KR20110006091A - Substrate processing apparatus and method, and in-line processing system and method comprising the same - Google Patents

Abstract

PURPOSE: A substrate processing apparatus, a method thereof, and an inline process system having the same, and a method thereof are provided to improve the productivity by shortening the process time by continuously processing the substrate. CONSTITUTION: A chamber(131) comprises the internal space. A transfer unit(141) supplies a cart(110) into the chamber or discharges the cart out of the chamber. A heating unit(151) heats a substrate(S) settled on the upper side. An elevating unit(161) raises or drops the substrate supplied into the chamber. The elevating unit comprises a plurality of lift pins(162).

Description

Substrate processing apparatus and method, and in-line processing system and method comprising the same

The present invention relates to a substrate processing apparatus and method for use in manufacturing semiconductors, in particular, solar cells, and to inline processing systems and methods including the same.

In order to solve international environmental and energy problems, researches and developments on alternative energy are being actively conducted around the world. In particular, the interest in alternative energy has been heightened by recent international oil price hikes and the depletion of fossil fuels. As an alternative energy to replace fossil fuels, solar energy is receiving much attention in terms of environmental aspects and infinite energy sources.

For example, a semiconductor device such as a solar cell that receives sunlight and converts it into electrical energy is used. In general, a solar cell is in the form of a PN junction diode, in which minority carriers excited by solar energy diffuse across the PN junction surface, causing a voltage difference across the PN junction diode, resulting in electromotive force.

In order to manufacture a solar cell, a process of depositing a thin film such as a P-type or N-type semiconductor layer, an antireflection film, an electrode, or the like on a substrate such as glass, and etching the deposited thin film to form a pattern necessary for improving energy conversion efficiency. It goes through various processes such as process. Such a process may include a step of preheating the substrate prior to depositing a thin film on the substrate.

However, according to the related art, the substrate is heated together with the supporting member in a state where the substrate is placed on the upper surface of the plate-shaped supporting member provided in the cart, and then a deposition process is performed. In this process, the heated substrate may be deprived of heat due to the support member, resulting in heat loss, and thus may not be uniform temperature distribution on the substrate. Then, when the thin film deposition process is performed, it may adversely affect the uniformity of the thin film.

In order to solve this problem, the support member may be configured to partially support the edge of the substrate to reduce the contact area with the substrate. However, even in the case described above, after the substrate is heated together with the supporting member, a temperature difference may be caused between the portion where the substrate and the supporting member are in contact with the portion which is not in contact. Therefore, a uniform temperature distribution may not be achieved on the substrate.

An object of the present invention is to provide a substrate processing apparatus and method that can minimize the heat loss by heating the substrate in a uniform temperature distribution.

In addition, an object of the present invention is to provide an inline processing system and method capable of continuously processing a substrate to improve production efficiency.

In order to achieve the above object, a substrate processing apparatus includes a cart having a center opened to support a substrate below an edge by placing a substrate on the substrate, and having a rear end opened in a transport direction of the substrate, and supplied from the cart. A substrate processing chamber portion for processing the received substrate, the substrate processing chamber portion comprising: a chamber having an internal space; A transfer unit for feeding the cart into or out of the chamber; A heating unit installed in the chamber and having a substrate seated thereon; And raising or lowering the substrate supplied into the chamber so that the substrate is loaded or unloaded to the cart and the heating unit, and the plurality of lifting pins and the lifting drive mechanism for lifting the lifting pins up and down through the heating unit. And a lifting unit provided.

The substrate processing method includes loading a substrate into a cart and transferring the substrate into a chamber; Unloading the substrate from the cart as the lift pins in the chamber are raised to lift the substrate; Transferring the cart with the substrate unloaded out of the chamber; Lowering the lifting pins in the chamber to seat the substrate on the heating surface, and then processing the substrate;

Raising the lift pins in the chamber to lift the processed substrate and then transferring the cart outside the chamber into the chamber; And lowering the lifting pins in the chamber to load the processed substrate into the cart and to transport it out of the chamber.

