KR101613274B1 - 무선 주파수 패키지 온 패키지 회로 및 무선 주파수 패키지 온 패키지 회로를 생성하기 위한 방법, 장치, 컴퓨터 판독가능 매체 - Google Patents

무선 주파수 패키지 온 패키지 회로 및 무선 주파수 패키지 온 패키지 회로를 생성하기 위한 방법, 장치, 컴퓨터 판독가능 매체 Download PDF

Info

Publication number
KR101613274B1
KR101613274B1 KR1020147016356A KR20147016356A KR101613274B1 KR 101613274 B1 KR101613274 B1 KR 101613274B1 KR 1020147016356 A KR1020147016356 A KR 1020147016356A KR 20147016356 A KR20147016356 A KR 20147016356A KR 101613274 B1 KR101613274 B1 KR 101613274B1
Authority
KR
South Korea
Prior art keywords
radio frequency
package
frequency package
circuit
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020147016356A
Other languages
English (en)
Korean (ko)
Other versions
KR20140094616A (ko
Inventor
아리스토텔레 하드지크리스토스
구르칸왈 싱 사호타
스티븐 씨. 시카렐리
데이비드 제이. 와일딩
리안 디. 레인
크리스티안 홀렌슈타인
밀린드 피. 샤
Original Assignee
퀄컴 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 퀄컴 인코포레이티드 filed Critical 퀄컴 인코포레이티드
Publication of KR20140094616A publication Critical patent/KR20140094616A/ko
Application granted granted Critical
Publication of KR101613274B1 publication Critical patent/KR101613274B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/1401—Structure
    • H01L2224/1403—Bump connectors having different sizes, e.g. different diameters, heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16265—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being a discrete passive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H01L2224/171—Disposition
    • H01L2224/1718—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/17181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/5317—Laminated device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Amplifiers (AREA)
  • Transceivers (AREA)
KR1020147016356A 2011-11-15 2012-11-15 무선 주파수 패키지 온 패키지 회로 및 무선 주파수 패키지 온 패키지 회로를 생성하기 위한 방법, 장치, 컴퓨터 판독가능 매체 Expired - Fee Related KR101613274B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161560157P 2011-11-15 2011-11-15
US61/560,157 2011-11-15
US13/677,054 2012-11-14
US13/677,054 US9131634B2 (en) 2011-11-15 2012-11-14 Radio frequency package on package circuit
PCT/US2012/065363 WO2013074846A1 (en) 2011-11-15 2012-11-15 Radio frequency package on package circuit

Publications (2)

Publication Number Publication Date
KR20140094616A KR20140094616A (ko) 2014-07-30
KR101613274B1 true KR101613274B1 (ko) 2016-04-18

Family

ID=48281100

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147016356A Expired - Fee Related KR101613274B1 (ko) 2011-11-15 2012-11-15 무선 주파수 패키지 온 패키지 회로 및 무선 주파수 패키지 온 패키지 회로를 생성하기 위한 방법, 장치, 컴퓨터 판독가능 매체

Country Status (7)

