JP2999931B2 - Resin sealing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing device used for manufacturing a light emitting diode having leads extending from a sealing resin in which a semiconductor light emitting chip is incorporated.

[0002]

2. Description of the Related Art In a light emitting diode, a semiconductor light emitting chip is sealed with a sealing resin, and a plurality of leads extend from the sealing resin. Such light emitting diodes are being mass-produced using a lead frame.

FIG. 6 is an exploded perspective view of a resin sealing device used for manufacturing a light emitting diode. This resin sealing device has a mold case 51 provided with a plurality of concave portions 51a filled with a liquid sealing resin. The mold case 51 has a state in which the concave portions 51a are arranged in a straight line. The mold case 51 is fitted in a guide groove 52 a provided in the support plate 52, and is supported on the support plate 52. Guide groove 52 of support plate 52
In a, a plurality of mold cases 51 are fitted.

[0004] An etching plate 53 for fixing the mold case 51 is attached to the support plate 52. The etching case 53 has an opening 53a into which the mold case 51 is fitted.
The etching plate 53 is attached to the support plate 52 by screws 54 in a state where the mold case 51 is fitted therein. The mold case 51 fitted in the guide groove 52 a of the support plate 52 is fixed in a state of being positioned with respect to the support plate 52 by being fitted in the opening 53 a of the etching plate 53.

[0005] A pair of side plates 54 are screwed to the support plate 52 so as to sandwich the guide groove 52a. Each side plate 54
In the upper part of the table, concave grooves 54a are provided corresponding to the guide grooves 52a formed in the support plate 52, respectively. Each end of a long plate-shaped frame hanger 56 that supports the lead frame 55 is fitted into each of the concave grooves 54 a that are arranged to face each of the side plates 54.

[0006] The frame hanger 56 holds the lead frame 55 so that a portion serving as a lead of the light emitting diode extends downward. The frame hanger 56 has a concave portion 56a formed on the lower surface of one end. The concave portion 56a is fitted to the bottom of a concave groove 54a provided on one side plate 54, thereby forming the frame hanger 56.
Are positioned with respect to each side plate 54.

In the resin sealing device having such a configuration, when the mold case 51 is fitted into the guide groove 52a of the support plate 52 and fixed by the etching plate 53, the liquid case is formed in each recess 51a of the mold case 51. Is injected. On the other hand, with the semiconductor light emitting chip mounted on the lead portion of the lead frame 55, the lead frame 5
5 is held by the frame hanger 56. Then, each end of the frame hanger 56 is inserted into the concave groove 54a of the side plate 54.
, Respectively, and are placed between the side plates 54. The frame hanger 56 is positioned with respect to the side plate 54 by the concave portion 56 a of the frame hanger 56.

In such a state, the leads of the lead frame 55 held by the frame hanger 56 are immersed in the liquid sealing resin filled in the recesses 51a of the mold case 51. When the sealing resin filled in each concave portion 51a of the mold case 51 is cured, the frame hanger 56 is moved upward with respect to the mold case 51, and the cured sealing resin is integrated with the leads of the lead frame 55. , Are taken out of each concave portion 51a of the mold case 51.

[0009]

In such a resin sealing device, the lead frame 55 is provided with a frame hanger 56.
The mold case 51 placed on the support plate 52 by being erected between the side plates 54 while being held
Are positioned with respect to. For this reason, each recess 51a of the mold case 51 and the lead frame 55 are positioned with the support plate 52, each side plate 54, the frame hanger 56 and the like interposed therebetween, and the positioning accuracy is poor. There is a possibility that the mold case 51 and the lead frame 55 may not be aligned in a predetermined state. As a result, there is a problem that the relationship between the sealing resin and the leads of the manufactured light emitting diode is not constant, and the quality of the manufactured light emitting diode varies.

Further, since the mold case 51 is fixed by the screws 54 in a state of being fitted into the opening 53a of the etching plate 53, there is a problem that the working efficiency is low.

An object of the present invention is to solve such a problem, and an object of the present invention is to provide a resin sealing device capable of accurately positioning a mold case and a lead frame by a simple operation. .