An inline processing system includes: a cart on which a substrate is placed to be transported, the center being opened to support under the edge of the substrate, and the rear end being opened relative to the transport direction of the substrate; A load lock chamber unit preheating the supplied substrate; Process processing of the substrate supplied from the load lock chamber unit, the transfer chamber for supplying the substrate mounted on the cart into the process chamber or discharged out of the process chamber, and installed in the process chamber and on the upper surface Lifting drive for raising and lowering the heating unit on which the substrate is seated, and the lifting pins and the lifting pins which are lifted and lowered through the heating unit by raising or lowering the substrate to load or unload the substrate to the cart and the heating unit. A process chamber portion including an elevation unit having a mechanism; And an unload lock chamber unit configured to cool the substrate supplied from the process chamber unit.

The inline processing method includes loading a substrate into a cart and transferring the substrate into a load lock chamber and then preheating the transferred substrate; Transferring the cart loaded with the preheated substrate into the process chamber; Lifting the lifting pins in the process chamber to unload the substrate from the cart as it lifts the substrate; Transferring the cart with the substrate unloaded into the unload lock chamber; Lowering the lifting pins in the process chamber to seat the substrate on the upper surface of the heating part, and then processing the process; Raising the lift pins in the process chamber to lift the processed substrate and then transferring the cart in the unload lock chamber into the process chamber; Lowering the lifting pins in the process chamber to load the processed substrate into a cart; And transferring the cart loaded with the processed substrate into the unload lock chamber and then cooling the transferred substrate.

According to the present invention, not only the substrate is heated with the cart, but only the substrate can be heated, so that a uniform temperature distribution can be made on the heated substrate. Thus, when the thin film deposition process is performed on the heated substrate, the thin film may be uniformly deposited on the substrate.

In addition, according to the present invention, since the substrate can be continuously processed, the process time can be shortened and productivity can be improved.

In addition, according to the present invention, since the conveying unit for conveying the cart provides rotational force to all the rollers, the cart can be smoothly transported, and even if the cart is deposited on some of the rollers during the deposition process, the cart can be smoothly transported. .

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a state in which a cart loaded with a substrate is supplied into a chamber in FIG. 1. 3 is a trial drawing which shows the transfer unit and the lifting unit in FIG.

1 to 3, the substrate processing apparatus 100 performs various processes such as preheating the substrate S or depositing a thin film on the substrate S. And a substrate processing chamber 120. Here, the substrate S may be a substrate such as glass.

The cart 110 mounts the substrate S so that the substrate S is transferred. The center of the cart 110 is opened to support under the edge of the substrate (S), the rear end is opened based on the transport direction of the substrate (S). For example, the cart 110 may be formed in a c shape, and the concave seating surface 111 may be continuously formed to allow the edge portion of the substrate S to be seated along the inner edge. In addition, the locking jaw 112 may be formed at both edges of the rear end of the cart 110 to prevent the substrate S from being horizontally moved backward in the state where the substrate S is seated on the seating surface 111.

As the above-described cart 110 has an opening formed in the center thereof, the lifting pins 162 may lift and lower the substrate S as the lifting pins 162 move up and down through the center opening. In addition, as the cart 110 has an opening formed at a rear end thereof, the cart 110 moves out of the chamber 131 in a state in which the lifting pins 162 are lifted to unload the substrate S from the cart 110. When conveyed it may be conveyed without interference with the lift pins 162 by the trailing opening.

The substrate processing chamber unit 120 receives the substrate S from the cart 110 and performs various processes such as preheating of the supplied substrate S or thin film deposition on the substrate S. The substrate processing chamber 120 includes a chamber 131, a transfer unit 141, a heating unit 151, and a lifting unit 161.

The chamber 131 has an internal space in which a vacuum atmosphere is formed. The vacuum atmosphere may be formed by a pump (not shown). In the chamber 131, gates 132 may be formed at the front and rear ends of the substrate S based on the transport direction of the substrate S so that the substrate S may be supplied and discharged. In the chamber 131, gate valves (not shown) for opening and closing the gates 132 may be installed. When the thin film deposition process is performed in the chamber 131, a shower head (not shown) for supplying source gas and reactant gas to the substrate may be mounted.

The transfer unit 141 supplies the cart 110 into or out of the chamber 131. Accordingly, the transfer unit 141 receives the cart 110 loaded with the substrate S and supplies the gas into the chamber 131, or transfers the cart 110 temporarily discharged out of the chamber 131 into the chamber 131. Can supply Then, the transfer unit 141 discharges the cart 110 loaded with the processed substrate S out of the chamber 131, or temporarily moves the cart 110 with the substrate S unloaded out of the chamber 131. Can be discharged.

