KR101630804B1 - Substrate process system, and unloadlock module therefor - Google Patents

Abstract

The present invention relates to a substrate processing system, and more particularly, to a substrate processing system for performing substrate processing such as a deposition process on a surface of a substrate and an unload lock module of the substrate processing system.

The present invention provides a substrate processing apparatus comprising: a substrate exchange module for unloading at least one substrate processed in a tray and loading at least one substrate on which a substrate processing is to be performed; A load lock module to which a tray on which at least one substrate to be subjected to the substrate processing is loaded is received from the substrate exchange module; A process module for receiving a tray loaded with a substrate from the load lock module and performing a substrate process on the substrate loaded on the tray; An unloading lock module for moving the tray in at least one of an upward direction and a downward direction so that the tray loaded with the processed substrate can be transferred from the process module to the substrate exchange module; And a tray feedback module that receives the tray loaded with the substrate from the unload lock module and transfers the tray to the substrate exchange module.

Inline, loadlock, unload lock

Description

[0001] The present invention relates to a substrate processing system and an unloadlock module therefor,

The present invention relates to a substrate processing system, and more particularly, to a substrate processing system for performing substrate processing such as a deposition process on a surface of a substrate and an unload lock module of the substrate processing system.

Semiconductors, glass substrates for LCD panels, and solar cells are manufactured by performing substrate processing processes such as deposition and etching on a substrate. Here, the deposition process refers to a process of forming a thin film on the surface of a substrate by using a chemical vapor deposition (PECVD) method or the like.

The substrate processing system for performing the substrate processing such as the deposition process includes a substrate loading module, a load lock module, a process module, an unload lock module, and a substrate unloading module. In accordance with the arrangement of the modules, Type, and a cluster type in which a load lock / unload lock module and a plurality of process modules are disposed around a conveying module.

On the other hand, a substrate processing system for manufacturing solar cells generally has each module arranged in an inline type. That is, in the substrate exchange module, a tray on which a plurality of substrates for solar cells are stacked passes through the load lock module, the process module, and the unload lock module in sequence, and the tray on which the substrate processing has been completed, And then transferred back to the substrate exchange module installed at the front end.

In the conventional in-line type substrate processing system for manufacturing a solar cell, since the substrate exchange module for loading the substrate into the tray for the process or unloading the processed substrate from the tray is disposed on one side of the inline system, The elevator module for moving the tray up and down must be installed at the rear end of the unloading module.

However, in the conventional inline type substrate processing system for manufacturing solar cells, since the load lock module, the process module, the unload lock module and the elevator module are sequentially installed in the substrate exchange module, the area occupied by the entire system becomes large, There is a problem that the cost remarkably increases.

Therefore, various measures are required to reduce the area and cost for installation in the substrate processing system.

Also, when the transfer distance of the substrate passing through the modules becomes long according to the increase of each module in the process of performing the substrate processing of the substrate processing system, the transfer time is increased correspondingly, so that the entire processing time for substrate processing is increased.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an in-line type substrate processing system that recognizes the necessity and problems as described above, and can reduce a manufacturing cost inevitably by reducing space for installation of a substrate processing system.

It is another object of the present invention to provide an in-line type substrate processing system that can simplify a substrate processing system to reduce manufacturing cost and significantly reduce installation space.

It is still another object of the present invention to provide an in-line type substrate processing system capable of significantly reducing the transfer distance of the substrate in the substrate processing system, thereby significantly improving the overall substrate processing speed.

SUMMARY OF THE INVENTION The present invention has been made in order to achieve the above-mentioned object of the present invention, and it is an object of the present invention to provide a substrate exchange module which unloads one or more substrates processed in a tray and loads one or more substrates to be processed; A load lock module to which a tray on which at least one substrate to be subjected to the substrate processing is loaded is received from the substrate exchange module; A process module for receiving a tray loaded with a substrate from the load lock module and performing a substrate process on the substrate loaded on the tray; An unloading lock module for moving the tray in at least one of an upward direction and a downward direction so that the tray loaded with the substrate processed can be transferred from the process module to the substrate exchange module; And a tray feedback module that receives the tray loaded with the substrate from the unload lock module and transfers the tray to the substrate exchange module.

