02-10 Tokyo Electron Ltd 真空吸着パッド、搬送アーム及び基板搬送装置

Also Published As

Publication number Publication date
US8720873B2 (en) 2014-05-13
US20120235335A1 (en) 2012-09-20
TW201250916A (en) 2012-12-16
JP5345167B2 (ja) 2013-11-20
TWI490974B (zh) 2015-07-01
JP2012199282A (ja) 2012-10-18
KR20120106586A (ko) 2012-09-26

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