JPS6218071Y2 - - Google Patents
Info
- Publication number
- JPS6218071Y2 JPS6218071Y2 JP1981117639U JP11763981U JPS6218071Y2 JP S6218071 Y2 JPS6218071 Y2 JP S6218071Y2 JP 1981117639 U JP1981117639 U JP 1981117639U JP 11763981 U JP11763981 U JP 11763981U JP S6218071 Y2 JPS6218071 Y2 JP S6218071Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- lead
- reflector
- semiconductor light
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 16
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
【考案の詳細な説明】 本考案は半導体発光表示装置に関する。[Detailed explanation of the idea] The present invention relates to a semiconductor light emitting display device.
従来の半導体発光表示装置を図面を用いて説明
する。PN接合１の形成された発光ダイオード２
がリード３上に固定され、その電極が金属ワイヤ
４で他のリード９に電気的に接続されている。発
光ダイオード２は反射体５で囲まれており、反射
体５とダイオード２との間が透光性樹脂６で封止
されている。発光ダイオード２のPN接合部１か
ら発光された光は、一部は直接に、また残りの大
部分は反射体５によつて反射されて反射体上部の
発光表示面７から外部に照射される。 A conventional semiconductor light emitting display device will be described with reference to the drawings. Light emitting diode 2 with PN junction 1 formed
is fixed on the lead 3, and its electrode is electrically connected to another lead 9 with a metal wire 4. The light emitting diode 2 is surrounded by a reflector 5, and a space between the reflector 5 and the diode 2 is sealed with a transparent resin 6. A portion of the light emitted from the PN junction 1 of the light emitting diode 2 is reflected directly, and most of the remaining light is reflected by the reflector 5 and irradiated to the outside from the light emitting display surface 7 above the reflector. .
第２図はその製造工程を説明する工程図であ
る。また第３図は反射体５の裏面図である。リー
ドフレーム８に、発光ダイオード２を固定し、ボ
ンデイングワイヤ４による接続を行なう。このリ
ードフレーム８を反射体５の裏面よりその中心開
口部９に挿入する。そして透光性樹脂で固定す
る。この際、治具を用いてリードフレーム８の反
射体５に対する高さＨを規定することにより発光
ダイオードの位置設定を行なう。 FIG. 2 is a process diagram explaining the manufacturing process. 3 is a back view of the reflector 5. FIG. A light emitting diode 2 is fixed to a lead frame 8 and connected using a bonding wire 4. This lead frame 8 is inserted into the central opening 9 of the reflector 5 from the back side. Then fix it with translucent resin. At this time, the position of the light emitting diode is set by defining the height H of the lead frame 8 relative to the reflector 5 using a jig.
以上のような従来の半導体発光表示装置におい
ては、発光素子の位置のバラつきが大きいという
欠点があつた。すなわちリードフレームと反射体
の位置関係を治具で決定しても、フレームのゆが
みやそりによつて発光素子が所望の位置に設定さ
れないことが多いからである。このように発光素
子の位置にバラつきが生じると、発光表示面での
輝度もそれに応じて変化することになる。従つ
て、例えばこのような半導体発光表示装置を複数
個並べて文字・数字等を表示する際に、個々の輝
度が異なるため全体として輝度ムラが生じてしま
う。これは、製品としての価値を著しく低下させ
る。 The conventional semiconductor light emitting display device as described above has a drawback in that the positions of the light emitting elements vary widely. That is, even if the positional relationship between the lead frame and the reflector is determined using a jig, the light emitting element is often not set at the desired position due to distortion or warpage of the frame. When variations occur in the positions of the light emitting elements in this way, the brightness on the light emitting display surface also changes accordingly. Therefore, for example, when a plurality of such semiconductor light emitting display devices are lined up to display characters, numbers, etc., the brightness of each device is different, resulting in uneven brightness as a whole. This significantly reduces the value as a product.
本考案は以上述べたような従来技術の欠点を改
良し、発光素子の位置決めが精度よく容易に行な
えるような半導体発光表示装置を提供することを
目的とする。 SUMMARY OF THE INVENTION An object of the present invention is to improve the drawbacks of the prior art as described above, and to provide a semiconductor light emitting display device in which the positioning of light emitting elements can be performed easily and accurately.