The tray feedback module may be installed below the load lock module and the process module.

Wherein the unload lock module includes a first gate connected to the gate formed in the process module through a first gate valve and a second gate connected to the tray feedback module via a second gate valve, An unloading chamber in which a gate is formed; And a tray raising and lowering unit installed in the unloading chamber to receive the tray from the process module through the first gate and descend downward to transfer the tray to the tray feedback module through the second gate.

A heat transfer unit installed in the unload lock chamber to heat the substrate mounted on the tray or a heat transfer unit installed in the unload lock chamber and cooling the substrate mounted on the tray.

The heat transfer member may include a heat transfer member provided to be in surface contact with the bottom surface of the tray, and the heat transfer member may be formed with a medium flow path to allow the heat transfer medium to flow therethrough.

The unload lock chamber may be provided with one or more temperature sensors for measuring the temperature of the substrate or the tray.

The temperature sensor may be a non-contact sensor or a touch sensor installed in contact with the bottom surface of the tray.

The heat transfer part may be installed up and down with the tray lifting / lowering part or fixed to the unloading lock chamber.

The tray lifting and lowering portion includes a lifting and lowering portion for supporting the tray and moving the tray up and down; A tray pulling part that supports the edge of the tray when the tray is drawn into the unloading lock chamber and is laterally moved when the tray is lifted and lowered by the lifting and lowering driving part to release support of the tray; And a tray discharge unit for supporting the edge of the tray transferred by the lifting and lowering driving unit and discharging the tray to the tray feed module.

Wherein the tray inlet includes a support module for supporting the tray when the tray is drawn into the unloading lock chamber and the support module is in a position capable of supporting the tray when the tray is drawn into the unloading lock chamber, So that when the tray is lowered, its movement is not interfered with.

An unloading lock chamber including an upper housing and a lower housing formed with a first gate connected through a first gate valve and a gate formed in the process module and detachably coupled to the upper module; A heat transfer unit installed in the lower housing and heating or cooling the substrate mounted on the tray by supporting the tray; And a lower housing lifting / lowering portion for moving the lower housing downward to transmit the tray to the tray feeding module.

One or both sides of the heat transfer part may be provided with a tray discharge part for receiving or discharging the tray.

The present invention also discloses an unload lock module of a substrate processing system having such a configuration.

The unload lock module of the substrate processing system and the substrate processing system according to the present invention allows the substrate to be moved up and down within the unload lock module, especially the tray on which at least one substrate is loaded, and circulated to the substrate exchange module by the tray feedback module There is an advantage that the number of modules constituting the substrate processing system can be reduced to reduce the manufacturing cost and significantly reduce the installation space.

Further, the unload lock module of the substrate processing system and the substrate processing system according to the present invention can reduce the moving distance of the substrate (or tray) by lowering the substrate (or the tray) in the unload lock module and circulating the substrate exchange module, Can be remarkably improved.

Further, the unload lock module of the substrate processing system and the substrate processing system according to the present invention can simplify the structure of the substrate processing system by providing the heat transfer part for cooling or heating the substrate together with the vertical movement of the substrate (or the tray) The cost can be reduced and the installation space can be significantly reduced.

Hereinafter, the unload lock module of the substrate processing system and the substrate processing system according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a side view of the substrate processing system of FIG. 1, FIG. 3 is a cross-sectional view of a process module of the substrate processing system of FIG. 1, and FIGS. 4A and 4B are cross- Figs. 5A and 5B are conceptual diagrams showing an example of a heat transfer part and a temperature sensor of the unload lock module of the substrate processing system of Fig. 1, respectively. Fig. 5A and Fig. 5B are partial cross-sectional views showing a part of the unload lock module of the substrate processing system of Fig.