The heating unit 151 is installed in the chamber 131 and heats the substrate S mounted on the upper surface. That is, the heating unit 151 applies heating to the substrate S when the substrate S is loaded on the upper surface by the elevating unit 161.

The lifting unit 161 raises or lowers the substrate S supplied into the chamber 131 so that the substrate S is loaded or unloaded to the cart 110 and the heating unit 151. The lifting unit 161 includes a plurality of lifting pins 162 and a lifting drive mechanism 163.

Lift pins 162 are installed to be elevated through the heating unit 151. The lifting pins 162 are arranged to correspond to the central opening of the cart 110 with the cart 110 positioned in the chamber 131, and are arranged at intervals to stably lift and lower the substrate S. The elevating pins 162 may be simultaneously elevated by the elevating drive mechanism 163 via the elevating frame 164.

Each lower end of the elevating pins 162 is fixed to the elevating frame 164 to protrude upward, and the elevating drive mechanism 163 may be connected to the lower surface of the elevating frame 164. The lifting drive mechanism 163 may use various linear driving mechanisms capable of lifting the lifting frame 164. For example, the lifting drive mechanism 163 may be an electric cylinder, an air cylinder, or the like. In this case, the body of the cylinder is fixed to the chamber 131, the rod drawn out from the body of the cylinder may be fixed to the lower surface of the lifting frame 164.

The transfer unit 141 may include a plurality of rollers 142 and a roller driving mechanism 143. The rollers 142 are horizontally arranged in two rows on both sides of the chamber 131 along the conveyance direction of the cart 110 and are rotatably installed in a direction in which the cart 110 can be mounted and conveyed. The rollers 142 are arranged to be spaced apart from each other along the conveyance direction of the cart 110.

The roller drive mechanism 143 provides rotational force to all of the rollers 142. This is to allow all of the rollers 142 to rotate with the same rotational force, so that the cart 110 can be smoothly transferred without biasing in either direction. In addition, even if deposited on some of the rollers 142 during the deposition process, the cart 110 may be smoothly transferred.

The roller drive mechanism 143 may include first gears 144, second gears 145, connecting gears 146, a motor 147, and a driving connecting shaft 148. . The first gears 144 are respectively coaxially coupled to the rollers 142. The second gears 145 are meshed with the first gears 144, respectively, and are spaced apart at regular intervals. The connecting gears 146 are interposed between the second gears 145, respectively, and mesh with the second gears 145. The connecting gears 146 allow the second gears 145 to all rotate in the same direction, so that both the first gears 144 and the rollers 142 associated therewith can rotate in the same direction.

The motor 147 is connected to any one of the first gear 144, the second gear 145, and the connecting gear 146 by a power transmission means including a pulley and a belt to provide rotational force. The motor 147 may be a rotary motor or the like capable of forward and reverse rotation.

The driving connecting shaft 148 rotates by connecting at least one of the second gears 145 located on the left side and the coaxially located right side thereof with each other. Accordingly, even if one motor 147 is installed on either of the left and right sides of the chamber 131, the driving force may be provided to all of the rollers 142.

As another example, the driving connecting shaft 148 may rotate together by connecting at least one of the connecting gears 146 located at the left side and the coaxially located right side thereof with each other.

The heating unit 151 may include a heating stage 152 and a susceptor 153. The heating stage 152 may include a heater (not shown) to generate heat. The susceptor 153 may be fixed on the heating stage 152. The susceptor 153 may be formed of a graphite material to evenly transfer heat generated from the heating stage 152 to the substrate S mounted on the top surface.

The chamber 131 may further include a cart position sensor 171. The cart position sensor 171 detects the position of the cart 110 in the chamber 131 so that the substrate S may be positioned in the chamber 131. For example, the information detected from the cart position sensor 171 may be provided to a controller (not shown) for overall control of the substrate processing apparatus 100. The controller may control the transfer unit 141 based on the information provided from the cart position sensor 171 to position the cart S at a predetermined position, thereby positioning the substrate S correctly.

As described above, the substrate S is unloaded from the cart 110 by the lifting unit 161 and the transfer unit 141, and the cart 110 is discharged out of the chamber 131 so that only the substrate S is heated. 151 may be heated. Thus, the substrate S can be heated with a uniform temperature distribution. In addition, when a thin film deposition process is performed on the heated substrate S, the thin film may be uniformly deposited on the substrate S. FIG.