次に本考案を図面を用いて詳細に説明する。第
４図は本考案による半導体発光表示装置の一実施
例の横断面図である。PN接合４１の形成された
発光ダイオード４２が半田等で金属リード４３上
に固定されている。またその電極がＡμ細線など
のボンデイングワイヤ４４によつてもう一方のリ
ード４９に電気的に接続されている。発光ダイオ
ード４２の周囲を囲むようにして、シリコン樹脂
等を成型した反射体４５が配置されている。発光
ダイオード４２と反射体４５の間は、透光性樹脂
４６で封止されている。発光ダイオード４２から
発光された光は、一部は直接に、またその他大部
分は反射体４５によつて反射されて発光表示面４
７から外部に照射される。前記リード４３，４９
は、それぞれ突起部４８，５０を有している。こ
の突起部４８，５０が反射体４５の第１のリード
ガイド５１，５２と係合し、またリード全体が第
２のリードガイド５３によつて挾まれている。第
５図ａは反射体４５の裏面図、第５図ｂはＡ−
A′線断面図、第５図ｃはＢ−B′線断面図であ
る。これらを参照して反射体４５に形成された２
つのリードガイドを説明する。 Next, the present invention will be explained in detail using the drawings. FIG. 4 is a cross-sectional view of an embodiment of a semiconductor light emitting display device according to the present invention. A light emitting diode 42 with a PN junction 41 formed thereon is fixed onto a metal lead 43 with solder or the like. Further, the electrode is electrically connected to the other lead 49 by a bonding wire 44 such as an Aμ thin wire. A reflector 45 made of silicone resin or the like is disposed to surround the light emitting diode 42 . The space between the light emitting diode 42 and the reflector 45 is sealed with a translucent resin 46. A portion of the light emitted from the light emitting diode 42 is reflected directly, and most of the light is reflected by the reflector 45 and is reflected onto the light emitting display surface 4.
7 to the outside. The leads 43, 49
have protrusions 48 and 50, respectively. The protrusions 48 and 50 engage with the first lead guides 51 and 52 of the reflector 45, and the entire lead is held between the second lead guides 53. FIG. 5a is a back view of the reflector 45, and FIG. 5b is A-
A sectional view taken along the line A', and FIG. 5c is a sectional view taken along the line B-B'. 2 formed on the reflector 45 with reference to these
Explain the two lead guides.
反射体４５の裏面には略長方形の底面部を有す
る凹状部が形成されている。この底面部に前記リ
ード４３，４９を挿入できる幅と厚さとを持つた
開口部５４が形成されている。この状部の側壁
に、前記開口部５４にリード４３，４９を挿入し
た際に、その突起部４８，５０が係合するような
溝部を設け第１のリードガイド５１，５２として
いる。また前記開口部５４のリード面に平行な長
手方向の一対の縁辺部を突出させて第２のリード
ガイド５３が形成されている。リードを開口部５
４に挿入した際にこのリードガイド５３がリード
面を挾むような構造になつている。 A concave portion having a substantially rectangular bottom portion is formed on the back surface of the reflector 45 . An opening 54 having a width and thickness into which the leads 43 and 49 can be inserted is formed in the bottom surface. Grooves are provided in the side walls of this shaped portion so that when the leads 43 and 49 are inserted into the opening 54, the protrusions 48 and 50 engage, forming first lead guides 51 and 52. Further, a second lead guide 53 is formed by protruding a pair of longitudinal edges parallel to the lead surface of the opening 54. Lead the opening 5
The lead guide 53 is structured so as to sandwich the lead surface when inserted into the lead.
