KR101641475B1 - 판상 제품의 전해 처리를 위한 장치 및 방법 - Google Patents

판상 제품의 전해 처리를 위한 장치 및 방법 Download PDF

Info

Publication number
KR101641475B1
KR101641475B1 KR1020157013377A KR20157013377A KR101641475B1 KR 101641475 B1 KR101641475 B1 KR 101641475B1 KR 1020157013377 A KR1020157013377 A KR 1020157013377A KR 20157013377 A KR20157013377 A KR 20157013377A KR 101641475 B1 KR101641475 B1 KR 101641475B1
Authority
KR
South Korea
Prior art keywords
product
nozzle
flow
treatment
counter electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020157013377A
Other languages
English (en)
Korean (ko)
Other versions
KR20150071031A (ko
Inventor
라인하르트 슈나이더
헨리 쿤체
페르디난트 비에너
Original Assignee
아토테크더치랜드게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아토테크더치랜드게엠베하 filed Critical 아토테크더치랜드게엠베하
Publication of KR20150071031A publication Critical patent/KR20150071031A/ko
Application granted granted Critical
Publication of KR101641475B1 publication Critical patent/KR101641475B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Coating Apparatus (AREA)
KR1020157013377A 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법 Expired - Fee Related KR101641475B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007026633.4 2007-06-06
DE102007026633A DE102007026633B4 (de) 2007-06-06 2007-06-06 Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware
PCT/EP2008/004616 WO2008148578A1 (en) 2007-06-06 2008-06-03 Apparatus and method for the electrolytic treatment of a plate-shaped product

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020097025444A Division KR20100019481A (ko) 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법

Publications (2)

Publication Number Publication Date
KR20150071031A KR20150071031A (ko) 2015-06-25
KR101641475B1 true KR101641475B1 (ko) 2016-07-20

Family

ID=39712035

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020157013377A Expired - Fee Related KR101641475B1 (ko) 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법
KR1020097025444A Ceased KR20100019481A (ko) 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020097025444A Ceased KR20100019481A (ko) 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법

Country Status (11)

Country Link
US (1) US8545687B2 (cg-RX-API-DMAC7.html)
EP (1) EP2176450B9 (cg-RX-API-DMAC7.html)
JP (2) JP2010530029A (cg-RX-API-DMAC7.html)
KR (2) KR101641475B1 (cg-RX-API-DMAC7.html)
CN (1) CN101730760B (cg-RX-API-DMAC7.html)
AT (1) ATE519872T1 (cg-RX-API-DMAC7.html)
BR (1) BRPI0812259A2 (cg-RX-API-DMAC7.html)
DE (1) DE102007026633B4 (cg-RX-API-DMAC7.html)
PL (1) PL2176450T3 (cg-RX-API-DMAC7.html)
TW (1) TWI433965B (cg-RX-API-DMAC7.html)
WO (1) WO2008148578A1 (cg-RX-API-DMAC7.html)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5243536B2 (ja) * 2007-06-05 2013-07-24 ネステク ソシエテ アノニム 遠心分離によって容器内に収容される食品液体を生成するためのカプセルシステム、装置、および方法
US8431175B2 (en) * 2007-06-05 2013-04-30 Nestec S.A. Method for preparing a beverage or food liquid and system using brewing centrifugal force
BRPI0812195B1 (pt) * 2007-06-05 2018-11-21 Nestec Sa cápsula de uso único para preparação de um líquido alimentício por centrifugação
EP2155019B1 (en) * 2007-06-05 2011-04-06 Nestec S.A. Method for preparing a beverage or liquid food
CN101687592B (zh) * 2007-06-05 2011-07-20 雀巢产品技术援助有限公司 用于通过离心法来制备液态食品的胶囊和方法
JP5457455B2 (ja) * 2008-09-02 2014-04-02 ネステク ソシエテ アノニム 遠心力を使用した制御型飲料製造装置
WO2010026045A1 (en) 2008-09-02 2010-03-11 Nestec S.A. Method for preparing a food liquid contained in a capsule by centrifugation and system adapted for such method
US9095236B2 (en) 2008-12-09 2015-08-04 Nestec S.A. Liquid food preparation system for preparing a liquid food by centrifugation
JP5375596B2 (ja) * 2009-02-19 2013-12-25 株式会社デンソー 噴流式めっき方法および装置
ES2535755T3 (es) * 2009-08-19 2015-05-14 Nestec S.A. Cápsula para la preparación de un extracto de café provista de una estructura que facilita la perforación por inyección de agua
US8658232B2 (en) * 2009-08-28 2014-02-25 Nestec S.A. Capsule system for the preparation of beverages by centrifugation
US9668604B2 (en) 2009-08-28 2017-06-06 Nestec S.A. Capsule system for the preparation of beverages by centrifugation
DE102010033256A1 (de) 2010-07-29 2012-02-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Methode zur Erzeugung gezielter Strömungs- und Stromdichtemuster bei der chemischen und elektrolytischen Oberflächenbehandlung
WO2012073501A1 (ja) * 2010-12-01 2012-06-07 マルイ鍍金工業株式会社 電解液、電解ケース、電解研磨システムおよび、それらを用いた電解研磨方法
EP2518187A1 (en) 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
US20140083842A1 (en) * 2012-09-25 2014-03-27 Almex Pe Inc. Serial plating system
EP2746432A1 (en) * 2012-12-20 2014-06-25 Atotech Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
ITMI20130466A1 (it) * 2013-03-27 2014-09-28 Qualital Servizi S R L Sistema di pretrattamento alla verniciatura dell'alluminio mediante una tecnica innovativa di ossidazione anodica.
EP2813601A1 (en) 2013-06-14 2014-12-17 ATOTECH Deutschland GmbH Device for moving a substrate holder during a vertical gal-vanic metal deposition, and a method for vertical galvanic metal deposition using such a device
WO2015136353A1 (en) * 2014-03-11 2015-09-17 Qualital Servizi S.R.L. Plant and process for the anodizing treatment of products made of aluminium or its alloys
CN105063709B (zh) * 2015-09-18 2018-02-23 安捷利电子科技（苏州）有限公司 印刷电路板用电镀装置
EP3176288A1 (en) 2015-12-03 2017-06-07 ATOTECH Deutschland GmbH Method for galvanic metal deposition
WO2017213021A1 (ja) * 2016-06-09 2017-12-14 Ｊｆｅスチール株式会社 電気めっき鋼板の製造方法およびその製造装置
EP3287550B1 (en) * 2016-08-23 2019-02-13 ATOTECH Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
JP6995544B2 (ja) 2017-09-20 2022-01-14 上村工業株式会社 表面処理装置および表面処理方法
CN113943966A (zh) * 2020-07-16 2022-01-18 南通深南电路有限公司 一种电路板的电镀装置和电镀方法
CN112899743B (zh) * 2021-01-19 2021-09-21 鑫巨(深圳)半导体科技有限公司 一种电镀装置及电镀方法
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
CN117964183B (zh) * 2024-04-02 2024-06-07 生态环境部华南环境科学研究所(生态环境部生态环境应急研究所) 一种苯胺类事故废水应急处置方法及一体化装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005097732A (ja) 2003-08-21 2005-04-14 Ebara Corp めっき装置