[0012]

A resin sealing device according to the present invention comprises: a mold case in which a plurality of concave portions into which a liquid sealing resin is injected are arranged in a straight line; A pair of positioning members, each of which is disposed so as to protrude upward, and which is fitted to each end of the lead frame and supports the lead frame in a state where the lead frame is positioned in the longitudinal direction of the mold case; A support guide disposed on the upper surface of the mold case so as to be fitted to the lead frame positioned at and to support the lead frame positioned in the width direction and the vertical direction of the mold case; But
It has a guide groove to be fitted on the bottom and mold
Fitting groove into which the lead frame supported by the case is fitted
And a box-shaped storage case having
Field case and lead frame are moved horizontally.
This is characterized by being housed in a housing case in such a manner that the above-mentioned object is achieved.

Further , the resin sealing device of the present invention provides a liquid sealing device.
A plurality of recesses into which resin is injected are arranged in a straight line.
Mold case and each end of this mold case
Each is arranged to protrude upward, and leads
Fits each end of frame to mold lead frame
Support with positioning in the longitudinal direction of the case
Positioned by a pair of positioning members and each positioning member
To fit the lead frame
Positioned in the width direction and vertical direction of the case
Placed on the upper surface of the mold case so that
And a support guide provided in the mold case.
The case body provided with the concave portion is a long plate-shaped support.
Fitting into the opening provided in the holding plate
It is characterized by being supported by rates.

[0014]

[0015]

According to the resin sealing device of the present invention, each end of the lead frame is supported by the positioning member provided at each end of the mold case in a state of being positioned in the longitudinal direction, and is positioned on the mold case. Are supported in a state of being positioned in the width direction and the vertical direction. Therefore, the lead frame and the mold case are positioned with high accuracy.

The lead frame supported while being positioned with respect to the mold case is slid horizontally with respect to the housing case together with the mold case,
The guide groove provided on the bottom surface of the housing case and the mold case are fitted together, and the fitting groove formed on the upper surface is fitted with the lead frame. In such a state, the mold case and the lead frame are fixed while being positioned with respect to each other, and in such a fixed state,
The sealing resin filled in each concave portion of the mold case is cured.

In the mold case, the case body is fitted and supported in the opening of the support plate. When the type of the semiconductor device to be manufactured is changed, the case body is replaced with the support plate. And a case body corresponding to the shape of the lead frame can be used.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view showing an example of the resin sealing device of the present invention. This resin sealing device is used, for example, when manufacturing the light emitting diode 10 shown in FIG. The light emitting diode 10 includes a transparent sealing resin 11 in which a semiconductor light emitting chip is built, and three leads 12 extending from the sealing resin 11. On a predetermined lead 12 in the sealing resin 11, a semiconductor light emitting chip is mounted.
The sealing resin 11 has a cylindrical shape, and has an upper end projecting hemispherically upward. Such a light emitting diode 10 is produced in large quantities using the resin sealing device and the lead frame 20 of the present invention shown in FIG.

The resin sealing device of the present invention comprises a plurality of mold cases 30 for simultaneously molding the sealing resin 11 of the plurality of light emitting diodes 10, and a housing case 40 for integrally supporting each mold case 30 together with the lead frame 20. And

FIGS. 3A and 3B show the structure of the mold case 30. FIG. 3A is a plan view of the main part, FIG. 3B is a partially cutaway front view, and FIG. . The mold case 30 includes a support plate 31 having a long plate shape.
And a plurality of case bodies 32 supported by the support plate 31.

FIG. 4 shows the structure of the support plate 31 used in the mold case 30. FIG.
Is a plan view of a main part of the support plate 31, (b) is a front view thereof, and (c) is a cross-sectional view thereof. Support plate 31
Has a long plate shape in a horizontal state, and has both side edges 31
c is bent upward. The support plate 31 is provided with a rectangular opening 31a over substantially the entire surface except for both ends. In the opening 31a, a plurality of case bodies 32 are inserted and supported in a state of being linearly arranged.

A positioning member 31b for positioning the lead frame 20 is attached to each end of the support plate 31. Each positioning member 31b
Is a flat plate vertically arranged from each end of the support plate 31, and a positioning groove 31 d into which each end of the lead frame 20 is fitted is provided at an upper portion of the side surface on the opening 31 side. Is provided. This positioning groove 31d is
It is in a state of gradually expanding as the upper end portion is located on the upper side.

Each positioning member 31b is made of, for example, a synthetic resin, and is integrated with the support plate 31 by insert molding.

