DE102008053326A1 - Strahlungsemittierende Vorrichtung und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung - Google Patents

Strahlungsemittierende Vorrichtung und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung Download PDF

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Publication number
DE102008053326A1
DE102008053326A1 DE102008053326A DE102008053326A DE102008053326A1 DE 102008053326 A1 DE102008053326 A1 DE 102008053326A1 DE 102008053326 A DE102008053326 A DE 102008053326A DE 102008053326 A DE102008053326 A DE 102008053326A DE 102008053326 A1 DE102008053326 A1 DE 102008053326A1
Authority
DE
Germany
Prior art keywords
substrate
radiation
electrode
emitting device
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102008053326A
Other languages
German (de)
English (en)
Inventor
Markus Dr. Klein
Andrew Ingle
Tilman Dr. Schlenker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Oled GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE102008053326A priority Critical patent/DE102008053326A1/de
Priority to JP2011519037A priority patent/JP5794915B2/ja
Priority to US13/055,901 priority patent/US8772818B2/en
Priority to EP09775996.3A priority patent/EP2308117B1/de
Priority to PCT/DE2009/001022 priority patent/WO2010009716A2/de
Priority to KR1020117004233A priority patent/KR101596070B1/ko
Priority to CN200980129404.8A priority patent/CN102106018B/zh
Publication of DE102008053326A1 publication Critical patent/DE102008053326A1/de
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/26Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8051Anodes
    • H10K59/80515Anodes characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60Forming conductive regions or layers, e.g. electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8721Metallic sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • H10K59/8731Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/874Passivation; Containers; Encapsulations including getter material or desiccant
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
DE102008053326A 2008-07-25 2008-10-27 Strahlungsemittierende Vorrichtung und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung Withdrawn DE102008053326A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102008053326A DE102008053326A1 (de) 2008-07-25 2008-10-27 Strahlungsemittierende Vorrichtung und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung
JP2011519037A JP5794915B2 (ja) 2008-07-25 2009-07-21 ビーム放射装置およびビーム放射装置を製造する方法
US13/055,901 US8772818B2 (en) 2008-07-25 2009-07-21 Radiation-emitting device and method for producing a radiation-emitting device
EP09775996.3A EP2308117B1 (de) 2008-07-25 2009-07-21 Strahlungsemittierende vorrichtung und verfahren zur herstellung einer strahlungsemittierenden vorrichtung
PCT/DE2009/001022 WO2010009716A2 (de) 2008-07-25 2009-07-21 Strahlungsemittierende vorrichtung und verfahren zur herstellung einer strahlungsemittierenden vorrichtung
KR1020117004233A KR101596070B1 (ko) 2008-07-25 2009-07-21 복사 방출 장치 및 복사 방출 장치의 제조 방법
CN200980129404.8A CN102106018B (zh) 2008-07-25 2009-07-21 发射辐射的装置和用于制造发射辐射的装置的方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008034717 2008-07-25
DE102008034717.5 2008-07-25
DE102008053326A DE102008053326A1 (de) 2008-07-25 2008-10-27 Strahlungsemittierende Vorrichtung und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung

Publications (1)

Publication Number Publication Date
DE102008053326A1 true DE102008053326A1 (de) 2010-01-28

Family

ID=41428852

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008053326A Withdrawn DE102008053326A1 (de) 2008-07-25 2008-10-27 Strahlungsemittierende Vorrichtung und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung

Country Status (7)

Country Link
US (1) US8772818B2 (https=)
EP (1) EP2308117B1 (https=)
JP (1) JP5794915B2 (https=)
KR (1) KR101596070B1 (https=)
CN (1) CN102106018B (https=)
DE (1) DE102008053326A1 (https=)
WO (1) WO2010009716A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012109228A1 (de) * 2012-09-28 2014-04-03 Osram Opto Semiconductors Gmbh Verfahren zum Ermitteln der Permeabilität einer dielektrischen Schicht eines optoelektronischen Bauelementes; Vorrichtung zum Ermitteln der Permeabilität einer dielektrischen Schicht eines optoelektronischen Bauelementes; optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010066245A1 (de) 2008-12-11 2010-06-17 Osram Opto Semiconductors Gmbh Organische leuchtdiode und beleuchtungsmittel
JP5010758B2 (ja) * 2010-06-04 2012-08-29 三井金属鉱業株式会社 電極箔および有機デバイス
JP2012054225A (ja) * 2010-08-04 2012-03-15 Canon Inc 表示装置
KR101430173B1 (ko) * 2010-10-19 2014-08-13 삼성디스플레이 주식회사 유기 발광 표시 장치
CN107039484B (zh) * 2011-06-27 2020-09-15 薄膜电子有限公司 具有横向尺寸改变吸收缓冲层的电子部件及其生产方法
JP6362330B2 (ja) * 2011-11-14 2018-07-25 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子、及び、面状発光体
EP2794814B1 (de) 2011-12-19 2017-10-18 InovisCoat GmbH Leuchtelemente mit einer elektrolumineszenzanordnung sowie verfahren zur herstellung eines leuchtelements
KR102083448B1 (ko) * 2012-12-20 2020-03-03 삼성디스플레이 주식회사 기상 증착 장치, 이를 이용한 증착 방법 및 유기 발광 표시 장치 제조 방법
US8921839B2 (en) * 2013-03-12 2014-12-30 Sharp Laboratories Of America, Inc. Light emitting device with spherical back mirror
US9356256B2 (en) * 2013-07-31 2016-05-31 Samsung Display Co., Ltd. Flexible display device and manufacturing method thereof
KR102253531B1 (ko) * 2014-07-25 2021-05-18 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN109994643B (zh) * 2018-01-02 2021-02-02 京东方科技集团股份有限公司 有机发光二极管器件及其制造方法、显示基板、显示装置
US20220209166A1 (en) * 2019-04-11 2022-06-30 Sharp Kabushiki Kaisha Light-emitting element and display device
CN110943184B (zh) * 2019-12-13 2022-08-16 昆山国显光电有限公司 显示面板及其制造方法、蒸镀掩模版组及显示装置
CN115275779A (zh) * 2022-07-13 2022-11-01 常州承芯半导体有限公司 垂直腔面发射激光器及其形成方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1691429A2 (en) * 2005-02-09 2006-08-16 Osram Opto Semiconductors GmbH Enhancement of light extraction with cavity and surface modification
DE102004022004B4 (de) * 2004-05-03 2007-07-05 Novaled Ag Schichtanordnung für eine organische lichtemittierende Diode
DE102006060781A1 (de) * 2006-09-29 2008-04-10 Osram Opto Semiconductors Gmbh Organisches Leuchtmittel