The substrate processing system according to the present invention is an inline type in which each module is sequentially disposed, and includes a substrate exchange module 400, a load lock module 200, a process module (not shown) 100, an unload lock module 300, and a tray feedback module 500.

The substrate exchange module 400 can be variously configured to load one or more substrates 10 to be subjected to substrate processing in the tray 20 or to unload one or more substrates 10 that have undergone substrate processing.

1 and 2, when the substrate 10 is loaded on the tray 20 and transported, the substrate exchange module 400 may be mounted on the tray 20, (Not shown) on which a plurality of substrates 10 are loaded and a tray support unit 410 for supporting the tray 20 and loading one or more substrates 10 on the tray 20 And a substrate loading apparatus 420 installed therein.

Here, the tray 20 is configured to transport one or more, preferably a plurality of, substrates 10 at one time, and can be configured in various ways according to design and design. In addition, Any materials and structures are possible.

For example, the tray 20 may be made of at least one of a nonmetal such as graphite and quartz, a metal such as aluminum and an aluminum alloy, and may have various shapes such as a rectangle.

The substrate 10 may be a semiconductor substrate, a glass substrate for an LCD panel, a substrate for a solar cell, and the like, and may have various shapes such as a rectangular shape and a circular shape.

Meanwhile, the tray 20 can be transported by various methods in each of the modules described later. For example, as shown in FIGS. 2 and 3, the tray 20 may include a plurality of modules 400, 200, 100, 300, and 500 among the modules 400, 200, 100, 300, (Not shown), a belt, or the like.

The tray support unit 410 may be provided with a structure for moving the tray 20 up and down to transport the tray 20 from a tray feed module 500 described later.

The load lock module 200 is a process module that receives a tray 20 loaded with one or more substrates 10 to be subjected to a substrate process such as a deposition process from a substrate exchange module 400 in an atmospheric pressure state, 100), and is connected to a vacuum pump (not shown) so as to change the pressure inside the load lock chamber.

The load lock module 200 may be provided with a heater for preheating the substrate 10 mounted on the tray 20 when the substrate 10 needs to be preheated according to a substrate processing process.

The load lock module 200 is provided with gate valves 210 and 220 for opening and closing a gate (not shown) and sealing the inside of the load lock module 200 in order to convert pressure such as a vacuum pressure and an atmospheric pressure.

The process module 100 is a module for performing a substrate process such as a deposition process and can be variously configured according to the substrate process. As shown in FIG. 3, the process module 100 includes a vacuum chamber 110 )Wow; A tray support 130 installed inside the vacuum chamber S for supporting a tray 20 on which a plurality of substrates 10 are stacked; And a shower head 130 installed at an upper portion of the vacuum chamber 110 and injecting gas into the processing space S.

The vacuum chamber 110 is configured to form a processing space S for performing substrate processing such as a deposition process. The vacuum chamber 110 may have various configurations. As shown in FIG. 3, 112 and an upper lead 111 detachably coupled to the chamber main body 112. As shown in FIG.

The chamber body 112 has a shape of a vessel opened on the upper side and one or more gates 101 and 102 through which the substrate 10 can enter and exit are formed. In this embodiment, a pair of gates 101 and 102 in the rectangular chamber body 112 are formed so as to face each other.

The upper lead 111 is configured to form a closed process space S with a sealing member (not shown) interposed therebetween on an upper side of the chamber main body 112. The upper lead 111 has a plate shape or a lower- .

The shower head unit 150 is installed on the upper side of the processing space S so as to perform substrate processing and supplies the gas to the processing space S from the gas supplying unit 170. The shower head unit 150 includes a processing unit Various configurations are possible depending on the supply method.

The tray supporting unit 130 is configured to support the tray 20 so that the deposition process can be smoothly performed. The tray supporting unit 130 may have various configurations according to design conditions and process conditions.

