KR101568237B1 - Jig for aligning leadframe - Google Patents

Jig for aligning leadframe Download PDF

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Publication number
KR101568237B1
KR101568237B1 KR1020107027566A KR20107027566A KR101568237B1 KR 101568237 B1 KR101568237 B1 KR 101568237B1 KR 1020107027566 A KR1020107027566 A KR 1020107027566A KR 20107027566 A KR20107027566 A KR 20107027566A KR 101568237 B1 KR101568237 B1 KR 101568237B1
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South Korea
Prior art keywords
lead frame
insertion groove
jig
lead
groove
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KR1020107027566A
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Korean (ko)
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KR20110021863A (en
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가즈마사 이쿠시마
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무사시 엔지니어링 가부시키가이샤
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Publication of KR20110021863A publication Critical patent/KR20110021863A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Die Bonding (AREA)

Abstract

It is an object of the present invention to provide a positioning jig capable of easily positioning with a simple structure and capable of maintaining a state where warpage or bending is corrected. A lead frame positioning jig comprising: a lead having an element fixing portion at an end portion; and a tie bar extending a plurality of the leads, wherein the lead is inserted in an upright state, Characterized in that the lead frame includes a support member having a groove for inserting a lead frame into which the lead frame is fixed, the support member having an upper contact surface whose upper surface abuts an outer bottom of the element fixing portion Positioning jig of frame.

Description

JIG FOR ALIGNING LEADFRAME < RTI ID = 0.0 >

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning jig for a lead frame having an element fixing portion for fixing elements such as semiconductor light emitting elements and semiconductor light receiving elements, The present invention relates to a positioning jig for a lead frame in a liquid material application process in a package process in a process.

BACKGROUND ART Light emitting diodes (LEDs) are widely used instead of compact bulbs because of their low power consumption and long lifespan. Recently, blue LEDs have been put to practical use, and full color display using LEDs of three primary colors of red, green, and blue and white LEDs using blue LEDs and phosphors have also been put to practical use.

The structure of a typical bullet-shaped LED is as shown in Fig. The lens portion 101 is formed of a transparent resin such as epoxy. From the lower portion of the lens portion 101, two leads 102 and 103 serving as terminals are extended. The LED chip 104, which is a light emitting element, is sealed inside the lens portion 101 formed of a transparent resin. More specifically, the LED chip 104 is mounted in the chip mount portion 105 molded at the end of one of the leads 102 in a mortar-shaped form, and the LED chip 104 and the other lead 103 are connected by a wire 106.

2, the lead frame 201 used in the above-mentioned bullet-type LED has a structure in which the pair of the negative side lead 102 and the positive side lead 103 are connected to each other via two tie bars tie bars 202, and 203, respectively. The tie bar inside the lead frame is called the middle tie bar 202, and the tie bar at the end of the lead frame is called the lower tie bar 203. A chip mounting portion 105 of an induced type is formed on the end surface of the negative side lead 102 opposite to the end surface connected to the tie bar 203. The opening surface of the trigger portion 105 is integrally molded so as to be substantially the same as the surface of the lead. The diameter of the lead-in portion 105 is larger than the thickness of the lead frame 201 and the outer bottom portion 204 is formed at two places with the lead frame 201 sandwiched therebetween.

Next, a manufacturing process of the LED will be described. The manufacturing process of the LED is largely divided into a process of manufacturing an LED chip and a process of assembling the LED chip into a package. The package process can be broadly divided into: (1) a die bonding process in which a silver paste is applied to a chip mount portion formed in one lead frame and then the LED chip is raised and cured; (2) (3) a molding step for sealing and fixing the tip end of the side on which the LED chip is mounted with the resin for molding the lens part, and (4) a step for cutting off the excess portion of the lead frame And a tie bar cutting process.

In addition, a process of applying a liquid material containing a phosphor onto the LED chip and curing it is added between (2) the wire bonding process and (3) the molding process when manufacturing the above-described white LED.

The lead frame is used in the package process in LED manufacturing as in the case of the conventional semiconductor package process, but the lead frame is used differently from the lead frame frequently used in the semiconductor package. In a conventional semiconductor package, a lead frame in a thin and long thin plate state is laid down, that is, a state in which the widest surface is a top or bottom surface (horizontal plane) (The state shown in Fig. 2) upright with the part 105 upward.

