KR101659146B1 - 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 - Google Patents

기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 Download PDF

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Publication number
KR101659146B1
KR101659146B1 KR1020140055776A KR20140055776A KR101659146B1 KR 101659146 B1 KR101659146 B1 KR 101659146B1 KR 1020140055776 A KR1020140055776 A KR 1020140055776A KR 20140055776 A KR20140055776 A KR 20140055776A KR 101659146 B1 KR101659146 B1 KR 101659146B1
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KR
South Korea
Prior art keywords
external electrode
electrode
external
ceramic body
thickness
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KR1020140055776A
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English (en)
Korean (ko)
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KR20150046712A (ko
Inventor
최영돈
Original Assignee
삼성전기주식회사
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Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to TW103129652A priority Critical patent/TWI686825B/zh
Priority to US14/475,185 priority patent/US9786434B2/en
Priority to CN201410479721.5A priority patent/CN104576050B/zh
Publication of KR20150046712A publication Critical patent/KR20150046712A/ko
Application granted granted Critical
Publication of KR101659146B1 publication Critical patent/KR101659146B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
KR1020140055776A 2013-10-22 2014-05-09 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 KR101659146B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW103129652A TWI686825B (zh) 2013-10-22 2014-08-28 多層陶瓷電子組件及具有該電子組件的印刷電路板
US14/475,185 US9786434B2 (en) 2013-10-22 2014-09-02 Multilayer ceramic electronic component and printed circuit board having the same
CN201410479721.5A CN104576050B (zh) 2013-10-22 2014-09-18 多层陶瓷电子组件和具有多层陶瓷电子组件的印刷电路板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020130126138 2013-10-22
KR20130126138 2013-10-22

Publications (2)

Publication Number Publication Date
KR20150046712A KR20150046712A (ko) 2015-04-30
KR101659146B1 true KR101659146B1 (ko) 2016-09-22

Family

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Family Applications (1)

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KR1020140055776A KR101659146B1 (ko) 2013-10-22 2014-05-09 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판

Country Status (3)

Country Link
KR (1) KR101659146B1 (zh)
CN (1) CN104576050B (zh)
TW (1) TWI686825B (zh)

Cited By (1)

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KR20190002331A (ko) * 2017-06-29 2019-01-08 다이요 유덴 가부시키가이샤 세라믹 전자 부품 및 그 제조 방법, 및 전자 부품 실장 기판

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US9922770B2 (en) * 2014-12-26 2018-03-20 Taiyo Yuden Co., Ltd. Through-type multilayer ceramic capacitor
JP6373247B2 (ja) * 2015-07-27 2018-08-15 太陽誘電株式会社 積層セラミック電子部品及びその製造方法
TWI574595B (zh) * 2015-10-28 2017-03-11 財團法人工業技術研究院 多層線路的製作方法與多層線路結構
TWI563886B (en) * 2015-10-28 2016-12-21 Ind Tech Res Inst Insulating colloidal material and multilayer circuit structure
JP2017112170A (ja) * 2015-12-15 2017-06-22 株式会社村田製作所 コンデンサ
JP2017117865A (ja) * 2015-12-22 2017-06-29 株式会社村田製作所 コンデンサ及びコンデンサ内蔵基板
KR102225504B1 (ko) * 2015-12-24 2021-03-10 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
KR102283084B1 (ko) * 2015-12-24 2021-07-30 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
KR102198538B1 (ko) * 2015-12-29 2021-01-06 삼성전기주식회사 적층 전자 부품
JP2017183574A (ja) * 2016-03-31 2017-10-05 株式会社村田製作所 電子部品及び電子部品内蔵型基板
JP2017216328A (ja) * 2016-05-31 2017-12-07 株式会社村田製作所 セラミックコンデンサ
JP2017216329A (ja) * 2016-05-31 2017-12-07 株式会社村田製作所 セラミックコンデンサ
JP6809865B2 (ja) * 2016-10-17 2021-01-06 太陽誘電株式会社 セラミック電子部品及びその製造方法
JP6793027B2 (ja) * 2016-12-16 2020-12-02 太陽誘電株式会社 積層セラミック電子部品
US11430940B2 (en) * 2017-07-18 2022-08-30 Taiyo Yuden Co., Ltd. Multilayer piezoelectric element, piezoelectric vibration apparatus, and electronic device
US11744156B2 (en) * 2017-08-07 2023-08-29 Taiyo Yuden Co., Ltd. Multilayer piezoelectric element, piezoelectric vibration apparatus, and electronic device
US10892100B2 (en) * 2018-02-19 2021-01-12 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor
KR102185055B1 (ko) * 2018-10-02 2020-12-01 삼성전기주식회사 적층 세라믹 전자부품
KR102620518B1 (ko) * 2019-04-17 2024-01-03 삼성전기주식회사 적층 세라믹 전자부품
JP7379899B2 (ja) * 2019-07-22 2023-11-15 Tdk株式会社 セラミック電子部品
KR20190116158A (ko) * 2019-08-23 2019-10-14 삼성전기주식회사 적층형 전자 부품

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JP4405477B2 (ja) * 2005-08-05 2010-01-27 日本特殊陶業株式会社 配線基板及びその製造方法、埋め込み用セラミックチップ
JP2012156191A (ja) * 2011-01-24 2012-08-16 Tdk Corp 積層型電子部品及び電子部品の実装構造

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DE3809922A1 (de) * 1988-03-24 1989-10-05 Fischer Artur Werke Gmbh Spielbauelement mit einem verbindungszapfen
CN100418769C (zh) * 2002-11-25 2008-09-17 京瓷株式会社 压电陶瓷、促动器及其制造方法、印刷头及喷墨打印机
US7932471B2 (en) * 2005-08-05 2011-04-26 Ngk Spark Plug Co., Ltd. Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment
KR101401863B1 (ko) 2008-01-30 2014-05-29 엘지전자 주식회사 커패시터 내장형 인쇄회로기판 및 그 제조방법
JP2011192968A (ja) * 2010-02-19 2011-09-29 Murata Mfg Co Ltd コンデンサ及びその製造方法
JP2012156315A (ja) * 2011-01-26 2012-08-16 Murata Mfg Co Ltd 積層セラミック電子部品

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4405477B2 (ja) * 2005-08-05 2010-01-27 日本特殊陶業株式会社 配線基板及びその製造方法、埋め込み用セラミックチップ
JP2012156191A (ja) * 2011-01-24 2012-08-16 Tdk Corp 積層型電子部品及び電子部品の実装構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190002331A (ko) * 2017-06-29 2019-01-08 다이요 유덴 가부시키가이샤 세라믹 전자 부품 및 그 제조 방법, 및 전자 부품 실장 기판
KR102567209B1 (ko) * 2017-06-29 2023-08-16 다이요 유덴 가부시키가이샤 세라믹 전자 부품 및 그 제조 방법, 및 전자 부품 실장 기판

Also Published As

Publication number Publication date
CN104576050A (zh) 2015-04-29
CN104576050B (zh) 2017-08-01
TWI686825B (zh) 2020-03-01
TW201526051A (zh) 2015-07-01
KR20150046712A (ko) 2015-04-30

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