A method of processing the substrate S by the substrate processing apparatus 100 having the above configuration will be described below with reference to FIGS. 4 to 7.

As shown in FIG. 4, the cart 110 loaded with the substrate S is supplied into the chamber 131 by the transfer unit 141. When the substrate S is in position, as shown in FIG. 5, the lifting pins 162 in the chamber 131 are raised to lift the substrate S. As shown in FIG. Then, the substrate S is separated from the cart 110 and unloaded. Thereafter, the substrate S is unloaded to temporarily discharge the empty cart 110 out of the chamber 131.

Subsequently, as shown in FIG. 6, the lifting pins 162 in the chamber 131 are lowered to seat the substrate S on the upper surface of the heating unit 151. Thereafter, the substrate S is preheated, or a process such as thin film deposition on the substrate is processed.

When the process is completed, as shown in FIG. 7, the lifting pins 162 in the chamber 131 are raised to lift the processed substrate S. As shown in FIG. Subsequently, the cart 110 temporarily discharged out of the chamber 131 is transferred back into the chamber 131. When the cart 110 is positioned at the substrate loading position, the lifting pins 162 in the chamber 131 are lowered to load the processed substrate S into the cart 110. Subsequently, the cart 110 loaded with the processed substrate S is discharged out of the chamber 131.

8 is a perspective view of an inline processing system according to one embodiment of the invention.

Referring to FIG. 8, the inline processing system 1000 continuously processes a process of preheating the substrate S, a process of depositing a thin film on the substrate S, and a process of cooling the substrate S. do. The inline processing system 1000 includes a cart 110, a load lock chamber unit 1100, a process chamber unit 1200, and an unload lock chamber unit 1300. . Here, the process chamber unit 1200 may be configured in the same configuration when the substrate processing chamber 120 of the substrate processing apparatus 100 described above is configured to perform a process such as thin film deposition.

The load lock chamber part 1100, the process chamber part 1200, and the unload lock chamber part 1300 are arranged in order along the transfer direction of the substrate S. Although the process chamber part 1200 is illustrated as being provided as one, a plurality of process chambers 1200 may be provided and arranged in a line to perform various processes. The cart 110 reciprocates and transfers between the load lock chamber 1100, the process chamber 1200, and the unload lock chamber 1300.

The load lock chamber 1100 may perform preheating on the substrate S. FIG. This is to preheat before the substrate S is heated in the process chamber part 1200, so that the process process in the process chamber part 1200 can be performed more quickly.

The load lock chamber unit 1100 may include a load lock chamber 1110, a transfer unit for supplying the substrate S mounted on the cart 110 into the load lock chamber 1110, or discharging the load lock chamber 1110 out of the load lock chamber 1110. It is installed in the lock chamber 1110 and may include a heating unit on which the substrate (S) is mounted on the upper surface. The transfer unit and the heating unit installed in the load lock chamber unit 1100 may be configured in the same manner as the transfer unit 141 and the heating unit 151 installed in the above-described process chamber unit 1200.

In the load lock chamber 1110, the substrate S may be preheated together with the cart 110 while being loaded in the cart 110. For example, the rollers of the transfer unit on which the cart 110 is mounted may be lowered to allow the substrate to be seated on the upper surface of the heating unit, so that the substrate may be preheated while being loaded in the cart 110. As another example, the heating unit may be raised toward the substrate to allow the substrate to contact the upper surface of the heating unit so that the substrate may be preheated while being loaded in the cart 110.

Meanwhile, since the load lock chamber 1100 further includes a lifting unit 161 of the process chamber 1200, only the substrate S may be preheated. That is, the lift pins in the load lock chamber 1110 are raised to lift the substrate, thereby separating the substrate from the cart and then temporarily discharging the cart into the process chamber 1210. Thereafter, the lifting pins in the load lock chamber 1110 may be lowered to seat the substrate on the upper surface of the heating unit so that only the substrate is heated.

The load lock chamber 1110 may be provided with gates for supplying and discharging the substrate S, a gate valve for opening and closing the gates, and a pump for forming an internal space in a vacuum. The load lock chamber 1110 may further include a cart position sensor.