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963588A (en) * 1975-04-21 1976-06-15 United States Steel Corporation Coalescent-jet apparatus and method for high current density preferential electroplating
US4043891A (en) * 1976-01-14 1977-08-23 Bell Telephone Laboratories, Incorporated Electrolytic cell with bipolar electrodes
JPS5836079B2 (ja) * 1980-12-02 1983-08-06 日鉱エンジニアリング株式会社 金属表面処理装置
JPS57210989A (en) 1981-02-10 1982-12-24 Hiroshige Sawa Electroplating method
CA1190514A (en) 1981-06-25 1985-07-16 George R. Scanlon High speed plating of flat planar workpieces
US4622917A (en) * 1982-09-27 1986-11-18 Etd Technology, Inc. Apparatus and method for electroless plating
US4443304A (en) * 1982-10-01 1984-04-17 Micro-Plate, Inc. Plating system and method
JPS59181873U (ja) * 1983-05-21 1984-12-04 株式会社　中央製作所 板状被表面処理物のメツキ処理装置
DE3804070C3 (de) 1988-02-10 1994-02-24 Siemens Nixdorf Inf Syst Galvanisieranlage für Leiterplatten
JPH07113159B2 (ja) 1988-08-29 1995-12-06 日本電装株式会社 めっき装置
JPH0826480B2 (ja) * 1989-03-28 1996-03-13 日本エレクトロプレイテイング・エンジニヤース株式会社 メッキ装置及びメッキ金属の補給方法
DE4133561C2 (de) 1991-10-10 1994-02-03 Reinhard Kissler Gmbh Verfahren und Vorrichtung zum Galvanisieren von Waren
DE4322378A1 (de) 1993-07-06 1995-01-12 Hans Henig Verfahren und Einrichtung zur Oberflächenbehandlung vornehmlich plattenförmiger Werkstücke in horizontaler Betriebslage
US5421987A (en) * 1993-08-30 1995-06-06 Tzanavaras; George Precision high rate electroplating cell and method
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages
JP3438387B2 (ja) 1995-03-16 2003-08-18 株式会社デンソー めっき装置およびめっき方法
JP3352352B2 (ja) 1997-03-31 2002-12-03 新光電気工業株式会社 めっき装置、めっき方法およびバンプの形成方法
DE19717512C3 (de) 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
US5865984A (en) * 1997-06-30 1999-02-02 International Business Machines Corporation Electrochemical etching apparatus and method for spirally etching a workpiece
US6103096A (en) * 1997-11-12 2000-08-15 International Business Machines Corporation Apparatus and method for the electrochemical etching of a wafer
CN1222641C (zh) 1998-02-12 2005-10-12 Acm研究公司 电镀设备及方法
JPH11288893A (ja) * 1998-04-03 1999-10-19 Nec Corp 半導体製造装置及び半導体装置の製造方法
US6132586A (en) * 1998-06-11 2000-10-17 Integrated Process Equipment Corporation Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly
US6610190B2 (en) * 2000-11-03 2003-08-26 Nutool, Inc. Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate
US6984302B2 (en) * 1998-12-30 2006-01-10 Intel Corporation Electroplating cell based upon rotational plating solution flow
JP4175528B2 (ja) * 1999-02-25 2008-11-05 株式会社ナウケミカル めっき装置
JP3352081B2 (ja) * 2001-02-01 2002-12-03 株式会社アスカエンジニアリング プリント基板の銅めっき装置
US6989084B2 (en) * 2001-11-02 2006-01-24 Rockwell Scientific Licensing, Llc Semiconductor wafer plating cell assembly
JP2005520930A (ja) * 2001-12-24 2005-07-14 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ ウェハ表面を電気メッキするための装置および方法
JP4330380B2 (ja) * 2003-05-29 2009-09-16 株式会社荏原製作所 めっき装置及びめっき方法
WO2004081261A2 (en) * 2003-03-11 2004-09-23 Ebara Corporation Plating apparatus
US20040182715A1 (en) * 2003-03-20 2004-09-23 Jeffrey Bogart Process and apparatus for air bubble removal during electrochemical processing
EP1533400A1 (en) * 2003-11-20 2005-05-25 Process Automation International Limited A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005097732A (ja) 2003-08-21 2005-04-14 Ebara Corp めっき装置

