TWI369762B - Method for manufacturing package - Google Patents

Method for manufacturing package

Info

Publication number
TWI369762B
TWI369762B TW097113267A TW97113267A TWI369762B TW I369762 B TWI369762 B TW I369762B TW 097113267 A TW097113267 A TW 097113267A TW 97113267 A TW97113267 A TW 97113267A TW I369762 B TWI369762 B TW I369762B
Authority
TW
Taiwan
Prior art keywords
manufacturing package
package
manufacturing
Prior art date
Application number
TW097113267A
Other languages
Chinese (zh)
Other versions
TW200943498A (en
Inventor
Chingshan Wang
Chinchih Chen
Original Assignee
Chipsip Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipsip Technology Co Ltd filed Critical Chipsip Technology Co Ltd
Priority to TW097113267A priority Critical patent/TWI369762B/en
Publication of TW200943498A publication Critical patent/TW200943498A/en
Application granted granted Critical
Publication of TWI369762B publication Critical patent/TWI369762B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
TW097113267A 2008-04-11 2008-04-11 Method for manufacturing package TWI369762B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097113267A TWI369762B (en) 2008-04-11 2008-04-11 Method for manufacturing package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097113267A TWI369762B (en) 2008-04-11 2008-04-11 Method for manufacturing package

Publications (2)

Publication Number Publication Date
TW200943498A TW200943498A (en) 2009-10-16
TWI369762B true TWI369762B (en) 2012-08-01

Family

ID=44869021

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097113267A TWI369762B (en) 2008-04-11 2008-04-11 Method for manufacturing package

Country Status (1)

Country Link
TW (1) TWI369762B (en)

Also Published As

Publication number Publication date
TW200943498A (en) 2009-10-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees