KR101630804B1 - 기판처리시스템 및 기판처리시스템의 언로드락모듈 - Google Patents

기판처리시스템 및 기판처리시스템의 언로드락모듈 Download PDF

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Publication number
KR101630804B1
KR101630804B1 KR1020090111649A KR20090111649A KR101630804B1 KR 101630804 B1 KR101630804 B1 KR 101630804B1 KR 1020090111649 A KR1020090111649 A KR 1020090111649A KR 20090111649 A KR20090111649 A KR 20090111649A KR 101630804 B1 KR101630804 B1 KR 101630804B1
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KR
South Korea
Prior art keywords
tray
module
substrate
unloading
heat transfer
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KR1020090111649A
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English (en)
Korean (ko)
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KR20110054857A (ko
Inventor
박해윤
Original Assignee
주식회사 원익아이피에스
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Priority to KR1020090111649A priority Critical patent/KR101630804B1/ko
Priority to CN2010105603011A priority patent/CN102117732B/zh
Publication of KR20110054857A publication Critical patent/KR20110054857A/ko
Application granted granted Critical
Publication of KR101630804B1 publication Critical patent/KR101630804B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020090111649A 2009-11-18 2009-11-18 기판처리시스템 및 기판처리시스템의 언로드락모듈 KR101630804B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020090111649A KR101630804B1 (ko) 2009-11-18 2009-11-18 기판처리시스템 및 기판처리시스템의 언로드락모듈
CN2010105603011A CN102117732B (zh) 2009-11-18 2010-11-18 基板处理系统及基板处理系统的卸载互锁模块

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090111649A KR101630804B1 (ko) 2009-11-18 2009-11-18 기판처리시스템 및 기판처리시스템의 언로드락모듈

Publications (2)

Publication Number Publication Date
KR20110054857A KR20110054857A (ko) 2011-05-25
KR101630804B1 true KR101630804B1 (ko) 2016-06-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090111649A KR101630804B1 (ko) 2009-11-18 2009-11-18 기판처리시스템 및 기판처리시스템의 언로드락모듈

Country Status (2)

Country Link
KR (1) KR101630804B1 (zh)
CN (1) CN102117732B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021194752A1 (en) * 2020-03-23 2021-09-30 Applied Materials, Inc. Load lock with integrated features

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102092702B1 (ko) * 2011-06-14 2020-05-28 삼성디스플레이 주식회사 기판 세정 장치
KR102019779B1 (ko) * 2011-11-15 2019-09-09 세메스 주식회사 기판 처리 장치
CN103219261A (zh) * 2012-01-21 2013-07-24 圆益Ips股份有限公司 基板处理装置及基板处理方法
KR20140012238A (ko) * 2012-07-19 2014-02-03 주식회사 원익아이피에스 기판 처리 시스템
US9111971B2 (en) * 2012-07-30 2015-08-18 Applied Materials Israel, Ltd. System and method for temperature control of a semiconductor wafer
KR101898066B1 (ko) * 2012-11-12 2018-10-30 주식회사 원익아이피에스 이온주입모듈 및 그를 가지는 이온주입시스템
KR101435504B1 (ko) * 2012-12-27 2014-09-02 주식회사 선익시스템 기판 이송 장치 및 기판 이송 방법
KR101481098B1 (ko) * 2013-07-01 2015-01-14 주식회사 선익시스템 인라인 증착 시스템 및 인라인 증착 방법
KR101630203B1 (ko) * 2015-06-12 2016-06-14 제이엔케이히터(주) 기판 유닛 리프트 장치
KR102173658B1 (ko) * 2016-11-30 2020-11-03 주식회사 원익아이피에스 기판처리시스템
US10901328B2 (en) * 2018-09-28 2021-01-26 Applied Materials, Inc. Method for fast loading substrates in a flat panel tool
KR200493286Y1 (ko) * 2019-08-12 2021-03-05 (주)에이피텍 높이 조절 베이스 인라인 시스템

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001110732A (ja) * 1999-10-14 2001-04-20 Sumitomo Metal Ind Ltd 常圧気相成長装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4034860B2 (ja) * 1997-10-31 2008-01-16 キヤノンアネルバ株式会社 トレイ搬送式成膜装置及び補助チャンバー
US7756599B2 (en) * 2004-10-28 2010-07-13 Tokyo Electron Limited Substrate processing apparatus, program for performing operation and control method thereof, and computer readable storage medium storing the program
JP5016351B2 (ja) * 2007-03-29 2012-09-05 東京エレクトロン株式会社 基板処理システム及び基板洗浄装置
JP4874870B2 (ja) * 2007-05-29 2012-02-15 東京エレクトロン株式会社 基板処理システム及び基板処理装置
JP2009135169A (ja) * 2007-11-29 2009-06-18 Tokyo Electron Ltd 基板処理システムおよび基板処理方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001110732A (ja) * 1999-10-14 2001-04-20 Sumitomo Metal Ind Ltd 常圧気相成長装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021194752A1 (en) * 2020-03-23 2021-09-30 Applied Materials, Inc. Load lock with integrated features
WO2021194724A1 (en) * 2020-03-23 2021-09-30 Applied Materials, Inc. Load lock with integrated features
US11557496B2 (en) 2020-03-23 2023-01-17 Applied Materials, Inc. Load lock with integrated features

Also Published As

Publication number Publication date
KR20110054857A (ko) 2011-05-25
CN102117732B (zh) 2013-08-28
CN102117732A (zh) 2011-07-06

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