KR101576176B1 - 절단장치 및 절단방법 - Google Patents

절단장치 및 절단방법 Download PDF

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Publication number
KR101576176B1
KR101576176B1 KR1020140049903A KR20140049903A KR101576176B1 KR 101576176 B1 KR101576176 B1 KR 101576176B1 KR 1020140049903 A KR1020140049903 A KR 1020140049903A KR 20140049903 A KR20140049903 A KR 20140049903A KR 101576176 B1 KR101576176 B1 KR 101576176B1
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KR
South Korea
Prior art keywords
distance
cutting
unit
cutter
distance sensing
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KR1020140049903A
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English (en)
Korean (ko)
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KR20150056027A (ko
Inventor
청춘 리
Original Assignee
에버디스플레이 옵트로닉스 (상하이) 리미티드
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Publication of KR20150056027A publication Critical patent/KR20150056027A/ko
Application granted granted Critical
Publication of KR101576176B1 publication Critical patent/KR101576176B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Control Of Cutting Processes (AREA)
KR1020140049903A 2013-11-14 2014-04-25 절단장치 및 절단방법 KR101576176B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310567379.X 2013-11-14
CN201310567379.XA CN103739192B (zh) 2013-11-14 2013-11-14 切割装置及切割方法

Publications (2)

Publication Number Publication Date
KR20150056027A KR20150056027A (ko) 2015-05-22
KR101576176B1 true KR101576176B1 (ko) 2015-12-10

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Family Applications (1)

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KR1020140049903A KR101576176B1 (ko) 2013-11-14 2014-04-25 절단장치 및 절단방법

Country Status (3)

Country Link
JP (1) JP5922701B2 (zh)
KR (1) KR101576176B1 (zh)
CN (1) CN103739192B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104328643B (zh) * 2014-09-30 2019-05-31 江苏和鹰机电科技有限公司 自动裁剪机及其机头控制方法
CN104389151B (zh) * 2014-09-30 2019-06-28 江苏和鹰机电科技有限公司 自动裁剪机及其打孔方法
CN104358095B (zh) * 2014-09-30 2019-08-13 江苏和鹰机电科技有限公司 自动裁剪机及其划线方法
CN104358096B (zh) * 2014-09-30 2018-10-19 长园和鹰智能科技有限公司 自动裁剪机及其切割方法
CN105522605B (zh) * 2016-01-29 2017-04-05 山东美鹰食品设备有限公司 胶粉聚苯颗粒保温板自动切割装置及方法
JP6744626B2 (ja) * 2016-07-25 2020-08-19 三星ダイヤモンド工業株式会社 スクライブ方法並びにスクライブ装置
CN107601834B (zh) * 2017-10-18 2019-11-26 台玻安徽玻璃有限公司 一种高效率等距浮法玻璃切割机
CN108356877B (zh) * 2018-04-24 2024-03-22 索菲亚家居湖北有限公司 一种百叶包覆自动切分系统
CN113735429B (zh) * 2021-08-24 2023-09-08 芜湖东旭光电科技有限公司 玻璃划线切割装置及其切割方法
CN113478540B (zh) * 2021-09-08 2021-11-05 江苏三维智能制造研究院有限公司 智能装备系统及其方法
CN114012911B (zh) * 2021-11-18 2024-03-22 浙江精力工具有限公司 一种高压无刷电机开槽机
CN113953687B (zh) * 2021-12-08 2023-05-05 业成科技（成都）有限公司 切割方法及切割装置
CN115435686A (zh) * 2022-11-08 2022-12-06 宁德时代新能源科技股份有限公司 测量设备及测量方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001170889A (ja) * 1999-12-16 2001-06-26 Horizon International Kk 断裁機
JP2002137197A (ja) * 2000-10-31 2002-05-14 Sanyo Electric Co Ltd カッティング機
JP2011245607A (ja) * 2010-05-31 2011-12-08 Sumitomo Chemical Co Ltd 積層体フィルムの切断装置および積層体フィルムの切断方法
JP2012096986A (ja) * 2007-06-06 2012-05-24 Mitsuboshi Diamond Industrial Co Ltd ホルダ取り付け部

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6285343U (zh) * 1985-11-20 1987-05-30
JP3116743B2 (ja) * 1994-09-09 2000-12-11 ヤマハ株式会社 ホイールカッター方式切断装置
JPH1055987A (ja) * 1996-08-07 1998-02-24 Seiko Seiki Co Ltd ダイシング装置
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP5065551B2 (ja) * 2001-01-12 2012-11-07 坂東機工株式会社 ガラス板切断ヘッド及びこれを具備しているガラス板加工装置
JP2003094393A (ja) * 2001-09-25 2003-04-03 Toray Ind Inc 基板の切断方法および切断装置
JP4663673B2 (ja) * 2007-04-16 2011-04-06 株式会社牧野フライス製作所 工具測定方法、及び工具測定機能を備えた工作機械
JP4985185B2 (ja) * 2007-07-27 2012-07-25 富士ゼロックス株式会社 記録材切断装置及びこれを用いた記録材切断処理装置
JP5625225B2 (ja) * 2008-02-21 2014-11-19 坂東機工株式会社 ガラス板の加工機械
CN101780649B (zh) * 2009-01-16 2012-10-10 鸿富锦精密工业（深圳）有限公司 刀具检测系统及方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001170889A (ja) * 1999-12-16 2001-06-26 Horizon International Kk 断裁機
JP2002137197A (ja) * 2000-10-31 2002-05-14 Sanyo Electric Co Ltd カッティング機
JP2012096986A (ja) * 2007-06-06 2012-05-24 Mitsuboshi Diamond Industrial Co Ltd ホルダ取り付け部
JP2011245607A (ja) * 2010-05-31 2011-12-08 Sumitomo Chemical Co Ltd 積層体フィルムの切断装置および積層体フィルムの切断方法

Also Published As

Publication number Publication date
CN103739192A (zh) 2014-04-23
CN103739192B (zh) 2016-02-17
JP5922701B2 (ja) 2016-05-24
JP2015093377A (ja) 2015-05-18
KR20150056027A (ko) 2015-05-22

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