In the various processes of manufacturing LED, the lead frame is set up as shown in Fig. 2. However, since the lead frame is made of a thin metal plate or the like, there is a problem such as warpage, &Quot;

Patent Document 1 discloses an apparatus for solving bending that occurs in a lead frame, which is a semiconductor device and includes an outer casing member having a recess formed in the shape of an outer shell of a semiconductor device, And the lead frame supporting member is provided with a lead frame supporting means provided so that the leading end of the lead provided with the semiconductor element rides in the recess so that the semiconductor element is positioned at a predetermined position in the recess Wherein the molding apparatus is a molding apparatus.

Patent Document 2 discloses a semiconductor integrated circuit device that includes a guide rail for supporting a lead frame from below and guiding a conveyance, conveying means for conveying the lead frame along the guide rail, support block for supporting the back surface of the lead frame, A clamping member for pressing and clamping the lead frame to the support block, and a pressing member which is driven by the driving means to press the tie bar of the lead frame so as to press the lead frame against the guide rail. A crystal device is disclosed.

Japanese Patent Application Laid-Open No. 52-70767 Japanese Patent Application Laid-open No. Hei 5-74842

However, according to the invention described in Patent Document 1, the warpage of the lead frame is corrected by sandwiching the tie bar portion. However, since only the tie bar portion is sandwiched therebetween, even if the overall deflection of the lead frame can be corrected, In the case where a bending portion of the chip mount portion occurred locally, the bending or bending portion could not be corrected.

Further, in the invention described in Patent Document 2, a complicated mechanism including a rod, a cam, a roller, and the like is required for operating the clamping member and the pressing member, and a separate driving means . Therefore, in the structure described in Patent Document 2, it is necessary to make the apparatus large-sized, and it is difficult to realize miniaturization.

However, it is important to perform the die bonding process, the molding process, and the like promptly by a working device such as a coating apparatus to perform positioning of the lead frame with good precision. For example, if the position recognition operation for the upright lead frame is performed only by the camera for the first chip mounting portion, and thereafter, the striking is applied at a predetermined distance, it is essential to perform the positioning with good accuracy do.

On the other hand, the work for the upright lead frame may be performed manually by the operator. It is also an object to be solved by the present invention to enable easy positioning at the time of work such as application by hand.

SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide a positioning jig that can be easily positioned with a simple structure and can maintain a state in which a bent portion and a bent portion are corrected.

A first aspect of the present invention is a positioning jig for a lead frame comprising a lead having an element fixing portion at an end portion thereof and a tie bar for extending a plurality of the leads, wherein the lead is inserted in an upright state, Wherein the lead frame includes a support member having a groove for inserting a lead frame into which the lead frame is fixed, wherein the support member includes an upper contact surface, the upper surface of which is in contact with an outer bottom of the element fixing portion, .

According to a second aspect of the present invention, in the first aspect of the invention, further comprising a pressing mechanism provided in the vicinity of the bottom of the lead frame insertion groove for pressing the lead frame in a direction orthogonal to the depth direction of the lead frame insertion groove .

According to a third invention, in the second invention, the pressing mechanism has a pressing member which is pressed in a direction orthogonal to the depth direction of the lead frame insertion groove, and the pressing member is inserted into the lead frame insertion groove And a second position spaced apart from an inner surface of the groove for inserting the lead frame.

A fourth aspect of the present invention is that, in the third invention, the pressing member is located at the first position at the deepest position of the lead frame that has entered the lead frame insertion groove, . Here, the deepest position of the lead frame may be defined by the upper contact surface of the support member or by the lower surface of the lead frame.

According to a fifth aspect of the present invention, in the third or fourth aspect of the present invention, the pressing member has a tip end portion formed of a spherical body.

A sixth aspect of the present invention is drawn to any one of the first to fifth aspects of the present invention, wherein the upper contact surface has a plurality of upper surface guide grooves in the width direction thereof, and a plurality of upper surface guide grooves Further comprising an insertion assisting tool having teeth.

According to a seventh aspect of the present invention related to the sixth aspect of the present invention, in the upper surface guide groove, the bottom surface of the lead frame reaches the inner bottom surface of the lead frame insertion groove Depth.