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11339969A (ja) * 1998-05-22 1999-12-10 Tdk Corp 有機el素子
CA2353506A1 (en) * 1998-11-02 2000-05-11 3M Innovative Properties Company Transparent conductive oxides for plastic flat panel displays
US6633121B2 (en) * 2000-01-31 2003-10-14 Idemitsu Kosan Co., Ltd. Organic electroluminescence display device and method of manufacturing same
US20020110673A1 (en) * 2001-02-14 2002-08-15 Ramin Heydarpour Multilayered electrode/substrate structures and display devices incorporating the same
EP1419286A1 (en) * 2001-08-20 2004-05-19 Nova-Plasma Inc. Coatings with low permeation of gases and vapors
JP4383077B2 (ja) * 2003-03-31 2009-12-16 大日本印刷株式会社 ガスバリア性基板
US7229703B2 (en) 2003-03-31 2007-06-12 Dai Nippon Printing Co. Ltd. Gas barrier substrate
US6888172B2 (en) * 2003-04-11 2005-05-03 Eastman Kodak Company Apparatus and method for encapsulating an OLED formed on a flexible substrate
EP1712109A4 (en) 2003-12-30 2008-03-19 Agency Science Tech & Res FLEXIBLE ELECTROLUMINESCENT FACILITIES
KR100666550B1 (ko) * 2004-04-07 2007-01-09 삼성에스디아이 주식회사 평판표시장치 및 그의 제조방법
JP2006024535A (ja) 2004-07-09 2006-01-26 Seiko Epson Corp 有機薄膜素子の製造方法、電気光学装置の製造方法及び電子機器の製造方法
JP4830411B2 (ja) * 2005-09-07 2011-12-07 株式会社豊田自動織機 有機el装置の製造方法
US7597603B2 (en) * 2005-12-06 2009-10-06 Corning Incorporated Method of encapsulating a display element
CN100585771C (zh) * 2005-12-06 2010-01-27 康宁股份有限公司 包封显示元件的方法
JP2008311059A (ja) 2007-06-14 2008-12-25 Rohm Co Ltd 有機エレクトロルミネセンス素子及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004022004B4 (de) * 2004-05-03 2007-07-05 Novaled Ag Schichtanordnung für eine organische lichtemittierende Diode
EP1691429A2 (en) * 2005-02-09 2006-08-16 Osram Opto Semiconductors GmbH Enhancement of light extraction with cavity and surface modification
DE102006060781A1 (de) * 2006-09-29 2008-04-10 Osram Opto Semiconductors Gmbh Organisches Leuchtmittel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012109228A1 (de) * 2012-09-28 2014-04-03 Osram Opto Semiconductors Gmbh Verfahren zum Ermitteln der Permeabilität einer dielektrischen Schicht eines optoelektronischen Bauelementes; Vorrichtung zum Ermitteln der Permeabilität einer dielektrischen Schicht eines optoelektronischen Bauelementes; optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes

Also Published As

Publication number Publication date
JP2011529244A (ja) 2011-12-01
EP2308117B1 (de) 2019-12-11
CN102106018A (zh) 2011-06-22
CN102106018B (zh) 2015-04-22
JP5794915B2 (ja) 2015-10-14
WO2010009716A3 (de) 2010-05-14
US20110260201A1 (en) 2011-10-27
US8772818B2 (en) 2014-07-08
KR20110055568A (ko) 2011-05-25
EP2308117A2 (de) 2011-04-13
KR101596070B1 (ko) 2016-02-19
WO2010009716A2 (de) 2010-01-28

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OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
R082 Change of representative

Representative=s name: EPPING HERMANN FISCHER, PATENTANWALTSGESELLSCH, DE

R081 Change of applicant/patentee

Owner name: OSRAM OLED GMBH, DE

Free format text: FORMER OWNER: OSRAM OPTO SEMICONDUCTORS GMBH, 93055 REGENSBURG, DE

Effective date: 20150209

R082 Change of representative

Representative=s name: EPPING HERMANN FISCHER, PATENTANWALTSGESELLSCH, DE

Effective date: 20150209

R005 Application deemed withdrawn due to failure to request examination