以上のような構成によつて本考案の半導体発光
表示装置は、製造工程において発光素子の位置決
めが非常に容易にしかも正確にできる。すなわち
リードの突起部４８，５０と反射体４５の第１の
リードガイド５１，５２とが係合してリードの反
射体に対する上下・左右の位置を規定する。ま
た、第２のリードガイドによつてリードを反射体
に対して垂直に保ち、精度よく挿入できる。これ
らの２つのリードガイドによつて反射体に対して
リードを確実に安定し支持できる。この結果、従
来のように発光素子の位置にバラツキが起こる恐
れがない。従つて輝度が均一な発光表示装置を作
ることができる。また反射体はシリコン樹脂を型
に入れて成形すればよく、複雑な形でも簡単に大
量に作ることができるので従来よりも工程が複雑
になるということはない。このように本考案によ
れば輝度ムラのない、しかも大量生産に適した半
導体発光表示装置を提供することができる。 With the above configuration, the semiconductor light emitting display device of the present invention allows the positioning of the light emitting elements to be very easily and accurately during the manufacturing process. That is, the protrusions 48 and 50 of the lead and the first lead guides 51 and 52 of the reflector 45 engage with each other to define the vertical and horizontal positions of the lead relative to the reflector. Further, the second lead guide keeps the lead perpendicular to the reflector, allowing for accurate insertion. These two lead guides ensure that the lead can be stably supported relative to the reflector. As a result, there is no risk of variations in the positions of the light emitting elements as in the conventional case. Therefore, a light emitting display device with uniform brightness can be produced. In addition, the reflector can be formed by placing silicone resin in a mold, and even complex shapes can be easily manufactured in large quantities, so the process is not more complicated than before. As described above, according to the present invention, it is possible to provide a semiconductor light emitting display device that has no uneven brightness and is suitable for mass production.
第１図は、従来の半導体発光表示装置の断面図
である。第２図は、従来の工程を示す断面図であ
る。第３図は、従来の反射体の裏面図である。第
４図は、本考案の半導体発光表示装置の断面図で
ある。第５図ａは、本考案の反射体の裏面図で、
第５図ｂはそのＡ−A′線断面図、第５図ｃはそ
のＢ−B′線断面図である。
４２……発光素子、４３，４９……リード、４
５……反射体、４７……表示部、４８，５０……
突起、５１，５２……第１のリードガイド、５３
……第２のリードガイド。
FIG. 1 is a cross-sectional view of a conventional semiconductor light emitting display device. FIG. 2 is a sectional view showing a conventional process. FIG. 3 is a back view of a conventional reflector. FIG. 4 is a sectional view of the semiconductor light emitting display device of the present invention. Figure 5a is a back view of the reflector of the present invention.
FIG. 5b is a cross-sectional view taken along the line A-A', and FIG. 5c is a cross-sectional view taken along the line B-B'. 42... Light emitting element, 43, 49... Lead, 4
5... Reflector, 47... Display section, 48, 50...
Projections, 51, 52...first lead guide, 53
...Second lead guide.
Claims (1)
たこの素子と外部との電気的接続をおこなうため
のリードと、一方の開口部から前記半導体発光素
子が挿入され、他方の開口部には前記半導体発光
素子からの光を外方に照光する表示面が設けら
れ、且つ前記半導体発光素子からの光を反射され
るように構成された反射体とからなる半導体発光
表示装置において前記リードが前記反射体の一方
の開口部に挿入される際に、この開口部において
前記リードが反射体の一部に係止されその挿入深
さが規定されるとともに、前記開口部の縁辺部の
相対する一部により前記リードを挾むようにした
ことを特徴とする半導体発光表示装置。 A semiconductor light emitting element, a lead on which the light emitting element is mounted, and a lead for electrically connecting the element to the outside; the semiconductor light emitting element is inserted through one opening, and the semiconductor light emitting element is inserted into the other opening. In a semiconductor light emitting display device comprising a display surface that illuminates light from a light emitting element outward, and a reflector configured to reflect light from the semiconductor light emitting element, the lead is connected to the reflector. When inserted into one of the openings, the lead is locked to a part of the reflector in this opening to define its insertion depth, and the opposite part of the edge of the opening defines the insertion depth. A semiconductor light emitting display device, characterized in that the lead is sandwiched between the leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981117639U JPS5825055U (en) | 1981-08-10 | 1981-08-10 | semiconductor light emitting display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981117639U JPS5825055U (en) | 1981-08-10 | 1981-08-10 | semiconductor light emitting display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5825055U JPS5825055U (en) | 1983-02-17 |
| JPS6218071Y2 true JPS6218071Y2 (en) | 1987-05-09 |
Family
ID=29911800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981117639U Granted JPS5825055U (en) | 1981-08-10 | 1981-08-10 | semiconductor light emitting display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5825055U (en) |
-
1981
- 1981-08-10 JP JP1981117639U patent/JPS5825055U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5825055U (en) | 1983-02-17 |
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