In addition, the tray supporting unit 130 may be provided with a heater 131 for maintaining a predetermined temperature so that the deposition process can be performed smoothly. Further, the tray supporting unit 130 may be constituted only by a heater. At this time, the heaters constituting the tray supporting unit 130 may be integrally formed or may be divided into a plurality of heaters 131 based on a supporting surface for supporting the tray 20, as shown in FIG. 3 have.

Meanwhile, in order to perform substrate processing, power may be applied to the process module 100. In this case, various configurations are possible according to the power application method. For example, one or more RF power sources, One or more LF power sources or the like may be applied to constitute the upper power source, and the tray supporting unit 130 may be grounded to constitute the lower power source.

Meanwhile, the process module 100 is further provided with a tray transfer device for transferring the tray 20, and the tray transfer device may be constituted by a transfer robot or the like in accordance with the transfer method of the tray 20, And the like.

Reference numeral 180, which is not described in the drawing, refers to an exhaust pipe for exhausting the processing space S of the vacuum chamber 110.

The unloading lock module 300 is configured to discharge the tray 20 on which the substrate 10 having undergone the deposition process is loaded from the process module 100 in the vacuum pressure state to the atmosphere outside the atmospheric pressure state, The tray 20 is moved in at least one of the upward direction and the downward direction so that the tray 20 on which the processed substrate 10 is loaded can be received from the process module 100 and transferred to the substrate exchange module 400 And the like.

4A and 4B, the unload lock module 300 includes a first gate 301 connected to the gate 102 formed in the process module 100 through a first gate valve 310, An unload lock chamber 330 provided below the first gate 301 and having a second gate 302 formed by opening and closing the tray feedback module 500 and the second gate valve 320; The tray 200 is installed in the unloading lock chamber 330 and receives the tray 20 from the process module 100 through the first gate 301 and descends downward to be transferred to the tray feed module 500 through the second gate 302, A tray lifting / lowering portion 340 for transferring the tray 20; And a heat transfer part 350 installed in the unloading lock chamber 330 and heating or cooling the substrate 10 mounted on the tray 20. [

The unload lock chamber 330 receives the tray 20 from the process module 100 in the vacuum pneumatic state and transmits the tray 20 to the tray feedback module 500 in an atmospheric pressure state. Various configurations are possible as a configuration for forming a space. At this time, the unloading lock chamber 330 is connected to a vacuum pump (not shown) to change the pressure inside the unloading lock chamber 330.

4A, the tray lifting / lowering part 340 receives the tray 20 from the process module 100 and moves the tray 20 downward to the tray feed module 500 as shown in FIG. 4B, The tray 20 is moved so as to support the edge of the tray 20 and draw the tray 20 into the unloading lock chamber 330 or to discharge the tray 20 to the tray feedback module 500. [ The tray discharging unit 341 is positioned on the upper side when the tray 20 is drawn in the unloading lock chamber 330 and the tray discharging unit 341 is positioned on the upper side when the tray 20 is discharged from the unloading lock chamber 330 And an elevation driving unit 342 for moving the tray discharging unit 341 upward and downward to place the tray 341 on the upper side.

As shown in FIGS. 4A and 4B, the tray discharging unit 341 may include a driving module or a conveyor belt module including a plurality of rollers, And a single support module.

The lifting and lowering drive unit 342 can be configured in various manners such as a screw jack, a hydraulic cylinder, and the like, which are configured to move the tray discharging unit 341 up and down in a state of supporting the tray discharging unit 341.

The lifting and lowering driving part 342 maintains a gap with the heat transfer part 350 described below when the tray 20 is drawn in or out and moves relative to the heat transfer part 350 so as to be in surface contact when cooling or heating Can be installed.

The heat transfer unit 350 may be configured to heat or cool the substrate 10 through the process module 100. The heat transfer unit 350 may include various types of heat transfer units installed on the bottom surface of the tray 20, And the heat transfer member 351 may include a medium passage 352 to allow the heat transfer medium to flow therethrough.