According to an eighth aspect of the present invention based on any one of the first to seventh aspects of the present invention, the support member has a plurality of lower guide grooves formed in the width direction of the lower surface thereof, And a releasing auxiliary tool having a releasing auxiliary tool.

According to a ninth aspect of the present invention, in the eighth invention, the bottom guide groove is formed such that when the plunging assisting tool enters the most, the lead inserted in the lead frame insertion groove is exposed to the upper side of the supporting member The depth of which is defined by the following formula:

According to a tenth aspect of the present invention, in any one of the first to ninth aspects of the present invention, there is further provided a fixing member for extending and fixing the supporting member in the width direction.

According to the present invention, it is possible to easily position the lead frame without installing a complicated mechanism. In addition, a predetermined operation can be performed while maintaining the state in which the bent or bent portion of the lead frame is corrected. Therefore, the work by the working device such as the coating device can be performed with good precision and promptly.

1 is a partial perspective view showing a structure of a general LED.
2 is a schematic view showing the shape of a general lead frame.
3 is a schematic perspective view of a jig according to the present invention.
4 is an explanatory diagram for explaining the insertion procedure of the lead frame in the jig according to the present invention.
Fig. 5 is a partial cross-sectional view showing an action of the pressing mechanism according to the present invention when inserting the pressing mechanism. Fig.
6 is an explanatory view for explaining the action of the bending correction by the jig according to the present invention.
Fig. 7 is an explanatory view for explaining a procedure of taking out a lead frame from a jig according to the present invention. Fig.
8 is a partial cross-sectional view showing the action of the pressurizing mechanism at the time of the release of the pressurizing mechanism according to the present invention.
9 is a schematic perspective view of a coating apparatus according to the first embodiment.
10 is a schematic perspective view showing a configuration example of the jig according to the second embodiment.

Hereinafter, an embodiment of the present invention will be described by taking an LED lead frame as an example.

[1] Jig body

As shown in Fig. 3, the jig 300 of the embodiment is constituted by a support member 301 having a special structure in a substantially rectangular parallelepiped shape.

The upper surface of the support member 301 is provided with a lead frame insertion groove 310 into which the lead frame 201 is inserted and an upper surface for holding and interposing the lead frame insertion groove 310 is formed on the upper contact surface 302a , And 302b. The upper contact surfaces 302a and 302b are portions that abut on the outer bottom portion 204 of the induction type chip mount portions formed in two places by sandwiching the lead frame 201, respectively.

The clamping surfaces 303a and 303b are planes adjacent to and perpendicular to the upper contact surfaces 302a and 302b and constitute the inner surface in the longitudinal direction of the lead frame insertion groove 310. [ The side contact surfaces 304a and 304b are planes adjacent to and perpendicular to the upper contact surfaces 302a and 302b and constitute inner side surfaces in the width direction of the lead frame insertion groove 310. [ The inner bottom surface of the lead frame insertion groove 310 is the lower contact surface 305, which is surrounded by the end surfaces of the gripping surfaces 303a and 303b and the side contact surfaces 304a and 304b. The distance between the two holding faces 303a and 303b is approximately the same as the thickness of the lead frame 201 and the distance between the two side contact faces 304a and 304b is equal to the width in the longitudinal direction of the lead frame 201 It is approximately the same size. The distance from the upper contact surfaces 302a and 302b to the lower contact surface 305 is substantially equal to the distance from the outer bottom 204 of the chip mount portion formed in the lead frame 201 to the lower tie bar 203 . That is, a groove-shaped space (leadframe insertion groove 310) having an inner dimension approximately the same as the outer dimension of the lead frame is formed in the rectangular parallelepiped-shaped support member 301, The five inner surfaces 303a, 303b, 304a, 304b and 305 of the space are brought into contact with the respective outer surfaces of the lead frame 201. [

Grooves 306 and 307 are formed on the upper surface and the lower surface of the support member 301 to guide the auxiliary tool when the lead frame is inserted and removed.

