KR101588159B1 - 광경화성 수지 조성물, 프린트 배선판, 및 광경화성 수지 조성물의 제조 방법 - Google Patents

광경화성 수지 조성물, 프린트 배선판, 및 광경화성 수지 조성물의 제조 방법 Download PDF

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KR101588159B1
KR101588159B1 KR1020147033546A KR20147033546A KR101588159B1 KR 101588159 B1 KR101588159 B1 KR 101588159B1 KR 1020147033546 A KR1020147033546 A KR 1020147033546A KR 20147033546 A KR20147033546 A KR 20147033546A KR 101588159 B1 KR101588159 B1 KR 101588159B1
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South Korea
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compound
carboxyl group
resin
group
resin composition
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KR1020147033546A
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Korean (ko)
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KR20140144311A (ko
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다로 기타무라
요코 시바사키
마나부 아키야마
쇼지 미네기시
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다이요 잉키 세이조 가부시키가이샤
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Publication of KR20140144311A publication Critical patent/KR20140144311A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020147033546A 2012-09-28 2013-09-27 광경화성 수지 조성물, 프린트 배선판, 및 광경화성 수지 조성물의 제조 방법 KR101588159B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2012-218556 2012-09-28
JP2012218556 2012-09-28
JPJP-P-2013-137427 2013-06-28
JP2013137427A JP5514356B2 (ja) 2012-09-28 2013-06-28 光硬化性樹脂組成物、プリント配線板、及び光硬化性樹脂組成物の製造方法
PCT/JP2013/076223 WO2014051035A1 (ja) 2012-09-28 2013-09-27 光硬化性樹脂組成物、プリント配線板、及び光硬化性樹脂組成物の製造方法

Publications (2)

Publication Number Publication Date
KR20140144311A KR20140144311A (ko) 2014-12-18
KR101588159B1 true KR101588159B1 (ko) 2016-01-22

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KR1020147033546A KR101588159B1 (ko) 2012-09-28 2013-09-27 광경화성 수지 조성물, 프린트 배선판, 및 광경화성 수지 조성물의 제조 방법

Country Status (4)

Country Link
JP (1) JP5514356B2 (zh)
KR (1) KR101588159B1 (zh)
TW (1) TWI480694B (zh)
WO (1) WO2014051035A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6561832B2 (ja) * 2013-08-23 2019-08-21 味の素株式会社 感光性樹脂組成物
JP5882510B2 (ja) 2014-06-30 2016-03-09 太陽インキ製造株式会社 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法
JP6227617B2 (ja) * 2014-06-30 2017-11-08 太陽インキ製造株式会社 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法
KR102342193B1 (ko) * 2014-09-05 2021-12-23 스미또모 가가꾸 가부시키가이샤 경화성 조성물
JP6594054B2 (ja) * 2015-06-18 2019-10-23 太陽インキ製造株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6742796B2 (ja) * 2015-07-21 2020-08-19 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6704425B2 (ja) * 2017-03-29 2020-06-03 株式会社タムラ製作所 感光性樹脂組成物
CN108693709A (zh) * 2017-03-29 2018-10-23 株式会社田村制作所 感光性树脂组合物
JP7029797B2 (ja) * 2018-02-22 2022-03-04 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、及びプリント配線板
WO2019230616A1 (ja) * 2018-06-01 2019-12-05 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、及びプリント配線板

Citations (4)

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JP2005122048A (ja) 2003-10-20 2005-05-12 Mitsubishi Chemicals Corp 光硬化性組成物、並びにそれを用いた光硬化性画像形成材料、光硬化性画像形成材、及び画像形成方法
JP2009294319A (ja) 2008-06-03 2009-12-17 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性フィルム及び感光性永久レジスト
JP2011164270A (ja) 2010-02-08 2011-08-25 Taiyo Holdings Co Ltd 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
JP2011215375A (ja) 2010-03-31 2011-10-27 Taiyo Holdings Co Ltd 感光性樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2774505B2 (ja) * 1988-03-14 1998-07-09 タムラ化研株式会社 はんだマスク形成用被覆組成物
JP2598346B2 (ja) * 1991-07-02 1997-04-09 太陽インキ製造株式会社 プリント配線板の製造方法
JPH0521971A (ja) * 1991-07-11 1993-01-29 Sony Corp プリント基板の接続構造
JP2001057466A (ja) 1999-08-17 2001-02-27 Ibiden Co Ltd プリント配線板、ソルダーレジスト樹脂組成物およびプリント配線板の製造方法
JP2001053448A (ja) 1999-08-12 2001-02-23 Ibiden Co Ltd プリント配線板、ソルダーレジスト樹脂組成物およびプリント配線板の製造方法
JP2005096169A (ja) * 2003-09-24 2005-04-14 Konica Minolta Medical & Graphic Inc 平版印刷版材料と印刷方法
JP4620700B2 (ja) * 2006-03-17 2011-01-26 富士フイルム株式会社 感光性組成物、感光性フィルム、永久パターンの形成方法、及びプリント基板
JP2008076852A (ja) * 2006-09-22 2008-04-03 Fujifilm Corp 感光性組成物、感光性フィルム、永久パターン形成方法、及びプリント基板
JP5713205B2 (ja) * 2012-04-25 2015-05-07 三菱瓦斯化学株式会社 プリプレグ、金属箔張積層板、プリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005122048A (ja) 2003-10-20 2005-05-12 Mitsubishi Chemicals Corp 光硬化性組成物、並びにそれを用いた光硬化性画像形成材料、光硬化性画像形成材、及び画像形成方法
JP2009294319A (ja) 2008-06-03 2009-12-17 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性フィルム及び感光性永久レジスト
JP2011164270A (ja) 2010-02-08 2011-08-25 Taiyo Holdings Co Ltd 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
JP2011215375A (ja) 2010-03-31 2011-10-27 Taiyo Holdings Co Ltd 感光性樹脂組成物

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Publication number Publication date
TW201423264A (zh) 2014-06-16
WO2014051035A1 (ja) 2014-04-03
JP2014081612A (ja) 2014-05-08
TWI480694B (zh) 2015-04-11
KR20140144311A (ko) 2014-12-18
JP5514356B2 (ja) 2014-06-04

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