Here, since the substrate 10 through the process module 100 is generally heated, the heat transfer part 350 is configured to cool most of the substrate 10.

4A and 4B, the heat transfer part 350 may be fixedly installed in the unloading lock chamber 330 or may be installed to move up and down together with the tray discharge part 341.

The cooling or heating of the substrate 10 in the unloading lock module 300 may be performed by various methods such as temperature and unloading process of the substrate 10 after the substrate processing. The heat capacity for cooling or heating the heat exchanger 350 and the cooling or heating time in the unloading lock module 300 can be determined.

At least one temperature sensor 353 for measuring the temperature of the substrate 10 or the tray 20 may be installed in the unloading lock chamber 330.

The temperature sensor 353 may be a non-contact sensor such as an infrared temperature sensor, or a touch sensor installed to contact the bottom surface of the tray 20, as shown in FIGS. 5A and 5B.

The temperature sensor 353 is installed in a temperature sensor mounting groove 353a formed in the heat transfer member 351 and a temperature sensor 353a is provided in the temperature sensor mounting groove 353a so as to be in close contact with the bottom surface of the tray 20. [ May be provided on the bottom surface of the tray 20, such as a spring for applying an elastic force.

The tray feeding module 500 is configured to receive the tray 20 loaded with the substrate 10 from the unloading lock module 300 and to transfer the tray 20 to the substrate exchange module 400, And can be configured as a tray transfer rail for returning to the substrate exchange module 400, as shown in FIG.

Here, the tray feedback module 500 is preferably installed below the load lock module 200 and the process module 100.

The tray 20 is moved by the upward and downward movements of the substrate exchange module 400 and the unloading lock module 300 and is unloaded through the tray transfer rail installed below the modules 100, The tray 20 ejected from the lock module 300 may be fed back from the tray feedback module 500 to the substrate exchange module 400.

Meanwhile, the unload lock module 300 can be configured in various ways according to the structure of the tray lifting / lowering part 340, that is, the image of the tray 20 is moved.

Figure 6 is a cross-sectional view showing a portion of another example of an unload lock module of the substrate processing system of Figure 2, Figures 7a and 7b are partial cross-sectional views showing a portion of the unload lock module of Figure 6, Figure 7c is a cross- 7b is a partial cross-sectional view showing that the tray is installed at a distance from the heat transfer portion in the unloading lock module of Fig.

6 and 7A and 7B, the tray lifting and lowering portion 360 of the unloading and locking module 300 includes a lifting and lowering driving portion 362 for supporting the tray 20 and moving the tray 20 up and down, And the tray 20 is supported by the edge of the tray 20 when the tray 20 is drawn into the unloading lock chamber 330 and is moved laterally when the tray 20 is lifted and lowered by the lifting and lowering driving unit 362, And a tray discharging part 361 for supporting the edges of the tray 20 transmitted by the elevation driving part 362 and discharging the tray to the tray feeding module 500. [ .

The tray inlet portion 363 and the tray outlet portion 361 may be configured in various manners depending on how the tray 20 is supported and moved. As shown in FIGS. 7A and 7B, Or a single support module such as a conveyor belt module.

The tray inlet portion 363 includes a support module for supporting the tray 20 when the tray 20 is drawn into the unloading lock chamber 330. The support module is configured such that the tray 20 is moved in the unloading lock chamber 330 The tray 20 is in a position to support the tray 20 as shown in FIG. 7A, and when the tray 20 is lifted or lowered, as shown in FIG. 7B, So as not to move in the horizontal direction.

The lifting and lowering drive unit 362 can be configured in various manners such as a screw jack and a hydraulic cylinder, which are linear moving devices, for vertically moving the tray 20 while supporting the tray 20.

The lifting and lowering driving unit 362 is spaced apart from the heat transfer unit 350 when the tray 20 is pulled in or out and installed so as to be movable relative to the heat transfer unit 350 .