The groove 306 on the upper surface is formed in a direction parallel to the short sides of the upper contact surfaces 302a and 302b, that is, in a direction perpendicular to the longitudinal direction of the support member 301 as shown in Fig. 3 have. The groove 306 has a depth reaching from the upper contact surfaces 302a and 302b to the tie bar (middle tie bar) 202 on the LED chip mounting side when the lead frame 201 is positioned. The width of the groove is substantially equal to the distance between the paired leads.

On the other hand, the grooves 307 on the lower surface are formed in a direction parallel to the shorter side of the jig lower surface 308, that is, in a direction orthogonal to the longitudinal direction of the support member 301. The groove 307 has a depth reaching from the jig lower surface 308 to about half of the distance between the upper contact surfaces 302a and 302b and the jig lower surface 308. [ The width of the groove is approximately equal to or slightly larger than the distance between the paired leads.

A pair of pressing mechanisms 309 for pressing the lead frame 201 from directions perpendicular to the holding surfaces 303a and 303b are provided below the center in the height direction of the supporting member 301 have. The pressurizing mechanism 309 is located between the pair of two leads 102 and 103. [ It is preferable that two or more pressing mechanisms 309 are disposed symmetrically with the longitudinal center line of the supporting member 301 therebetween. Details of the pressurizing mechanism 309 will be described later.

[2] Insertion of the lead frame into the jig

A procedure for inserting the LED lead frame 201 into the jig 300 according to the present invention and a procedure for releasing the LED lead frame 201 from the jig 300 will be described.

(i) the insertion procedure of the lead frame into the jig

4A, the lower tie bar 203 of the lead frame is inserted into the lead frame insertion groove 310 formed in the support member 301, and the lower tie bar 203 of the lead frame is inserted into the sphere 501 The lead frame 201 is inserted. The action of the pressing mechanism 309 at this time is as shown in Fig. 5 (a). That is, in the first step, since sufficient force for pushing the lead frame 201 from above is not applied, resistance against the force of the spring 502 pressing the spherical body 501 toward the gripping surface 303b So that the lead frame 201 is not pushed in.

Subsequently, as shown in Fig. 4B, a greater force is applied to the lead frame 201 from the upper side, and the lower tie bar 203 is pushed downwardly of the pressing mechanism 309. Then, as shown in Fig. At this time, it is preferable that the insertion aid tool 401 is pushed downward at the position where the teeth 402 are aligned with the groove 306 formed in the upper surface of the jig, do. It is preferable that the teeth 402 and the grooves 306 are arranged evenly so as not to exert an excessive force on a specific place of the lead frame 201. [ This ensures that the chip mount portion outer bottom surface 204 abuts the upper contact surfaces 302a and 302b or the lower tie bar 203 abuts the lower contact surface 305, The frame 201 is pushed downward.

The action of the pressurizing mechanism 309 at this time is as shown in Fig. 5 (b). That is, by giving sufficient force to push the lead frame 201 downward, the force of the spring 502 pushing the spherical body 501 in the pressurizing mechanism 309 is overcome so that the lower tie bar 203 The spherical member 501 is pushed in a direction opposite to the direction in which the spring 502 is pressed. When the lower tie bar 203 passes through and becomes a lead portion, the spherical body 501 enters between the two pairs of leads 102 and 103 paired with each other by the force of the spring 502.

The lead frame 201 is positioned by abutting the five inner surfaces 303a, 303b, 304a, 304b, 305 and the upper contact surfaces 302a, 302b of the lead frame insertion groove 310 according to the above procedure And the state of being positioned by the pressurizing mechanism 309 is maintained. 6, by burying the lead frame 201 on the jig 300, the bending portion (for example, the bent portion) of the lead frame 201 in the vicinity of the chip mounting portion 105 the bent portion 601 is corrected by the clamping surfaces 303a and 303b abutting against the lead frame 201 so that the chip mount portion 105 to be coated can be accurately positioned.

(ii) the ejection process from the jig of the lead frame

First, as shown in Fig. 7 (a), the jig 300 holding the lead frame 201 in a state of being positioned is engaged with the groove 307 formed in the lower surface of the support member 301 The teeth 702 of the fire-fighting assistant tool 701 are fitted. The teeth 702 of the valve seat 701 are brought into contact with the lower surfaces of the lower tie bars 203 until the teeth 702 come into contact with the innermost portion of the groove 307, 308 push the jig 300 downward until the jig 300 abuts against the member 703 on which the teeth of the ejection assistant tool 701 are provided. As a result, the lead frame 201 is pushed out of the jig 300 by the action of the fire-fighting assisting tool 701.

