KR101575697B1 - 위상 시프트마스크 블랭크 및 위상 시프트마스크의 제조방법 - Google Patents

위상 시프트마스크 블랭크 및 위상 시프트마스크의 제조방법 Download PDF

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KR101575697B1
KR101575697B1 KR1020090028032A KR20090028032A KR101575697B1 KR 101575697 B1 KR101575697 B1 KR 101575697B1 KR 1020090028032 A KR1020090028032 A KR 1020090028032A KR 20090028032 A KR20090028032 A KR 20090028032A KR 101575697 B1 KR101575697 B1 KR 101575697B1
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Prior art keywords
film
phase shift
etching
pattern
mask
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Korean (ko)
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KR20090105850A (ko
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코미나토 아츠시
스즈키 토시유키
오쿠보 야스시
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호야 가부시키가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54—Absorbers, e.g. of opaque materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80—Etching

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Drying Of Semiconductors (AREA)
KR1020090028032A 2008-04-02 2009-04-01 위상 시프트마스크 블랭크 및 위상 시프트마스크의 제조방법 Active KR101575697B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2008-095924 2008-04-02
JP2008095924 2008-04-02
JP2009034480A JP5323526B2 (ja) 2008-04-02 2009-02-17 位相シフトマスクブランク及び位相シフトマスクの製造方法
JPJP-P-2009-034480 2009-02-17

Publications (2)

Publication Number Publication Date
KR20090105850A KR20090105850A (ko) 2009-10-07
KR101575697B1 true KR101575697B1 (ko) 2015-12-08

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ID=41078854

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KR1020090028032A Active KR101575697B1 (ko) 2008-04-02 2009-04-01 위상 시프트마스크 블랭크 및 위상 시프트마스크의 제조방법

Country Status (5)

Country Link
US (1) US8043771B2 (enExample)
JP (1) JP5323526B2 (enExample)
KR (1) KR101575697B1 (enExample)
DE (1) DE102009015589A1 (enExample)
TW (1) TWI453529B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2209048B1 (en) * 2009-01-15 2013-09-04 Shin-Etsu Chemical Co., Ltd. Method for manufacturing a photomask, and dry etching method
KR101663173B1 (ko) * 2009-10-09 2016-10-07 삼성전자주식회사 알카리 세정에 내성을 갖는 위상 반전 마스크 및 위상 반전 마스크의 제조 방법
JP2011123426A (ja) 2009-12-14 2011-06-23 Toppan Printing Co Ltd フォトマスクブランク及びフォトマスクの製造方法
JP5704754B2 (ja) 2010-01-16 2015-04-22 Hoya株式会社 マスクブランク及び転写用マスクの製造方法
JP2011215197A (ja) * 2010-03-31 2011-10-27 Hoya Corp フォトマスク及びその製造方法
KR101151685B1 (ko) * 2011-04-22 2012-07-20 주식회사 에스앤에스텍 블랭크 마스크 및 포토마스크
SG185228A1 (en) * 2011-04-25 2012-11-29 Ultratech Inc Phase-shift mask with assist phase regions
JP5541265B2 (ja) * 2011-11-18 2014-07-09 信越化学工業株式会社 エッチングマスク膜の評価方法
JP5541266B2 (ja) 2011-11-18 2014-07-09 信越化学工業株式会社 パターン形成膜のエッチング条件の評価方法
US8715890B2 (en) * 2012-01-31 2014-05-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor mask blanks with a compatible stop layer
JP5837257B2 (ja) * 2013-09-24 2015-12-24 Hoya株式会社 マスクブランク、転写用マスクおよび転写用マスクの製造方法
JP6364813B2 (ja) * 2014-02-27 2018-08-01 大日本印刷株式会社 フォトマスクの製造方法
US10571797B2 (en) * 2015-03-19 2020-02-25 Hoya Corporation Mask blank, transfer mask, method for manufacturing transfer mask, and method for manufacturing semiconductor device
JP6780550B2 (ja) * 2017-03-10 2020-11-04 信越化学工業株式会社 フォトマスクブランク
JP6753375B2 (ja) * 2017-07-28 2020-09-09 信越化学工業株式会社 フォトマスクブランク、フォトマスクブランクの製造方法及びフォトマスクの製造方法
US10739671B2 (en) 2017-11-10 2020-08-11 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing phase shift photo masks
US20220075258A1 (en) * 2018-12-26 2022-03-10 S&S Tech Co., Ltd. Blankmask and photomask

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002251000A (ja) 2001-02-26 2002-09-06 Semiconductor Leading Edge Technologies Inc 位相シフトマスクの製造方法、位相シフトマスク、位相シフトマスクブランクス及び半導体装置の製造方法
JP2007241065A (ja) 2006-03-10 2007-09-20 Shin Etsu Chem Co Ltd フォトマスクブランク及びフォトマスク

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* Cited by examiner, † Cited by third party
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JPH0749558A (ja) * 1993-08-05 1995-02-21 Sony Corp 位相シフトマスクの作製方法
JP3539652B2 (ja) 1996-08-28 2004-07-07 シャープ株式会社 フォトマスクの製造方法
US7011910B2 (en) 2002-04-26 2006-03-14 Hoya Corporation Halftone-type phase-shift mask blank, and halftone-type phase-shift mask
JP2003322947A (ja) * 2002-04-26 2003-11-14 Hoya Corp ハーフトーン型位相シフトマスクブランク及びハーフトーン型位相シフトマスク
US6924070B2 (en) * 2003-03-19 2005-08-02 Intel Corporation Composite patterning integration
DE112004000591B4 (de) * 2003-04-09 2020-09-10 Hoya Corp. Herstellungsverfahren für Photomaske
JP4413828B2 (ja) * 2004-10-22 2010-02-10 信越化学工業株式会社 フォトマスクブランクおよびフォトマスクならびにこれらの製造方法
US8293430B2 (en) * 2005-01-27 2012-10-23 Applied Materials, Inc. Method for etching a molybdenum layer suitable for photomask fabrication
JP2008095924A (ja) 2006-10-16 2008-04-24 Denso Corp シール装置
US7641339B2 (en) 2007-07-31 2010-01-05 Kabushiki Kaisha Topcon Ophthalmologic information processing apparatus and ophthalmologic examination apparatus
JP2009063638A (ja) * 2007-09-04 2009-03-26 Fujitsu Microelectronics Ltd フォトマスクの製造方法及び半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002251000A (ja) 2001-02-26 2002-09-06 Semiconductor Leading Edge Technologies Inc 位相シフトマスクの製造方法、位相シフトマスク、位相シフトマスクブランクス及び半導体装置の製造方法
JP2007241065A (ja) 2006-03-10 2007-09-20 Shin Etsu Chem Co Ltd フォトマスクブランク及びフォトマスク

Also Published As

Publication number Publication date
US8043771B2 (en) 2011-10-25
DE102009015589A1 (de) 2009-10-22
KR20090105850A (ko) 2009-10-07
JP5323526B2 (ja) 2013-10-23
TWI453529B (zh) 2014-09-21
JP2009265620A (ja) 2009-11-12
US20090253054A1 (en) 2009-10-08
TW201003296A (en) 2010-01-16

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