KR101614590B1 - 경화성 수지 조성물 - Google Patents

경화성 수지 조성물 Download PDF

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Publication number
KR101614590B1
KR101614590B1 KR1020137012137A KR20137012137A KR101614590B1 KR 101614590 B1 KR101614590 B1 KR 101614590B1 KR 1020137012137 A KR1020137012137 A KR 1020137012137A KR 20137012137 A KR20137012137 A KR 20137012137A KR 101614590 B1 KR101614590 B1 KR 101614590B1
Authority
KR
South Korea
Prior art keywords
group
resin composition
curable resin
ladder
silsesquioxane
Prior art date
Application number
KR1020137012137A
Other languages
English (en)
Korean (ko)
Other versions
KR20140005884A (ko
Inventor
게이조 이노우에
시게아끼 가무로
Original Assignee
주식회사 다이셀
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 다이셀 filed Critical 주식회사 다이셀
Publication of KR20140005884A publication Critical patent/KR20140005884A/ko
Application granted granted Critical
Publication of KR101614590B1 publication Critical patent/KR101614590B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5406—Silicon-containing compounds containing elements other than oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020137012137A 2010-12-07 2011-11-29 경화성 수지 조성물 KR101614590B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010272358A JP5690571B2 (ja) 2010-12-07 2010-12-07 硬化性樹脂組成物
JPJP-P-2010-272358 2010-12-07
PCT/JP2011/077495 WO2012077528A1 (ja) 2010-12-07 2011-11-29 硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
KR20140005884A KR20140005884A (ko) 2014-01-15
KR101614590B1 true KR101614590B1 (ko) 2016-04-21

Family

ID=46207019

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137012137A KR101614590B1 (ko) 2010-12-07 2011-11-29 경화성 수지 조성물

Country Status (5)

Country Link
JP (1) JP5690571B2 (zh)
KR (1) KR101614590B1 (zh)
CN (1) CN103080233B (zh)
TW (1) TWI530531B (zh)
WO (1) WO2012077528A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10197916B2 (en) * 2014-11-07 2019-02-05 Dic Corporation Curable composition, resist material and resist film
CN114302913A (zh) * 2019-09-05 2022-04-08 3M创新有限公司 包含含氟聚合物和支链倍半硅氧烷聚合物的组合物和制品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010001336A (ja) * 2008-06-18 2010-01-07 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物及び半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3449593B2 (ja) * 1997-01-07 2003-09-22 日本電信電話株式会社 光学材料およびこれを用いた光導波路
JP2000114240A (ja) * 1998-09-30 2000-04-21 Hitachi Ltd プラズマ処理装置及びプラズマ閉じ込め方法
EP1312659A1 (en) * 2000-08-17 2003-05-21 Nippon Sheet Glass Co., Ltd. Adhesive composition and optical device using the same
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP5298501B2 (ja) * 2007-11-02 2013-09-25 信越化学工業株式会社 透明材料用含フッ素硬化性組成物
JP2009277887A (ja) * 2008-05-15 2009-11-26 Shin Etsu Chem Co Ltd 発光装置
JP5972512B2 (ja) * 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP5612960B2 (ja) * 2010-08-11 2014-10-22 株式会社ダイセル フッ素含有化合物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010001336A (ja) * 2008-06-18 2010-01-07 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物及び半導体装置

Also Published As

Publication number Publication date
JP5690571B2 (ja) 2015-03-25
JP2012121955A (ja) 2012-06-28
CN103080233B (zh) 2015-06-24
TWI530531B (zh) 2016-04-21
KR20140005884A (ko) 2014-01-15
WO2012077528A1 (ja) 2012-06-14
TW201231556A (en) 2012-08-01
CN103080233A (zh) 2013-05-01

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