The distance by which the jig 300 is pushed downward is determined by the length of the teeth 702 of the fire departure aid 701 and the depth of the groove 307 formed in the jig bottom surface 308. This distance can be appropriately adjusted by a person skilled in the art, but it is preferable to secure a sufficient distance so that the operator can hold the lead frame 201 pushed out of the jig 300 without touching the element fixing portion 107 with his fingers . The distance is preferably such that the lead frame 201 is exposed by 5 mm or more from the upper contact surfaces 302a and 302b and more preferably the lead frame 201 is exposed by 10 mm or more. Most preferably at least 15 mm.

It is preferable that the grooves 307 and the teeth 702 are evenly arranged in two or more so as not to exert an excessive force on a specific place of the lead frame 201. [

The action of the pressurizing mechanism 309 at this time is as shown in Fig. That is, by giving sufficient force to push the lead frame 201 upward, the force of the spring 502 pushing the sphere 501 in the pressing mechanism 309 is overcome, The body 501 is pushed in a direction opposite to the direction in which the spring 502 is pressed. Then, when the lower tie bars 203 pass, the spherical bodies 501 are pressed toward the gripping surfaces 303b again by the force of the springs 502. [

The lead frame 201 is surrounded by the holding surfaces 303a and 303b of the jig 300 and the side contact surfaces 304a and 304b and the lower contact surface 305 as shown in FIG. And is drawn out from the lead frame insertion groove 310. As described above, according to the present invention, the lead frame 201 can be easily positioned, fixed and separated. In addition, the risk that an arbitrary member comes into contact with the chip mounting portion 105, which is a part to be coated, during positioning of the lead frame 201 can be remarkably reduced.

Hereinafter, the details of the present invention will be described with reference to Examples, but the present invention is not limited to the Examples.

[Example 1]

9, the coating apparatus 901 according to the present embodiment includes an X driving mechanism 902, a Y driving mechanism 903, a Z driving mechanism 904, a discharging device 905, A camera 906, and a control unit 907 for controlling the operations of these units. The control unit 907 also serves as an image processing unit for processing an image sent from the camera 906. [

On the X driving mechanism 902, a Z driving mechanism 904 is provided. On the Y driving mechanism 903, a table 908 for mounting the lead frame 201, which is an object to be coated, positioned on the jig 300 is provided. The discharging device 905 provided on the Z driving mechanism 904 includes a storage container 909 for storing the liquid material and a nozzle 910 for discharging the liquid material. The camera 906 of this embodiment is provided on the Z drive mechanism 904 together with the ejection apparatus 905. [ However, the present invention is not limited to this configuration, and the camera 906 may be disposed on the X driving mechanism 902 independently of the Z driving mechanism 904. [

In the case of performing the coating operation, first, the jig 300 to which the lead frame 201 is fixed is mounted on the table 908 and fixed. Next, the X drive mechanism 902 and the Y drive mechanism 903 are operated to move the jig 300 to which the lead frame 201 is fixed, to a position below the camera 906. After the application position is confirmed by the camera 906, it moves down the nozzle 910, and application is started. When the application is completed, the table 908 and the ejection apparatus 905 are moved to the standby position by the respective drive mechanisms 902, 903, and 904, and the application operation for one lead frame 201 is terminated. When the coating operation is continued with respect to the plurality of lead frames, the above-described operation is repeated by replacing the already-applied lead frame with a lead frame not coated. At the time of exchange, a plurality of jigs 300 may be prepared and exchanged for each jig.

According to the jig 300 of the present embodiment having the above-described configuration, it is possible to perform positioning easily without providing a complicated mechanism, and to carry out work in a state in which warpage or bent portions are corrected. Therefore, the application operation by the application device 901 can be performed with good precision and promptly.

