HK1153570A1 - Jig for aligning leadframe - Google Patents

Jig for aligning leadframe

Info

Publication number
HK1153570A1
HK1153570A1 HK11107494.3A HK11107494A HK1153570A1 HK 1153570 A1 HK1153570 A1 HK 1153570A1 HK 11107494 A HK11107494 A HK 11107494A HK 1153570 A1 HK1153570 A1 HK 1153570A1
Authority
HK
Hong Kong
Prior art keywords
leadframe
jig
aligning
aligning leadframe
Prior art date
Application number
HK11107494.3A
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of HK1153570A1 publication Critical patent/HK1153570A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Die Bonding (AREA)
HK11107494.3A 2008-05-08 2011-07-19 Jig for aligning leadframe HK1153570A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008122480A JP5358120B2 (en) 2008-05-08 2008-05-08 Lead frame positioning jig
PCT/JP2009/001993 WO2009136492A1 (en) 2008-05-08 2009-05-07 Jig for aligning leadframe

Publications (1)

Publication Number Publication Date
HK1153570A1 true HK1153570A1 (en) 2012-03-30

Family

ID=41264549

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11107494.3A HK1153570A1 (en) 2008-05-08 2011-07-19 Jig for aligning leadframe

Country Status (6)

Country Link
JP (1) JP5358120B2 (en)
KR (1) KR101568237B1 (en)
CN (1) CN102067296B (en)
HK (1) HK1153570A1 (en)
TW (1) TWI445107B (en)
WO (1) WO2009136492A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102347406B (en) * 2011-09-30 2015-01-14 中国电子科技集团公司第四十五研究所 Fixture for vertical LED (light emitting diode) lead frame
CN102969294B (en) * 2012-11-20 2016-07-06 无锡市威海达机械制造有限公司 A kind of lead frame structure saves the method for consumptive material
CN103406873B (en) * 2013-07-29 2016-02-24 江苏云意电气股份有限公司 A kind of rectifier diodes location pressing clamp and pressing method
CN106298560A (en) * 2016-09-29 2017-01-04 中国科学院长春光学精密机械与物理研究所 Leads of IC forming device
KR102215300B1 (en) * 2019-09-30 2021-02-15 성문일렉트로닉스 주식회사 Electrode Bending Device of LED Module
CN111370553B (en) * 2020-03-20 2021-08-24 苏州斯尔特微电子有限公司 High-precision chip welding method of LED full-automatic die bonder

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3113104B2 (en) * 1992-11-20 2000-11-27 ローム株式会社 Method for manufacturing semiconductor device
JP2755343B2 (en) * 1993-04-15 1998-05-20 ローム株式会社 Material handling equipment for manufacturing electronic components
JP2999931B2 (en) * 1994-09-02 2000-01-17 シャープ株式会社 Resin sealing device

Also Published As

Publication number Publication date
CN102067296B (en) 2013-01-23
KR101568237B1 (en) 2015-11-11
KR20110021863A (en) 2011-03-04
JP2009272491A (en) 2009-11-19
TWI445107B (en) 2014-07-11
WO2009136492A1 (en) 2009-11-12
CN102067296A (en) 2011-05-18
TW200952100A (en) 2009-12-16
JP5358120B2 (en) 2013-12-04

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