FIG. 5 is a sectional view of the supporting member 1 supported by the supporting plate 31.
FIGS. 3A and 3B show a configuration of one case body 32, wherein FIG. 3A is a plan view, FIG. 3B is a partially cutaway front view, and FIG. The case body 32 has five cylindrical recesses 32a into which a liquid sealing resin is injected. Each recess 32a has an open top surface, and each is arranged linearly. Each recess 32a
Has a hemispherical bottom surface. Case body 32
Each of the side edges of the upper end portion is a flange portion 32b which spreads laterally, and each of the flange portions 32b has an opening when the case body 32 is inserted into the opening portion 31a of the support plate 31. Each side portion of the portion 31a is supported.

Each of the flange portions 32b of the case body 32 has a support base portion 32c projecting upward between the second and third recesses 32a arranged in a straight line, each of which has a widthwise direction. Each is provided on a side. Each support base 32
c has a concave groove 32d formed in the upper part, and each concave groove 32d
Each leg of the flat support guide 33 for supporting the lead frame 20 is inserted into d. As a result, the support guide 33 is supported vertically while being bridged between the support bases 32c.

As shown in FIG. 5 (c), the support guide 33 has a pair of legs 33a extending downward from each side, and each leg 33a is provided on the case main body 32. It is inserted into the support base 32c and vertically supported.
At the center of the upper surface of the support guide 33, the lead frame 20 is provided.
A support groove 33b into which is fitted is provided. The support groove 33b is open upward, and is gradually expanded toward the upper side.

The support guide 33 is detachable from the case body 30 and can be replaced according to the shape of the lead frame 20 or the like.

In the opening 31a of the support plate 31,
A plurality of case bodies 32 are inserted so as to be arranged in a straight line, and the flange portions 32 b of each case body 32 are supported by being placed on the support plate 31. In such a state, the leg 33a of the support guide 33 is inserted into the support base 32c provided on the upper surface of each case body 32, and the support guide 33 is attached in a vertical state.

In the mold case 30 assembled as described above, the liquid sealing resin is filled in each recess 32a of the case body 32. After that, the vertically positioned lead frame 20 is disposed between the positioning members 31b provided on the support plate 31.

As shown in FIG. 1, the lead frame 20 is placed on the mold case 30 with the cradle 21 facing upward.
Arranged on the upper side, the lower tie bar 22 is
3 is inserted into the support groove 33b. Below the tie bar 22, a plurality of sets of leads 23, one set of three, are extended downward.

The lead frame 20 disposed above the mold case 30 is fitted into the positioning groove 31d of the positioning member 31b provided at each end of the support plate 31, so that each end of the lead frame 20 is fitted into the mold case 30. 30 are positioned and supported in the longitudinal direction. Further, the tie bar 22 is fitted into the support groove 33c of the support guide 33 supported vertically on each case body 32, so that the tie bar 22 is positioned in the width direction and the vertical direction of the mold case 20, and is positioned vertically. Supported.

When the lead frame 20 is positioned with respect to the mold case 30 in this manner, one set of three leads 23 extending downward from the tie bar 22 is attached to each of the recesses 32a of the case body 32. Each is inserted by a predetermined amount.

In such a state, the mold case 30 is housed together with the lead frame 20 in the housing case 40 shown in FIG. 1, and is fixed so that the relative position between the mold case 30 and the lead frame 20 does not change. Is done.

The housing case 40 has a rectangular parallelepiped shape with an open front surface, and a plurality of linearly extending guide grooves 42 in which the mold case 30 is inserted are provided in parallel on the bottom surface 41. At each side edge of the upper end of each guide groove 42, a notch 43 is provided, which is cut out so that each side edge of the support plate 31 in the mold case 30 is placed.

In the lower part of the upper surface 44 of the housing case 40, a plurality of fitting grooves 45 are provided in parallel to each of the guide grooves 42 provided on the bottom surface 41. When the case body 32 of the mold case 30 supporting the lead frame 20 is fitted into the guide groove 42 and slid, the fitting groove 45 is fitted with the cradle 21 on the upper side of the lead frame 20. It is slid.

The mold case 30 and the lead frame 20 positioned at a predetermined position with respect to the mold case 30 are integrally inserted into the housing case 40. The mold case 30 and the lead frame 20 are arranged along the guide groove 42 of the housing case 40, and the end of the mold case 30 is fitted to the front surface of the guide groove 42, and the lead frame 20. Is fitted to the front surface of the fitting groove 45. In such a state, the mold case 30 is
At the same time, it is slid toward the inner part of the storage case 40. The mold case 30 is slid while the respective side edges of the support plate 31 are placed on the respective notches 43 provided on the respective side edges of the guide grooves 42, and the case body 32 of the mold case 30 is slid. Are inserted in the guide groove 42 in the horizontal direction.