Further, according to the configuration of the present embodiment, the bendable portion of the lead frame is calibrated and the positioning is performed with high accuracy, so that the image recognition processing at the time of positioning operation is not necessarily required. However, even in the case of performing image recognition at the time of positioning operation for safety, a stable image can be obtained by the configuration of this embodiment. That is, in order to detect the position of the chip mount portion 105, when the image is recognized by the camera from above the chip mount portion 105, the image obtained by the camera is present under the chip mount portion 105 The upper contact surfaces 302a and 302b are formed on the lower side of the chip mounting portion because the lead frame is inserted (fitted) into the " groove " in the present embodiment It always exists. Therefore, in the image picked up by the camera of the present embodiment, since the upper contact surfaces 302a and 302b are always in the background, an image such as the outline of the chip mount portion 105 can be easily obtained. In this regard, in the conventional apparatus in which the lead frame is pressed and positioned and fixed on the side surface of one plate, the background image of the half of the plate side of the chip mount is the plate, while the background image of the opposite half exists in the lower side It is difficult to obtain a stable image and the chip mounting portion 105 can not be recognized because the component is picked up and shot.

[Example 2]

The jig 300 of this embodiment has a configuration in which a plurality of support members 301 are extended.

This is because, as in the first embodiment shown in Fig. 9, there is a space in the space on the table 908 in order to position the lead frame 201 in a standing state, As shown in Fig.

The number of the extending support members 301 can be appropriately increased or decreased by the size of the table 908, the stroke of the drive mechanisms 902, 903, and 904, and the like. The plurality of support members 301 are aligned and fixed by an arbitrary fixing member so that they can be simultaneously operated. In this embodiment, as shown in Fig. 10, ten jigs 300 are fixed to the fixing plate 1001 using fastening means such as screws. At this time, the grooves 306 and 307 formed on the upper and lower surfaces of the single jig 300 are aligned with each other, that is, when the ten jigs 300 are arranged side by side, they are arranged as if they are one groove. This is for the purpose of enabling insertion and ejection of the ten jigs at one time by fixing the positions of the grooves 306, 307 in correspondence with each other. The holding plate 1001 is provided with a handle 1002 for facilitating the operation.

As shown in Fig. 10, the insertion assisting tool 401 of the present embodiment is configured in such a shape as to work simultaneously on the ten support members 301 to be extended. That is, the teeth 402 of the insertion assisting tool 401 are constituted by arranging three plate bodies having a length transverse to the ten grooves 306 in parallel. Here, the teeth 402 are fixed so as to sandwich the both ends thereof by a pair of frame bodies 1003 provided with a handle 1004. The tooth 402 is fixed by the frame body 1003 in order to prevent visibility at the time of positioning. When the visibility is not a problem as in the case where the positioning is automatically performed by a machine, the saw tooth 402 may be fixed to the flat plate.

As shown in Fig. 10, the plucking assisting tool 701 of the present embodiment has a shape for performing simultaneous work on the ten support members 301 to be extended. That is, the teeth 702 of the fire-fighting assisting tool 701 are constructed by arranging two plate-shaped bodies having a length transverse to the ten grooves 307 in parallel on a single flat plate 1005. A guide member 1006 for guiding the support member 301 arranged side by side on the flat plate 10005 is provided so that the positions of the teeth 702 and the groove 307 are not shifted when the support sheet 301 arranged side by side is pressed Is installed.

According to the jig 300 of the present embodiment having the above-described configuration, the positioning operation can be simultaneously performed on the lead frames 201 of a plurality of units, so that it is possible to shorten the time required for insertion and ejection operations and application operations.

[Industrial applicability]

The jig of the present invention is applicable to a lead frame having a pair of leads provided with a lead frame having a plurality of leads each having a semiconductor element provided at an end thereof, for example, an LED chip, a photodiode chip and a phototransistor chip .

