KR101667879B1 - 전자 부품의 수지 밀봉 방법 및 수지 밀봉 장치 - Google Patents

전자 부품의 수지 밀봉 방법 및 수지 밀봉 장치 Download PDF

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KR101667879B1
KR101667879B1 KR1020150052469A KR20150052469A KR101667879B1 KR 101667879 B1 KR101667879 B1 KR 101667879B1 KR 1020150052469 A KR1020150052469 A KR 1020150052469A KR 20150052469 A KR20150052469 A KR 20150052469A KR 101667879 B1 KR101667879 B1 KR 101667879B1
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South Korea
Prior art keywords
mold
cavity
block
air vent
resin
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Korean (ko)
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KR20150137992A (ko
Inventor
도모노리 히메노
노부유키 모로하시
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토와 가부시기가이샤
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    • H01L23/28—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • H01L21/56—

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR1020150052469A 2014-05-29 2015-04-14 전자 부품의 수지 밀봉 방법 및 수지 밀봉 장치 Active KR101667879B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014111374A JP6320172B2 (ja) 2014-05-29 2014-05-29 電子部品の樹脂封止方法及び樹脂封止装置
JPJP-P-2014-111374 2014-05-29

Publications (2)

Publication Number Publication Date
KR20150137992A KR20150137992A (ko) 2015-12-09
KR101667879B1 true KR101667879B1 (ko) 2016-10-19

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KR1020150052469A Active KR101667879B1 (ko) 2014-05-29 2015-04-14 전자 부품의 수지 밀봉 방법 및 수지 밀봉 장치

Country Status (6)

Country Link
JP (1) JP6320172B2 (https=)
KR (1) KR101667879B1 (https=)
CN (1) CN105280506B (https=)
MY (1) MY172522A (https=)
SG (1) SG10201504081PA (https=)
TW (1) TWI602680B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6654861B2 (ja) * 2015-11-09 2020-02-26 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
EP3188260B1 (en) * 2015-12-31 2020-02-12 Dow Global Technologies Llc Nanostructure material structures and methods
JP6654971B2 (ja) * 2016-06-17 2020-02-26 本田技研工業株式会社 樹脂成形部材の成形方法及び成形システム
JP6436260B1 (ja) * 2018-05-31 2018-12-12 株式会社玉谷製作所 ピン、スリーブ又は入れ子
JP6981935B2 (ja) * 2018-08-23 2021-12-17 アピックヤマダ株式会社 モールド金型及びそれを備えた樹脂モールド装置
JP7171897B2 (ja) * 2018-08-30 2022-11-15 ハスキー インジェクション モールディング システムズ リミテッド プラスチック成形用の溶解ディスペンサー
JP6678973B1 (ja) * 2019-04-09 2020-04-15 アサヒ・エンジニアリング株式会社 樹脂封止装置および樹脂封止方法
CN111531802B (zh) * 2020-04-27 2025-07-22 芜湖鼎联电子科技有限公司 一种用于功率半导体器件封装的无重熔高温高压注塑模具
CN111775392B (zh) * 2020-08-03 2025-02-18 昆山大全凯帆精密模具有限公司 一种bmc&dmc传递压制模具和加工方法
JP7661285B2 (ja) * 2022-07-15 2025-04-14 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
CN115923049B (zh) * 2022-11-04 2026-01-06 神通科技集团股份有限公司 一种用于双色模的一次料头模内切除机构及双色模
WO2025116643A1 (ko) * 2023-12-01 2025-06-05 삼성전자 주식회사 밀봉 부재를 배치하기 위한 수리 키트 장치
CN119408074A (zh) * 2025-01-07 2025-02-11 北京七星华创微电子有限责任公司 一种foplp封装加工用注塑模具结构

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013049253A (ja) 2011-08-31 2013-03-14 Towa Corp 電子部品の樹脂封止成形方法及び装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61292926A (ja) * 1985-06-21 1986-12-23 Hitachi Hokkai Semiconductor Ltd モ−ルド方法およびモ−ルド装置
JPH06210658A (ja) * 1993-01-19 1994-08-02 Toshiba Corp 樹脂成形用金型装置
JP2875479B2 (ja) * 1994-09-08 1999-03-31 日本ペルノックス株式会社 半導体の封止方法
KR100533067B1 (ko) * 1999-12-16 2005-12-02 다이-이치 세이코 가부시키가이샤 수지봉지용 금형장치
JP2007152831A (ja) * 2005-12-07 2007-06-21 Sharp Corp 可動エアベントおよびそれを備えたモールド成形装置、並びに電子部品の製造方法
JP5138470B2 (ja) * 2008-06-06 2013-02-06 アピックヤマダ株式会社 トランスファモールド装置とこれを用いたトランスファモールド方法
JP5140517B2 (ja) * 2008-08-07 2013-02-06 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
JP2013184413A (ja) * 2012-03-08 2013-09-19 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
JP5930394B2 (ja) * 2012-07-06 2016-06-08 アピックヤマダ株式会社 樹脂モールド装置
JP6058431B2 (ja) * 2013-03-08 2017-01-11 アピックヤマダ株式会社 樹脂モールド装置、および樹脂モールド方法
JP6259263B2 (ja) * 2013-11-11 2018-01-10 アピックヤマダ株式会社 樹脂モールド金型および樹脂モールド成形方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013049253A (ja) 2011-08-31 2013-03-14 Towa Corp 電子部品の樹脂封止成形方法及び装置

Also Published As

Publication number Publication date
TW201603986A (zh) 2016-02-01
JP2015226014A (ja) 2015-12-14
JP6320172B2 (ja) 2018-05-09
KR20150137992A (ko) 2015-12-09
MY172522A (en) 2019-11-28
CN105280506A (zh) 2016-01-27
TWI602680B (zh) 2017-10-21
CN105280506B (zh) 2018-06-08
SG10201504081PA (en) 2015-12-30

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