The unload lock chamber 1300 receives the substrate S from the process chamber 1200 and cools the supplied substrate S. FIG. The unload lock chamber unit 1300 includes an unload lock chamber 1310 and a transfer unit that supplies the substrate S mounted on the cart 110 into the unload lock chamber 1310 or discharges it out of the unload lock chamber 1310. . Since the transfer unit may be configured in the same manner as the transfer unit installed in the load lock chamber 1100 and the process chamber 1200 described above, a detailed description thereof will be omitted.

Although not shown, the unload lock chamber 1310 may include cooling means for cooling the substrate S, for example, a means for supplying a cooling medium. The unload lock chamber 1310 may be provided with a pump for forming the internal space in a vacuum. The unload lock chamber 1310 may further include a cart position sensor.

On the other hand, one side of the load lock chamber unit 1100 is provided with a loading station for loading the substrate (S) to the cart 110 to the low lock chamber unit 1100, one side of the unload lock chamber unit 1300 An unloading station may be provided to unload the substrate S from the cart 110 and to discharge the cart 110. The cart 110 discharged from the unloading station descends from the unloading station, and then passes through the unload lock chamber 1300, the process chamber 1200, and the lower side of the load lock chamber 1100 to the loading station. By being conveyed, it can circulate.

A method of inlining the substrate S by the inline processing apparatus 1000 having the above configuration will be described below.

First, the substrate S is loaded into the cart 110 and transferred to the load lock chamber 1110, and then the substrate is preheated in the load lock chamber 1110.

The cart 110 loaded with the preheated substrate is then transferred into the process chamber 1210. When the substrate is positioned in the process chamber 1210, the lifting pins in the process chamber 1210 are raised to lift the substrate. The substrate is then separated from the cart 110 and unloaded. Subsequently, the substrate is unloaded and the empty cart 110 is transferred into the unload lock chamber 1310 and discharged out of the process chamber 1210.

After the cart 110 is completely discharged from the process chamber 1210, the lifting pins in the process chamber 1210 are lowered to seat the substrate on the heating surface. Subsequently, the substrate is heated, and a process such as thin film deposition is performed on the heated substrate.

When the processing of the substrate is completed, the lifting pins in the process chamber 1210 are raised to lift the processed substrate. At this time, the height of lifting the substrate may be set equal to the height for loading the substrate from the cart (110).

Subsequently, the cart 110 that has been temporarily discharged into the unload lock chamber 1310 is transferred back into the process chamber 1210. When the cart 110 is positioned at the substrate loading position, the lifting pins in the process chamber 1210 are lowered to load the processed substrate into the cart 110.

Subsequently, the cart 110 loaded with the processed substrate is transferred into the unload lock chamber 1310 and then cooled to the substrate transferred into the unload lock chamber 1310.

As described above, according to the in-line processing apparatus 1000 and the in-line processing method according to an embodiment of the present invention, since the substrate can be processed continuously, it is possible to shorten the process time and improve productivity.

Meanwhile, the preheating of the substrate in the load lock chamber 1110 may include a preheating process with the cart 110 while the substrate is loaded in the cart 110. As another example, preheating the substrate in the load lock chamber 1110 may include unloading the substrate from the cart 110 to preheat only the substrate by the heating unit. Here, the process of unloading the substrate from the cart 110 and preheating only the substrate by the heating unit may be the same as the process performed in the above-described process chamber 1210.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is merely exemplary, and various modifications and equivalent other embodiments are possible to those skilled in the art. I can understand. Accordingly, the true scope of protection of the invention should be defined only by the appended claims.

1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a state in which a cart loaded with a substrate is supplied into a chamber in FIG. 1; FIG.

FIG. 3 is a perspective view of the transfer unit and the lift unit shown in FIG. 1;

4 to 7 are cross-sectional views for explaining a process of loading or unloading the substrate to the cart and the heating unit in FIG.

8 is a perspective view of an inline processing system according to one embodiment of the invention.

<Brief description of the major symbols in the drawings>

110. Cart 120. Processing chamber part

131. Chamber 141. Transfer unit

151..Heating section 161 .. Lifting unit

1100..Loadlock chamber part 1200..Process chamber part

1300..Unload Lock Chamber

Claims (13)

