KR101563418B1 - 와이어 쏘 및 와이어 쏘의 제조방법 - Google Patents

와이어 쏘 및 와이어 쏘의 제조방법 Download PDF

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Publication number
KR101563418B1
KR101563418B1 KR1020140023279A KR20140023279A KR101563418B1 KR 101563418 B1 KR101563418 B1 KR 101563418B1 KR 1020140023279 A KR1020140023279 A KR 1020140023279A KR 20140023279 A KR20140023279 A KR 20140023279A KR 101563418 B1 KR101563418 B1 KR 101563418B1
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KR
South Korea
Prior art keywords
layer
abrasive grains
wire saw
electrodeposition
abriboelectric
Prior art date
Application number
KR1020140023279A
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English (en)
Korean (ko)
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KR20140122999A (ko
Inventor
미야사카 요시오
카토 오사무
사사베 히로시
니시오 타카히데
사카타 신이치
Original Assignee
가부시키가이샤 후지키한
와이어 엔지니어링 프로덕티버티 엘엘씨
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Publication date
Application filed by 가부시키가이샤 후지키한, 와이어 엔지니어링 프로덕티버티 엘엘씨 filed Critical 가부시키가이샤 후지키한
Publication of KR20140122999A publication Critical patent/KR20140122999A/ko
Application granted granted Critical
Publication of KR101563418B1 publication Critical patent/KR101563418B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020140023279A 2013-04-11 2014-02-27 와이어 쏘 및 와이어 쏘의 제조방법 KR101563418B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013083332A JP6245833B2 (ja) 2013-04-11 2013-04-11 ワイヤソーの製造方法
JPJP-P-2013-083332 2013-04-11

Publications (2)

Publication Number Publication Date
KR20140122999A KR20140122999A (ko) 2014-10-21
KR101563418B1 true KR101563418B1 (ko) 2015-10-26

Family

ID=51666008

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140023279A KR101563418B1 (ko) 2013-04-11 2014-02-27 와이어 쏘 및 와이어 쏘의 제조방법

Country Status (4)

Country Link
JP (1) JP6245833B2 (zh)
KR (1) KR101563418B1 (zh)
CN (1) CN104097270B (zh)
TW (1) TWI566864B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104908500B (zh) * 2015-05-18 2017-08-25 刘肖梅 一种钢丝纹理加工装置的雕刻轮
CN104849211B (zh) * 2015-05-27 2017-11-17 深圳市常兴技术股份有限公司 电镀磨具表面金刚石加厚程度的检测方法
CN106086950B (zh) * 2016-06-24 2018-12-18 中国有色桂林矿产地质研究院有限公司 一种齿缝镶嵌金刚石的内圆刀片的制备方法
CN108527664A (zh) * 2018-02-09 2018-09-14 江苏中博钻石科技有限公司 环形金刚石线锯切割装置
CN110091435A (zh) * 2019-06-12 2019-08-06 成都易德莱斯科技有限公司 负反馈自动调控绳锯及调控方法
CN110704985A (zh) * 2019-10-16 2020-01-17 北京航空航天大学 一种渐开线砂轮磨削表面形貌仿真方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010201542A (ja) * 2009-03-02 2010-09-16 Sumitomo Electric Ind Ltd ダイヤモンドワイヤーソー、ダイヤモンドワイヤーソーの製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10100070A (ja) * 1996-09-26 1998-04-21 Toyota Banmotsupusu Kk メタルボンド砥石
KR100299102B1 (ko) * 1998-11-24 2001-11-22 홍영철 취성재료절단용다이아몬드전착와이어및그제조방법
JP2002075767A (ja) * 2000-08-31 2002-03-15 Sumitomo Special Metals Co Ltd 耐食性被膜を有する希土類系永久磁石およびその製造方法
TW571000B (en) * 2001-10-19 2004-01-11 Nihon Parkerizing Methods of preparing metal wires for plastic processing
JP2004009238A (ja) * 2002-06-10 2004-01-15 Kanai Hiroaki ソーワイヤ製造方法及びソーワイヤ
JP2007152485A (ja) * 2005-12-05 2007-06-21 Kanai Hiroaki ソーワイヤの製造方法
WO2007039934A1 (ja) * 2005-12-27 2007-04-12 Japan Fine Steel Co., Ltd. 固定砥粒ワイヤ
JP2007268627A (ja) * 2006-03-30 2007-10-18 Noritake Super Abrasive:Kk 電着ワイヤソー
CN102481647B (zh) * 2009-08-14 2015-07-15 圣戈班磨料磨具有限公司 包括粘结到长形本体上的磨料颗粒的磨料物品
JP5576177B2 (ja) * 2010-04-28 2014-08-20 株式会社リード 固定砥粒ワイヤーソー及びその製造方法
JP2012157908A (ja) * 2011-01-28 2012-08-23 Sumco Corp 硬脆性材料のスライス方法
JP5863170B2 (ja) * 2011-01-31 2016-02-16 サンコール株式会社 固定砥粒ワイヤの製造方法
TWM412050U (en) * 2011-03-17 2011-09-21 Tomohiko Sinosaki Wire saw structure with fixed abrasive particle
KR20120117594A (ko) * 2011-04-16 2012-10-24 다이섹(주) 엔드리스 와이어 톱용 컷팅 비드
CN103857494B (zh) * 2011-09-16 2017-07-11 圣戈班磨料磨具有限公司 研磨制品和形成方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010201542A (ja) * 2009-03-02 2010-09-16 Sumitomo Electric Ind Ltd ダイヤモンドワイヤーソー、ダイヤモンドワイヤーソーの製造方法

Also Published As

Publication number Publication date
CN104097270A (zh) 2014-10-15
JP2014205211A (ja) 2014-10-30
KR20140122999A (ko) 2014-10-21
JP6245833B2 (ja) 2017-12-13
TW201438833A (zh) 2014-10-16
TWI566864B (zh) 2017-01-21
CN104097270B (zh) 2016-03-30

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