KR101664993B1 - 캐리어 부착 극박 동박, 동 클래드 적층판 및 코어레스 기판 - Google Patents

캐리어 부착 극박 동박, 동 클래드 적층판 및 코어레스 기판 Download PDF

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Publication number
KR101664993B1
KR101664993B1 KR1020157019788A KR20157019788A KR101664993B1 KR 101664993 B1 KR101664993 B1 KR 101664993B1 KR 1020157019788 A KR1020157019788 A KR 1020157019788A KR 20157019788 A KR20157019788 A KR 20157019788A KR 101664993 B1 KR101664993 B1 KR 101664993B1
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KR
South Korea
Prior art keywords
carrier
ultra
copper foil
foil
thin copper
Prior art date
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KR1020157019788A
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English (en)
Korean (ko)
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KR20150122632A (ko
Inventor
료타 후지타
타케오 우노
Original Assignee
후루카와 덴키 고교 가부시키가이샤
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Publication of KR20150122632A publication Critical patent/KR20150122632A/ko
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing & Machinery (AREA)
KR1020157019788A 2013-02-26 2014-02-25 캐리어 부착 극박 동박, 동 클래드 적층판 및 코어레스 기판 KR101664993B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-035852 2013-02-26
JP2013035852 2013-02-26
PCT/JP2014/054457 WO2014132947A1 (ja) 2013-02-26 2014-02-25 キャリア付き極薄銅箔、銅張積層板並びにコアレス基板

Publications (2)

Publication Number Publication Date
KR20150122632A KR20150122632A (ko) 2015-11-02
KR101664993B1 true KR101664993B1 (ko) 2016-10-11

Family

ID=51428211

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157019788A KR101664993B1 (ko) 2013-02-26 2014-02-25 캐리어 부착 극박 동박, 동 클래드 적층판 및 코어레스 기판

Country Status (5)

Country Link
JP (1) JP5755371B2 (zh)
KR (1) KR101664993B1 (zh)
CN (1) CN105074058B (zh)
TW (1) TWI593830B (zh)
WO (1) WO2014132947A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018009237A (ja) * 2016-07-15 2018-01-18 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
KR101944783B1 (ko) 2017-01-16 2019-04-18 일진머티리얼즈 주식회사 캐리어박 부착 극박동박
TWI745574B (zh) * 2017-03-29 2021-11-11 日商昭和電工材料股份有限公司 無芯基板用預浸體、無芯基板、無芯基板的製造方法及半導體封裝體
KR102137068B1 (ko) * 2019-11-27 2020-07-23 와이엠티 주식회사 캐리어박 부착 금속박, 이의 제조방법 및 이를 포함하는 적층체

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012102407A (ja) * 2005-12-15 2012-05-31 Furukawa Electric Co Ltd:The キャリア付き極薄銅箔及びプリント配線板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001089892A (ja) * 1999-09-21 2001-04-03 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びその製造方法並びにそのキャリア箔付電解銅箔を用いた銅張積層板
US6893742B2 (en) * 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement
LU90804B1 (fr) * 2001-07-18 2003-01-20 Circuit Foil Luxembourg Trading Sarl Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards
TW200609109A (en) * 2004-08-02 2006-03-16 Nippon Denkai Ltd Composite copper foil and method for production thereof
JP4934409B2 (ja) * 2005-12-15 2012-05-16 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP4927503B2 (ja) * 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP4805300B2 (ja) * 2008-03-31 2011-11-02 古河電気工業株式会社 回路基板積層用キャリア付きＦｅ−Ｎｉ合金箔の製造方法、回路基板積層用キャリア付き複合箔の製造方法、キャリア付き合金箔、キャリア付き複合箔、金属張板、プリント配線板及びプリント配線積層板
JP4805304B2 (ja) * 2008-05-12 2011-11-02 Ｊｘ日鉱日石金属株式会社 キャリヤー付き金属箔及び多層コアレス回路基板の製造方法
EP2336395A1 (en) * 2008-09-05 2011-06-22 Furukawa Electric Co., Ltd. Ultrathin copper foil with carrier, and copper laminated board or printed wiring board
TWI569705B (zh) * 2011-03-30 2017-02-01 三井金屬礦業股份有限公司 多層印刷配線板的製造方法及以該製造方法所得之多層印刷配線板
JP5666384B2 (ja) * 2011-05-31 2015-02-12 日本電解株式会社 支持体付極薄銅箔とその製造方法
CN103392028B (zh) * 2011-08-31 2016-01-06 Jx日矿日石金属株式会社 附载体铜箔

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012102407A (ja) * 2005-12-15 2012-05-31 Furukawa Electric Co Ltd:The キャリア付き極薄銅箔及びプリント配線板

Also Published As

Publication number Publication date
JPWO2014132947A1 (ja) 2017-02-02
TWI593830B (zh) 2017-08-01
JP5755371B2 (ja) 2015-07-29
KR20150122632A (ko) 2015-11-02
WO2014132947A1 (ja) 2014-09-04
CN105074058B (zh) 2016-11-23
CN105074058A (zh) 2015-11-18
TW201437436A (zh) 2014-10-01

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