Meanwhile, the heat transfer part 350 may be installed at an upper part of the lifting and lowering driving part 362 so as to support and move the tray 20 when the tray 20 is moved up and down. As shown in FIG. 7C, the heat transfer part 350 may be formed by supporting the bottom surface of the tray 20 in a surface contact manner, or may be provided at an upper portion of the tray 20 so as to be spaced apart from the bottom surface of the tray 20 362 may be provided with a plurality of support members 351 for supporting the bottom surface of the tray 20.

8A and 8B are cross-sectional views illustrating another example of the unload lock module of the substrate processing system of FIG.

As another example, the unload lock module 300 may include a first gate (not shown) coupled through a first gate valve 310 to a gate 102 formed in the process module 100, as shown in FIGS. 8A and 8B. An unloading lock chamber 330 including an upper housing 331 and a lower housing 332 which are coupled to each other to be detachable up and down; A heat transfer part 350 installed in the lower housing 332 and supporting the tray 20 to heat or cool the substrate 10 mounted on the tray 20; And a lower housing ascending / descending section 380 for moving the lower housing 332 downward and delivering the tray 20 to the tray feed module 500.

The unloading lock chamber 330 has substantially the same structure as the unloading lock chamber 330 shown in FIGS. 4A and 4B and includes an upper housing 331 and a lower housing 332 which are detachably coupled to each other .

The upper housing 331 and the lower housing 332 may have various structures and shapes and the upper housing 331 may be formed by detachably or integrally forming one or more members as shown in Figures 8A and 8B. And the lower housing 332 may be detachably coupled to the lower end of the upper housing 331. The lower housing 332 may be detachably coupled to the upper housing 331. [

It is preferable that a sealing member 333 is installed at the lower end of the upper housing 331 and the coupling part of the lower housing 332 in consideration of forming a vacuum inside the unloading lock chamber 330. The upper housing 331 is supported by a separate support member 334 because the lower housing 332 is detachably coupled and the sealing member 333 is supported by at least one of the upper housing 331 and the lower housing 332 It can be installed in any one of them.

The heat transfer part 350 may have a structure similar to that of the above-described structure, except that the heat transfer part 350 is installed in the lower housing 332.

On the other hand, the tray discharging part 352 for receiving or discharging the tray 20 is constituted by a supporting module such as a driving module or a conveyor belt module including a plurality of rollers, and unlike the above-described embodiment, Or on both sides thereof. In FIGS. 8A and 8B, the heat transfer part 350 may have a configuration similar to that shown in FIG. 4A, with only the support part overlapped with the tray discharge part 352. FIG.

When the tray 20 is received through the first gate 301 of the unloading lock chamber 330, the lower housing lifting / lowering portion 380 moves the lower housing 332 upward to close the upper housing 331, And the lower housing 332 is lowered to move the tray 20 on the heat transfer part 350 to the lower side of the lower housing 332.

The lower housing lifting / lowering portion 380 may be a screw jack, a hydraulic cylinder, or the like, provided that the lower housing 332 of the unloading lock chamber 330 can be lifted and lowered.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

1 is a top view of a substrate processing system in accordance with the present invention.

Figure 2 is a side view of the substrate processing system of Figure 1;

3 is a cross-sectional view of the process module of the substrate processing system of FIG.

Figures 4A and 4B are partial cross-sectional views showing a portion of an unload lock module of the substrate processing system of Figure 2;

5A and 5B are conceptual diagrams showing an example of a heat transfer part and a temperature sensor of an unload lock module of the substrate processing system of FIG.

Figure 6 is a cross-sectional view showing part of another example of an unload lock module of the substrate processing system of Figure 2; 7A and 7B are partial longitudinal sectional views showing a part of the unloading lock module of FIG.

7C is a partial cross-sectional view showing that the tray is installed at a distance from the heat transfer portion in the unloading lock module of FIGS. 7A and 7B.