Country Link
US (1) US9131634B2 (enExample)
EP (1) EP2780941A1 (enExample)
JP (1) JP6109842B2 (enExample)
KR (1) KR101613274B1 (enExample)
CN (1) CN103930989B (enExample)
IN (1) IN2014CN02599A (enExample)
WO (1) WO2013074846A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9252147B2 (en) * 2013-08-05 2016-02-02 Qualcomm Incorporated Methods and apparatuses for forming multiple radio frequency (RF) components associated with different RF bands on a chip
CN107078125B (zh) 2015-01-21 2020-06-02 株式会社村田制作所 功率放大模块
WO2016189951A1 (ja) * 2015-05-26 2016-12-01 株式会社村田製作所 フィルタ装置
WO2017033564A1 (ja) 2015-08-27 2017-03-02 株式会社村田製作所 高周波モジュール
CN105514094A (zh) * 2016-01-29 2016-04-20 宜确半导体（苏州）有限公司 一种射频天线开关芯片
DE102016110862B4 (de) * 2016-06-14 2022-06-30 Snaptrack, Inc. Modul und Verfahren zur Herstellung einer Vielzahl von Modulen
US10312193B2 (en) * 2016-08-12 2019-06-04 Qualcomm Incorporated Package comprising switches and filters
US10685924B2 (en) * 2017-08-24 2020-06-16 Qualcomm Incorporated Antenna-on-package arrangements
WO2019065668A1 (ja) * 2017-09-29 2019-04-04 株式会社村田製作所 高周波モジュールおよび通信装置
WO2019075450A1 (en) * 2017-10-15 2019-04-18 Skyworks Solutions, Inc. STACK ASSEMBLY WITH ELECTRO-ACOUSTIC DEVICE
CN109087909B (zh) * 2018-08-10 2024-08-02 浙江熔城半导体有限公司 具有金属柱的多腔室封装结构及其制作方法
CN108807350B (zh) * 2018-08-10 2024-08-02 浙江熔城半导体有限公司 放大器芯片电极外设的多腔室封装结构及其制作方法
KR102578395B1 (ko) * 2019-04-25 2023-09-14 엘지전자 주식회사 커넥터를 구비하는 전자 기기
CN111276475B (zh) * 2020-05-07 2020-08-18 杭州臻镭微波技术有限公司 一种三维异构集成综合射频前端微系统
JP2022007366A (ja) * 2020-06-26 2022-01-13 株式会社村田製作所 高周波モジュールおよび通信装置
US11152707B1 (en) * 2020-07-02 2021-10-19 International Business Machines Corporation Fast radio frequency package
CN112117978A (zh) * 2020-10-15 2020-12-22 北京飞宇微电子电路有限责任公司 一种信号处理装置及其预处理模块
CN112117984A (zh) * 2020-10-15 2020-12-22 北京飞宇微电子电路有限责任公司 一种预处理模块
CN112865835A (zh) * 2021-01-05 2021-05-28 上海闻泰信息技术有限公司 一种射频前端模组的封装结构及移动终端
CN115037357B (zh) * 2022-06-08 2023-03-14 西安交通大学 一种瓦片式下变频器、相控阵天线系统及卫星通信系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030122638A1 (en) 2001-12-27 2003-07-03 Yukinobu Tarui Stacked radio-frequency module
US20080111226A1 (en) * 2006-11-15 2008-05-15 White George E Integration using package stacking with multi-layer organic substrates
US20090160430A1 (en) 2007-12-20 2009-06-25 Anritsu Company HAND-HELD MICROWAVE SPECTRUM ANALYZER WITH OPERATION RANGE FROM 9 KHz TO OVER 20 GHz
US20110128713A1 (en) 2009-11-30 2011-06-02 Renesas Electronics Corporation Semiconductor device and method of manufacturing the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59172271A (ja) 1983-03-19 1984-09-28 Fujitsu Ltd 半導体装置
US6150724A (en) 1998-03-02 2000-11-21 Motorola, Inc. Multi-chip semiconductor device and method for making the device by using multiple flip chip interfaces
JP2000223656A (ja) * 1999-02-03 2000-08-11 Rohm Co Ltd 無線通信装置用半導体装置およびこれを用いた無線通信装置
US6856007B2 (en) 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US20060255446A1 (en) 2001-10-26 2006-11-16 Staktek Group, L.P. Stacked modules and method
US7239020B2 (en) 2004-05-06 2007-07-03 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Multi-mode integrated circuit structure
US7772708B2 (en) 2006-08-31 2010-08-10 Intel Corporation Stacking integrated circuit dies
JP4734282B2 (ja) * 2007-04-23 2011-07-27 株式会社日立製作所 半導体チップおよび半導体装置
US20090321876A1 (en) * 2008-06-30 2009-12-31 Telesphor Kamgaing System with radio frequency integrated circuits
JP4833307B2 (ja) * 2009-02-24 2011-12-07 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体モジュール、端子板、端子板の製造方法および半導体モジュールの製造方法
CN102184906B (zh) * 2011-03-31 2013-05-08 锐迪科创微电子（北京）有限公司 带有绝缘体填充的阱结构的封装基板及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030122638A1 (en) 2001-12-27 2003-07-03 Yukinobu Tarui Stacked radio-frequency module
US20080111226A1 (en) * 2006-11-15 2008-05-15 White George E Integration using package stacking with multi-layer organic substrates
US20090160430A1 (en) 2007-12-20 2009-06-25 Anritsu Company HAND-HELD MICROWAVE SPECTRUM ANALYZER WITH OPERATION RANGE FROM 9 KHz TO OVER 20 GHz
US20110128713A1 (en) 2009-11-30 2011-06-02 Renesas Electronics Corporation Semiconductor device and method of manufacturing the same

Also Published As

Publication number Publication date
WO2013074846A1 (en) 2013-05-23
US20130122833A1 (en) 2013-05-16
JP6109842B2 (ja) 2017-04-05
CN103930989A (zh) 2014-07-16
CN103930989B (zh) 2017-07-21
KR20140094616A (ko) 2014-07-30
IN2014CN02599A (enExample) 2015-08-07
EP2780941A1 (en) 2014-09-24
JP2014533911A (ja) 2014-12-15
US9131634B2 (en) 2015-09-08

Similar Documents

Publication Publication Date Title
KR101613274B1 (ko) 무선 주파수 패키지 온 패키지 회로 및 무선 주파수 패키지 온 패키지 회로를 생성하기 위한 방법, 장치, 컴퓨터 판독가능 매체
CN104105342B (zh) 高频电路组件
US7596357B2 (en) High-frequency switching circuit, high-frequency module, and wireless communications device
US9178491B2 (en) Circuit module including duplexer
CN106797222B (zh) 轮廓调谐电路
US9917615B2 (en) Radio-frequency module
US8987061B2 (en) Methods for antenna switch modules
CN103973332B (zh) 模块基板及模块
US10103135B2 (en) Backside ground plane for integrated circuit
US9252476B2 (en) Circuit module including a splitter and a mounting substrate
JP5456935B1 (ja) 回路モジュール
JP6721114B2 (ja) 高周波モジュール
US20120077449A1 (en) Radio frequency power amplifier
US20130314170A1 (en) Switch module
US8963652B2 (en) Duplexer and circuit module including the same
US20200077510A1 (en) Devices and methods related to nested filters
WO2018123972A1 (ja) 高周波モジュール及び通信装置
JP2021170701A (ja) 高周波モジュール及び通信装置
CN117713865A (zh) 射频前端模组和通信设备
JP2021170702A (ja) 高周波モジュール及び通信装置
CN114270714B (zh) 高频模块以及通信装置
JP2006253834A (ja) 高周波モジュ−ル及びそれを搭載した無線通信装置
JP2006203470A (ja) 高周波モジュール及び無線通信機器
JP2006211144A (ja) 高周波モジュール及び無線通信機器
HK1232683A1 (en) Network with integrated passive device and conductive trace in packaging substrate and related modules and devices

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20190327

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20210412

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20210412