A cart having a substrate open at a center thereof to support a substrate under the edge of the substrate and having a rear end opened based on a transport direction of the substrate, and a substrate processing chamber portion for processing the substrate supplied from the cart; The substrate processing chamber portion, A chamber having an interior space; A transfer unit for feeding the cart into or out of the chamber; A heating unit installed in the chamber and having a substrate seated thereon; And Lifting or lowering the substrate supplied into the chamber so that the substrate is loaded or unloaded to the cart and the heating unit, and a plurality of lifting pins and the lifting drive mechanism for lifting the lifting pins up and down through the heating unit. And an elevating unit. The method of claim 1, The cart has a concave seating surface formed so that the edge portion of the substrate can be seated along the inner edge, and the locking jaws are formed on both edges of the rear end so that the substrate is not moved away horizontally. Processing unit. The method of claim 1, The transfer unit is: A plurality of rollers on which the cart is mounted and spaced apart from each other along the conveying direction of the cart and rotatably installed on both sides of the chamber; And a roller drive mechanism for providing rotational force to all of the rollers. The method of claim 3, wherein The roller drive mechanism is: First gears coaxially coupled to the rollers, respectively; Second gears engaged with the first gears and spaced apart from each other, Connecting gears interposed between the second gears and engaged with the second gears, respectively; A motor connected to any one of the first gear, the second gear, and the connecting gear to provide a rotational force, and And at least one of the second gears and the connection gears on the left side, and a driving connecting shaft which connects and rotates together the ones on the right side of the second shaft. The method of claim 1, The chamber further comprises a cart position sensor for sensing the position of the cart so that the substrate is positioned in the interior. Loading the substrate into the cart and transferring it into the chamber; Unloading the substrate from the cart as the lift pins in the chamber are raised to lift the substrate; Transferring the cart with the substrate unloaded out of the chamber; Lowering the lifting pins in the chamber to seat the substrate on the heating surface, and then processing the substrate; Raising the lift pins in the chamber to lift the processed substrate and then transferring the cart outside the chamber into the chamber; And And lowering the lifting pins in the chamber to load the processed substrate into the cart and then to transport it out of the chamber. A cart having a substrate mounted thereon, the center of which is opened so as to support under the edge of the substrate and having a rear end opened based on the transfer direction of the substrate; A load lock chamber unit preheating the supplied substrate; Process processing on the substrate supplied from the load lock chamber unit, a transfer unit for supplying the substrate placed on the cart into the process chamber or discharged out of the process chamber, and installed in the process chamber A heating part on which a substrate is seated on the substrate, and a plurality of lifting pins and lifting pins for lifting up and down through the heating part by raising or lowering the substrate so that the substrate is loaded or unloaded from the cart and the heating part. A process chamber unit including a lifting unit having a drive mechanism; And And an unload lock chamber configured to cool the substrate supplied from the process chamber. The method of claim 7, wherein In the cart, the inclined seating surface is formed so that the edge portion of the substrate can be seated along the inner edge, and the locking jaw is formed on both edges of the rear end so that the substrate is not horizontally moved backward Processing system. The method of claim 7, wherein The transfer unit is: A plurality of rollers on which the cart is mounted and spaced apart from each other along the conveying direction of the cart and rotatably installed on both sides of the process chamber; And a roller drive mechanism for providing rotational force to all of the rollers. The method of claim 9, The roller drive mechanism is: First gears coaxially coupled to the rollers, respectively; Second gears engaged with the first gears and spaced apart from each other, Connecting gears interposed between the second gears; A motor connected to any one of the first gear, the second gear, and the connecting gear to provide a rotational force, and And at least one of the second gears or the connecting gears on the left side and a driving connecting shaft which connects and rotates together the ones on the right side of the shaft coaxially to the right side. The method of claim 7, wherein The process chamber, the in-line processing system further comprises a cart position sensor for detecting the position of the cart so that the substrate is positioned in the interior. Loading the cart into a load lock chamber and preheating the transferred substrate; Transferring the cart loaded with the preheated substrate into the process chamber; Lifting the lift pins in the process chamber to unload the substrate from the cart as it lifts the substrate; Transferring the cart with the substrate unloaded into the unload lock chamber; Lowering the lifting pins in the process chamber to seat the substrate on the upper surface of the heating part, and then processing the process; Raising the lift pins in the process chamber to lift the processed substrate and then transferring the cart in the unload lock chamber into the process chamber; Lowering the lifting pins in the process chamber to load the processed substrate into a cart; And And transferring the cart loaded with the processed substrate into the unload lock chamber, followed by cooling the transferred substrate. The method of claim 12, Preheating the transferred substrate includes preheating the cart with the substrate loaded in the cart or unloading the substrate from the cart to preheat only the substrate.

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