Also Published As

Publication number Publication date
JP2010530029A (ja) 2010-09-02
EP2176450B9 (en) 2012-02-01
JP2013224492A (ja) 2013-10-31
PL2176450T3 (pl) 2011-12-30
US8545687B2 (en) 2013-10-01
JP5597751B2 (ja) 2014-10-01
WO2008148578A1 (en) 2008-12-11
BRPI0812259A2 (pt) 2014-12-23
KR20150071031A (ko) 2015-06-25
KR20100019481A (ko) 2010-02-18
DE102007026633A1 (de) 2008-12-11
DE102007026633B4 (de) 2009-04-02
EP2176450A1 (en) 2010-04-21
ATE519872T1 (de) 2011-08-15
TWI433965B (zh) 2014-04-11
TW200918689A (en) 2009-05-01
EP2176450B1 (en) 2011-08-10
CN101730760B (zh) 2011-09-28
US20100176004A1 (en) 2010-07-15
CN101730760A (zh) 2010-06-09

Similar Documents

Publication Publication Date Title
KR20150071031A (ko) 판상 제품의 전해 처리를 위한 장치 및 방법
EP2167224B1 (en) Apparatus and method for the wet chemical treatment of products
KR100713235B1 (ko) 박판재(薄板材)의 표면처리장치
EP0458863A1 (en) Method and apparatus for manufacturing interconnects with fine lines and spacing
KR20020047236A (ko) 전기 절연 포일 재료의 표면상에 상호 절연된 전기 전도성구조체들을 전해 처리하는 방법, 장치, 및 이 방법의 응용
TWI788832B (zh) 用於一基板之化學及/或電解表面處理之一製程流體之分配本體
KR20240018524A (ko) 기판의 화학적 및/또는 전해 표면 처리 시스템
JP3025254B1 (ja) めっき装置およびめっき方法
US6240934B1 (en) Method and device for treating holes or recesses extending into workpieces with liquid treatment media
CN109477236B (zh) 用于衬底上的垂直电流金属沉积的装置
KR101132092B1 (ko) 기판 도금 장치
JP2008057049A (ja) 内部熱スプレッダめっき方法および装置
US6372101B1 (en) Apparatus for preventing drag-out
JPH0354887A (ja) プリント基板の微小孔処理方法及びその装置
CN112899743B (zh) 一种电镀装置及电镀方法
TWI850584B (zh) 表面處理裝置
US12351935B2 (en) Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate
JPWO2022224886A5 (cg-RX-API-DMAC7.html)
JPH10154871A (ja) バンプ接点を有する回路基板の製造方法およびそれに用いる噴流式めっき装置
JPH04354895A (ja) 配線基板用電気めっき装置
JPH05339789A (ja) 電着塗装方法

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20190705

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20200703

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20210702

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

FPAY Annual fee payment

Payment date: 20220701

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20240715

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240715