101: Lens part 102: Negative side lead
103: positive side lead 104: LED chip
105: chip mounting portion 106: wire
107: Element fixing section 201: Lead frame
202: Middle tie bar 203: Lower tie bar
204: chip mounting portion outer bottom portion 300: jig
301: support member 302a, 302b: upper contact surface
303a, 303b: nipping surface 304a, 304b: side contact surface
305: lower contact surface 306: upper surface guide groove
307: lower guide groove 308: jig
309: pressing mechanism 310: groove for inserting lead frame
401: Insert Helper 402: Insert Helper tooth
501: spherical member (pressing member) 502: spring
601: bent portion 701:
702: Sprockets of sprue aids
703: a member on which the teeth of the firing assistant tool are installed
901: Coating device 902: X drive mechanism
903: Y drive mechanism 904: Z drive mechanism
905: Discharging device 906: Camera
907: control unit, image processing unit 908: table
909: Reservoir 910: Nozzle
1001: Fixing plate 1002: Handle
1003: frame body 1004: handle
1005: flat plate 1006: guide member

Claims (10)

A lead frame positioning jig comprising a lead having an element fixing portion at an end portion thereof and a tie bar extending a plurality of the leads,
And a lead frame insertion groove in which the lead frame is inserted in an upright state and in which the lead frame is stuck and fixed,
Wherein the support member includes an upper contact surface whose upper surface abuts an outer bottom of the element fixing portion. The method according to claim 1,
Further comprising a pressing mechanism that is provided below the center in the depth direction of the lead frame insertion groove and above the bottom portion and that presses the lead frame in a direction orthogonal to the depth direction of the lead frame insertion groove Positioning jig of lead frame. 3. The method of claim 2,
Wherein the pressing mechanism has a pressing member urged in a direction orthogonal to the depth direction of the lead frame insertion groove,
Wherein the pressing member has a first position in contact with an inner surface of the lead frame insertion groove and a second position spaced from an inner surface of the lead frame insertion groove. The method of claim 3,
Wherein the pressing member is at the first position at the deepest position of the lead frame that has entered the lead frame insertion groove and prevents movement of the tie bar upward. The method according to claim 3 or 4,
Wherein the pressing member has a tip end portion formed of a spherical body. 5. The method according to any one of claims 1 to 4,
The upper contact surface has a plurality of upper surface guide grooves formed in the width direction thereof,
Further comprising an insertion auxiliary tool having a plurality of teeth that engage with the upper surface guide groove. The method according to claim 6,
Wherein the upper surface guide groove comprises a depth at which the lower surface of the lead frame reaches the inner bottom surface of the lead frame insertion groove when the insertion assist tool is inserted most frequently, . 5. The method according to any one of claims 1 to 4,
The support member has a plurality of lower surface guide grooves formed in the width direction of the lower surface thereof,
Further comprising a release auxiliary tool having a plurality of teeth that are engaged with the guide groove. 9. The method of claim 8,
Wherein the guide groove has a depth at which at least 5 mm of the lead inserted in the lead frame insertion groove is exposed upward of the support member when the plunging assisting tool enters most of the guide groove, Jig. 5. The method according to any one of claims 1 to 4,
And a fixing member for extending and fixing the supporting member in the width direction.
KR1020107027566A 2008-05-08 2009-05-07 Jig for aligning leadframe KR101568237B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-122480 2008-05-08
JP2008122480A JP5358120B2 (en) 2008-05-08 2008-05-08 Lead frame positioning jig

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KR101568237B1 true KR101568237B1 (en) 2015-11-11

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CN102347406B (en) * 2011-09-30 2015-01-14 中国电子科技集团公司第四十五研究所 Fixture for vertical LED (light emitting diode) lead frame
CN102969294B (en) * 2012-11-20 2016-07-06 无锡市威海达机械制造有限公司 A kind of lead frame structure saves the method for consumptive material
CN103406873B (en) * 2013-07-29 2016-02-24 江苏云意电气股份有限公司 A kind of rectifier diodes location pressing clamp and pressing method
CN106298560A (en) * 2016-09-29 2017-01-04 中国科学院长春光学精密机械与物理研究所 Leads of IC forming device
KR102215300B1 (en) * 2019-09-30 2021-02-15 성문일렉트로닉스 주식회사 Electrode Bending Device of LED Module
CN111370553B (en) * 2020-03-20 2021-08-24 苏州斯尔特微电子有限公司 High-precision chip welding method of LED full-automatic die bonder

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JP2009272491A (en) 2009-11-19
WO2009136492A1 (en) 2009-11-12
TW200952100A (en) 2009-12-16
JP5358120B2 (en) 2013-12-04
TWI445107B (en) 2014-07-11
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HK1153570A1 (en) 2012-03-30
CN102067296A (en) 2011-05-18

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