At this time, the upper end of the lead frame 20 is also fitted with the fitting groove 45 provided on the upper surface 44 of the housing case 40.
Slide inside. When the mold case 30 and the lead frame 20 are inserted into the housing case 40, the mold case 30 maintains a horizontal state, and the lead frame 20 positioned in the mold case 30 maintains a vertical state. .

In this state, the liquid sealing resin filled in each recess 32a of the case main body 32 in the mold case 30 is cured. When the sealing resin is cured, the lead frame 20 is slid horizontally with the mold case 30 and taken out of the housing case 40, and the lead frame 20 is moved upward with respect to the mold case 30, whereby the cured sealing resin is cured. Is taken out of each recess 32a of the mold case 30 integrally with the lead frame 20.

The mold case 30 includes a support plate 31
A plurality of case bodies 32 are fitted and supported in the opening 31a of the case body 32. The case body 32 can be easily replaced according to the shape of the lead frame 20, the type of the semiconductor device to be manufactured, and the like. It is supposed to be.

[0041]

As described above, the resin sealing device of the present invention provides:
The positioning member provided on each end of the mold case supports the lead frame in a state where the lead frame is positioned in the longitudinal direction of the mold case, and the support guide provided on the mold case holds the lead frame in the width direction of the mold case and Vertical positioning and support
Then, in this state, attach the lead frame to the mold case.
In the storage case. At this time, the bottom of the storage case
The guide groove provided in the case and the mold case are fitted
With the fitting groove formed on the upper surface and the lead frame
Are fitted, so that the
The entire case and lead frame are in the storage case.
Position with very high accuracy
Decisions can be made and work efficiency is significantly improved.

In the resin sealing device of the present invention, a concave portion is provided.
The case body is mounted on a long plate-shaped support plate.
Is supported by the support plate.
When the type of semiconductor device to be sealed with resin and the shape of the lead frame are changed, only the case body needs to be replaced with the support plate, further improving work efficiency. I do.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing an example of a resin sealing device of the present invention.

FIG. 2 is a front view showing an example of a light emitting diode manufactured by the resin sealing device.

3A is a plan view of a main part of a mold case used in the resin sealing device of the present invention, FIG. 3B is a partially cutaway front view, and FIG. 3C is a cross-sectional view thereof.

4A is a plan view of a main part of a support plate used in the mold case, FIG. 4B is a front view thereof, and FIG.
Is a cross-sectional view thereof.

5A is a plan view of a main part of a case body used in the molded case, FIG. 5B is a partially cutaway front view thereof,
(C) is a cross-sectional view thereof.

FIG. 6 is an exploded perspective view showing an example of a conventional resin sealing device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Light emitting diode 11 Sealing resin 12 Lead 20 Lead frame 30 Mold case 31 Support plate 31a Opening 31b Positioning member 31d Positioning groove 32 Case main body 32a Depression 32b Flange 33 Supporting guide 40 Housing case 42 Guide groove 45 Fitting groove

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-52-70767 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/56 H01L 33/00

Claims (2)

(57) [Claims] 1. A mold case in which a plurality of recesses into which a liquid sealing resin is injected are arranged in a straight line, and arranged at each end of the mold case so as to project upward. A pair of positioning members that are fitted to each end of the lead frame and support the lead frame positioned in the longitudinal direction of the mold case; and a lead that is fitted to the lead frame positioned by each positioning member. To support the frame positioned in the width direction and the vertical direction of the mold case,
A support guide disposed on the top surface of the mold case, and a guide groove on the bottom surface in which the mold case is fitted;
As well as the lead frame supported by the mold case
Box-shaped storage case having a fitting groove on the upper surface for fitting
And the mold case and the lead frame.
The arm is moved in the horizontal direction and
Resin sealing apparatus characterized in that it is. 2. A plurality of recesses into which a liquid sealing resin is injected.
And a mold case arranged in a straight line and projecting upward at each end of the mold case.
And mated to each end of the leadframe
The lead frame with respect to the longitudinal direction of the mold case.
And a pair of positioning members that are supported in a state where they are positioned, and fit into the lead frame positioned by each positioning member.
The lead frame in the width direction of the mold case and
So that it is supported in a state where it is positioned in the vertical direction,
And a support guide disposed on the upper surface of the mold case.
The case body is mounted on a long plate-shaped support plate.
Fitted into the opening and supported by the support plate
A resin sealing device.