KR101603967B1 - 연속 패턴 도금 전사 시스템 및 연속 패턴 도금 전사물 제조 방법 - Google Patents

연속 패턴 도금 전사 시스템 및 연속 패턴 도금 전사물 제조 방법 Download PDF

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Publication number
KR101603967B1
KR101603967B1 KR1020147026916A KR20147026916A KR101603967B1 KR 101603967 B1 KR101603967 B1 KR 101603967B1 KR 1020147026916 A KR1020147026916 A KR 1020147026916A KR 20147026916 A KR20147026916 A KR 20147026916A KR 101603967 B1 KR101603967 B1 KR 101603967B1
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KR
South Korea
Prior art keywords
plating
pattern
dlc
cylinder body
transfer
Prior art date
Application number
KR1020147026916A
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English (en)
Korean (ko)
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KR20140132743A (ko
Inventor
타츠오 시게타
Original Assignee
가부시키가이샤 씽크. 라보라토리
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 씽크. 라보라토리 filed Critical 가부시키가이샤 씽크. 라보라토리
Publication of KR20140132743A publication Critical patent/KR20140132743A/ko
Application granted granted Critical
Publication of KR101603967B1 publication Critical patent/KR101603967B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020147026916A 2012-07-20 2013-07-16 연속 패턴 도금 전사 시스템 및 연속 패턴 도금 전사물 제조 방법 KR101603967B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2012-161927 2012-07-20
JP2012161927 2012-07-20
JPJP-P-2012-248482 2012-11-12
JP2012248482A JP6117520B2 (ja) 2012-07-20 2012-11-12 連続パターンメッキ転写システム及び連続パターンメッキ転写物製造方法
PCT/JP2013/069238 WO2014013962A1 (ja) 2012-07-20 2013-07-16 連続パターンメッキ転写システム及び連続パターンメッキ転写物製造方法

Publications (2)

Publication Number Publication Date
KR20140132743A KR20140132743A (ko) 2014-11-18
KR101603967B1 true KR101603967B1 (ko) 2016-03-16

Family

ID=49948789

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147026916A KR101603967B1 (ko) 2012-07-20 2013-07-16 연속 패턴 도금 전사 시스템 및 연속 패턴 도금 전사물 제조 방법

Country Status (4)

Country Link
JP (1) JP6117520B2 (zh)
KR (1) KR101603967B1 (zh)
CN (1) CN104206031B (zh)
WO (1) WO2014013962A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101696118B1 (ko) * 2015-12-22 2017-01-13 주식회사 포스코 금속박판 제조장치
KR102288594B1 (ko) * 2021-02-26 2021-08-11 주식회사 이송이엠씨 박막 fmcl 제조 장치 및 박막 fmcl 제조 방법
CN116960266A (zh) * 2023-09-21 2023-10-27 河南锂动电源有限公司 一种极片补锂装置、极片补锂系统及极片补锂方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005206933A (ja) 2003-06-27 2005-08-04 Kyocera Corp 電子部品の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5939542A (ja) * 1982-08-30 1984-03-03 株式会社井上ジャパックス研究所 電磁波の通過防止体の製造方法
JPS6196795A (ja) * 1984-10-17 1986-05-15 日本写真印刷株式会社 印刷配線板の製造方法
JPS63136689A (ja) * 1986-11-28 1988-06-08 三菱電機株式会社 両面回路形成方法および装置
JPH09260809A (ja) * 1996-03-26 1997-10-03 Tokai Rubber Ind Ltd プリント回路体及びその製造方法
US20060163073A1 (en) * 2003-06-27 2006-07-27 Nobuhiro Higashihara Process for producing metal plating film, process for producing electronic part and plating film forming apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005206933A (ja) 2003-06-27 2005-08-04 Kyocera Corp 電子部品の製造方法

Also Published As

Publication number Publication date
KR20140132743A (ko) 2014-11-18
JP6117520B2 (ja) 2017-04-19
WO2014013962A1 (ja) 2014-01-23
JP2014037615A (ja) 2014-02-27
CN104206031B (zh) 2018-04-27
CN104206031A (zh) 2014-12-10

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