KR101596070B1 - 복사 방출 장치 및 복사 방출 장치의 제조 방법 - Google Patents

복사 방출 장치 및 복사 방출 장치의 제조 방법 Download PDF

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Publication number
KR101596070B1
KR101596070B1 KR1020117004233A KR20117004233A KR101596070B1 KR 101596070 B1 KR101596070 B1 KR 101596070B1 KR 1020117004233 A KR1020117004233 A KR 1020117004233A KR 20117004233 A KR20117004233 A KR 20117004233A KR 101596070 B1 KR101596070 B1 KR 101596070B1
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South Korea
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electrode
substrate
metal film
encapsulation part
film
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KR20110055568A (ko
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마르쿠스 클레인
틸만 슈렌커
앤드류 잉글
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오스람 오엘이디 게엠베하
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/26—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80515—Anodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8721—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020117004233A 2008-07-25 2009-07-21 복사 방출 장치 및 복사 방출 장치의 제조 방법 Active KR101596070B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102008034717 2008-07-25
DE102008034717.5 2008-07-25
DE102008053326.2 2008-10-27
DE102008053326A DE102008053326A1 (de) 2008-07-25 2008-10-27 Strahlungsemittierende Vorrichtung und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung

Publications (2)

Publication Number Publication Date
KR20110055568A KR20110055568A (ko) 2011-05-25
KR101596070B1 true KR101596070B1 (ko) 2016-02-19

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KR1020117004233A Active KR101596070B1 (ko) 2008-07-25 2009-07-21 복사 방출 장치 및 복사 방출 장치의 제조 방법

Country Status (7)

Country Link
US (1) US8772818B2 (https=)
EP (1) EP2308117B1 (https=)
JP (1) JP5794915B2 (https=)
KR (1) KR101596070B1 (https=)
CN (1) CN102106018B (https=)
DE (1) DE102008053326A1 (https=)
WO (1) WO2010009716A2 (https=)

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WO2010066245A1 (de) 2008-12-11 2010-06-17 Osram Opto Semiconductors Gmbh Organische leuchtdiode und beleuchtungsmittel
JP5010758B2 (ja) * 2010-06-04 2012-08-29 三井金属鉱業株式会社 電極箔および有機デバイス
JP2012054225A (ja) * 2010-08-04 2012-03-15 Canon Inc 表示装置
KR101430173B1 (ko) * 2010-10-19 2014-08-13 삼성디스플레이 주식회사 유기 발광 표시 장치
CN107039484B (zh) * 2011-06-27 2020-09-15 薄膜电子有限公司 具有横向尺寸改变吸收缓冲层的电子部件及其生产方法
JP6362330B2 (ja) * 2011-11-14 2018-07-25 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子、及び、面状発光体
EP2794814B1 (de) 2011-12-19 2017-10-18 InovisCoat GmbH Leuchtelemente mit einer elektrolumineszenzanordnung sowie verfahren zur herstellung eines leuchtelements
DE102012109228A1 (de) * 2012-09-28 2014-04-03 Osram Opto Semiconductors Gmbh Verfahren zum Ermitteln der Permeabilität einer dielektrischen Schicht eines optoelektronischen Bauelementes; Vorrichtung zum Ermitteln der Permeabilität einer dielektrischen Schicht eines optoelektronischen Bauelementes; optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes
KR102083448B1 (ko) * 2012-12-20 2020-03-03 삼성디스플레이 주식회사 기상 증착 장치, 이를 이용한 증착 방법 및 유기 발광 표시 장치 제조 방법
US8921839B2 (en) * 2013-03-12 2014-12-30 Sharp Laboratories Of America, Inc. Light emitting device with spherical back mirror
US9356256B2 (en) * 2013-07-31 2016-05-31 Samsung Display Co., Ltd. Flexible display device and manufacturing method thereof
KR102253531B1 (ko) * 2014-07-25 2021-05-18 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN109994643B (zh) * 2018-01-02 2021-02-02 京东方科技集团股份有限公司 有机发光二极管器件及其制造方法、显示基板、显示装置
US20220209166A1 (en) * 2019-04-11 2022-06-30 Sharp Kabushiki Kaisha Light-emitting element and display device
CN110943184B (zh) * 2019-12-13 2022-08-16 昆山国显光电有限公司 显示面板及其制造方法、蒸镀掩模版组及显示装置
CN115275779A (zh) * 2022-07-13 2022-11-01 常州承芯半导体有限公司 垂直腔面发射激光器及其形成方法