8A and 8B are cross-sectional views illustrating another example of the unload lock module of the substrate processing system of FIG.

Description of Reference Numerals to Main Parts of the Drawings *****

100: Process module 200: Load lock module

300: unload lock module 400: substrate exchange module

500: Tray feedback module

Claims (13)

A substrate exchange module for unloading one or more substrates that have undergone substrate processing in the tray and loading one or more substrates on which the substrate processing is to be performed; A load lock module to which a tray on which at least one substrate to be subjected to the substrate processing is loaded is received from the substrate exchange module; A process module that receives a tray loaded with a substrate from the load lock module and performs a substrate process on the substrate loaded on the tray in a pneumatic state; An unloading lock module for moving the tray in at least one of an upward direction and a downward direction so that the tray loaded with the processed substrate can be transferred from the process module to the substrate exchange module; And a tray feed module for receiving a tray on which the substrate is loaded from the unload lock module and transferring the tray to the substrate exchange module, Wherein the load lock module transfers a tray loaded with one or more substrates to be subjected to substrate processing from the substrate exchange module in an atmospheric pressure state to the process module in a pneumatic state, Wherein the unloading lock module transfers the tray loaded with the substrate processed from the process module in the vacuum pressure state to the tray feedback module in the atmospheric pressure state. The method according to claim 1, Wherein the tray feedback module is installed below the load lock module and the process module. The method according to claim 1, The unload lock module A first gate connected to a gate formed in the process module through a first gate valve and a second gate provided under the first gate and connected to the tray feedback module by opening and closing the second gate valve, A chamber; And a tray lifting / lowering unit installed in the unloading chamber to receive the tray from the process module through the first gate and to move downward to transfer the tray to the tray feedback module through the second gate. system. The method of claim 3, Further comprising a heat transfer unit installed in the unload lock chamber and performing at least one of heating and cooling the substrate mounted on the tray. The method of claim 4, Wherein the heat transfer unit includes a heat transfer member provided in a surface contact or a gap with the bottom surface of the tray, and the heat transfer member is formed with a medium flow path so that the heat transfer medium can flow. The method of claim 4, Wherein the unload lock chamber is provided with one or more temperature sensors for measuring the temperature of the substrate or the tray. The method of claim 6, Wherein the temperature sensor is a non-contact sensor or a contact sensor provided so as to be in contact with a bottom surface of the tray. The method of claim 4, Wherein the heat transfer part is raised and lowered together with the tray lifting / lowering part or is fixed to the unloading lock chamber. The method of claim 3, The tray lifting / A lifting and lowering drive part for supporting the tray and moving it up and down; A tray pulling part that supports the edge of the tray when the tray is drawn into the unloading lock chamber and is laterally moved when the tray is lifted and lowered by the lifting and lowering driving part to release support of the tray; And a tray discharging unit for supporting an edge of the tray transferred by the elevation driving unit and discharging the tray to the tray feed module. The method of claim 9, Wherein the tray inlet includes a support module for supporting the tray when the tray is drawn into the unloading lock chamber, Wherein the support module is in a position capable of supporting the tray when it is pulled into the unloading lock chamber and is supported by the lifting and lowering portion so that the tray is moved in the lateral direction so as not to interfere with the movement of the tray when the tray is lowered. Processing system. The method according to claim 1, An unloading lock chamber including an upper housing and a lower housing formed with a first gate connected through a first gate valve and a gate formed in the process module and detachably coupled to the upper module; A heat transfer unit installed in the lower housing and heating or cooling the substrate mounted on the tray by supporting the tray; And a lower housing lifting / lowering portion for moving the lower housing downward to deliver the tray to the tray feeding module. The method of claim 11, And a tray discharging portion for receiving or discharging the tray is installed on one side or both sides of the heat transfer portion. An unloading lock module of a substrate processing system according to any one of claims 2 to 12.

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