KR101686450B1 - 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 장치 - Google Patents

경화성 실리콘 조성물, 이의 경화물, 및 광반도체 장치 Download PDF

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KR101686450B1
KR101686450B1 KR1020157020136A KR20157020136A KR101686450B1 KR 101686450 B1 KR101686450 B1 KR 101686450B1 KR 1020157020136 A KR1020157020136 A KR 1020157020136A KR 20157020136 A KR20157020136 A KR 20157020136A KR 101686450 B1 KR101686450 B1 KR 101686450B1
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group
component
sio
carbon atoms
curable silicone
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KR20150103108A (ko
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가즈히로 니시지마
다카시 사가와
도모히로 이이무라
미치타카 스토
가스미 다케우치
하루히코 후루카와
요시쓰구 모리타
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다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H01L33/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
KR1020157020136A 2012-12-28 2013-12-24 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 장치 Active KR101686450B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012288122A JP5985981B2 (ja) 2012-12-28 2012-12-28 硬化性シリコーン組成物、その硬化物、および光半導体装置
JPJP-P-2012-288122 2012-12-28
PCT/JP2013/085314 WO2014104389A2 (en) 2012-12-28 2013-12-24 Curable silicone composition, cured product thereof, and optical semiconductor device

Publications (2)

Publication Number Publication Date
KR20150103108A KR20150103108A (ko) 2015-09-09
KR101686450B1 true KR101686450B1 (ko) 2016-12-14

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KR1020157020136A Active KR101686450B1 (ko) 2012-12-28 2013-12-24 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 장치

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Country Link
US (1) US9752032B2 (enExample)
EP (1) EP2938655B1 (enExample)
JP (1) JP5985981B2 (enExample)
KR (1) KR101686450B1 (enExample)
CN (1) CN104968711B (enExample)
TW (1) TWI623586B (enExample)
WO (1) WO2014104389A2 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015136820A1 (ja) * 2014-03-12 2015-09-17 横浜ゴム株式会社 硬化性樹脂組成物
JPWO2017110468A1 (ja) 2015-12-24 2018-10-18 Jnc株式会社 熱硬化性樹脂組成物
CN109790385B (zh) * 2016-09-30 2021-09-21 日产化学株式会社 交联性有机聚硅氧烷组合物、其固化物及led装置
CN106634807A (zh) * 2016-10-28 2017-05-10 烟台德邦先进硅材料有限公司 一种萘基超高折led封装硅胶
CN106633076B (zh) * 2016-12-29 2017-12-19 广州市斯洛柯高分子聚合物有限公司 一种有机硅弹性体凝胶及其制备方法
CN106866722B (zh) * 2017-01-12 2020-05-12 复旦大学 一种含苯并环丁烯官能化的有机硅化合物及其制备方法
JP6863878B2 (ja) * 2017-11-02 2021-04-21 信越化学工業株式会社 付加硬化型シリコーン組成物、硬化物、及び光学素子
JP6823578B2 (ja) * 2017-11-02 2021-02-03 信越化学工業株式会社 付加硬化型シリコーン組成物、硬化物、光学素子
TWI787444B (zh) * 2018-02-07 2022-12-21 日商陶氏東麗股份有限公司 可固化聚矽氧組成物、其固化產物、及光學半導體裝置
JP6905486B2 (ja) * 2018-03-13 2021-07-21 信越化学工業株式会社 付加硬化型シリコーン組成物、シリコーン硬化物、及び半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
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WO2009154260A1 (en) 2008-06-18 2009-12-23 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition and semiconductor device
US20120056236A1 (en) 2010-09-02 2012-03-08 Yoshihira Hamamoto Low gas permeable silicone resin composition and optoelectronic device

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JP2004186168A (ja) * 2002-11-29 2004-07-02 Shin Etsu Chem Co Ltd 発光ダイオード素子用シリコーン樹脂組成物
JP2005089671A (ja) * 2003-09-19 2005-04-07 Shin Etsu Chem Co Ltd 硬化性シリコーン樹脂組成物
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
WO2007100445A2 (en) * 2006-02-24 2007-09-07 Dow Corning Corporation Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
JP5469874B2 (ja) * 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
JP5499774B2 (ja) * 2009-03-04 2014-05-21 信越化学工業株式会社 光半導体封止用組成物及びそれを用いた光半導体装置
DE202011110489U1 (de) * 2010-01-25 2014-04-17 Lg Chem, Ltd. Härtbare Zusammensetzung
JP2012052035A (ja) 2010-09-01 2012-03-15 Shin-Etsu Chemical Co Ltd 付加硬化型シリコーン組成物、該組成物からなる光学素子封止材、及び該光学素子封止材の硬化物により光学素子が封止された半導体装置
WO2012093907A2 (ko) 2011-01-06 2012-07-12 주식회사 엘지화학 경화성 조성물
JP5652387B2 (ja) 2011-12-22 2015-01-14 信越化学工業株式会社 高信頼性硬化性シリコーン樹脂組成物及びそれを使用した光半導体装置
WO2014017885A1 (ko) 2012-07-27 2014-01-30 주식회사 엘지화학 경화성 조성물
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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009154260A1 (en) 2008-06-18 2009-12-23 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition and semiconductor device
US20120056236A1 (en) 2010-09-02 2012-03-08 Yoshihira Hamamoto Low gas permeable silicone resin composition and optoelectronic device

Also Published As

Publication number Publication date
JP5985981B2 (ja) 2016-09-06
KR20150103108A (ko) 2015-09-09
EP2938655B1 (en) 2016-09-14
US9752032B2 (en) 2017-09-05
WO2014104389A2 (en) 2014-07-03
WO2014104389A3 (en) 2014-08-21
EP2938655A2 (en) 2015-11-04
CN104968711B (zh) 2018-04-27
TWI623586B (zh) 2018-05-11
TW201431960A (zh) 2014-08-16
US20150344692A1 (en) 2015-12-03
CN104968711A (zh) 2015-10-07
JP2014129478A (ja) 2014-07-10

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