Citations (2)

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JP2004319484A (ja) * 2003-04-11 2004-11-11 Eastman Kodak Co 透明防湿層を形成するための方法及び装置並びに防湿型ｏｌｅｄデバイス
JP2007073338A (ja) * 2005-09-07 2007-03-22 Toyota Industries Corp 有機ｅｌ装置の製造方法及び有機ｅｌ装置

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JPH11339969A (ja) * 1998-05-22 1999-12-10 Tdk Corp 有機ｅｌ素子
CA2353506A1 (en) * 1998-11-02 2000-05-11 3M Innovative Properties Company Transparent conductive oxides for plastic flat panel displays
US6633121B2 (en) * 2000-01-31 2003-10-14 Idemitsu Kosan Co., Ltd. Organic electroluminescence display device and method of manufacturing same
US20020110673A1 (en) * 2001-02-14 2002-08-15 Ramin Heydarpour Multilayered electrode/substrate structures and display devices incorporating the same
EP1419286A1 (en) * 2001-08-20 2004-05-19 Nova-Plasma Inc. Coatings with low permeation of gases and vapors
JP4383077B2 (ja) * 2003-03-31 2009-12-16 大日本印刷株式会社 ガスバリア性基板
US7229703B2 (en) 2003-03-31 2007-06-12 Dai Nippon Printing Co. Ltd. Gas barrier substrate
EP1712109A4 (en) 2003-12-30 2008-03-19 Agency Science Tech & Res FLEXIBLE ELECTROLUMINESCENT FACILITIES
KR100666550B1 (ko) * 2004-04-07 2007-01-09 삼성에스디아이 주식회사 평판표시장치 및 그의 제조방법
DE102004022004B4 (de) * 2004-05-03 2007-07-05 Novaled Ag Schichtanordnung für eine organische lichtemittierende Diode
JP2006024535A (ja) 2004-07-09 2006-01-26 Seiko Epson Corp 有機薄膜素子の製造方法、電気光学装置の製造方法及び電子機器の製造方法
US7504770B2 (en) * 2005-02-09 2009-03-17 Osram Opto Semiconductors Gmbh Enhancement of light extraction with cavity and surface modification
US7597603B2 (en) * 2005-12-06 2009-10-06 Corning Incorporated Method of encapsulating a display element
CN100585771C (zh) * 2005-12-06 2010-01-27 康宁股份有限公司 包封显示元件的方法
DE102006060781B4 (de) * 2006-09-29 2021-09-16 Pictiva Displays International Limited Organisches Leuchtmittel
JP2008311059A (ja) 2007-06-14 2008-12-25 Rohm Co Ltd 有機エレクトロルミネセンス素子及びその製造方法

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JP2004319484A (ja) * 2003-04-11 2004-11-11 Eastman Kodak Co 透明防湿層を形成するための方法及び装置並びに防湿型ｏｌｅｄデバイス
JP2007073338A (ja) * 2005-09-07 2007-03-22 Toyota Industries Corp 有機ｅｌ装置の製造方法及び有機ｅｌ装置

Also Published As

Publication number Publication date
DE102008053326A1 (de) 2010-01-28
JP2011529244A (ja) 2011-12-01
EP2308117B1 (de) 2019-12-11
CN102106018A (zh) 2011-06-22
CN102106018B (zh) 2015-04-22
JP5794915B2 (ja) 2015-10-14
WO2010009716A3 (de) 2010-05-14
US20110260201A1 (en) 2011-10-27
US8772818B2 (en) 2014-07-08
KR20110055568A (ko) 2011-05-25
EP2308117A2 (de) 2011-04-13
WO2010009716A2 (de) 2010-01-28

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