JP6245833B2 - ワイヤソーの製造方法 - Google Patents

ワイヤソーの製造方法 Download PDF

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Publication number
JP6245833B2
JP6245833B2 JP2013083332A JP2013083332A JP6245833B2 JP 6245833 B2 JP6245833 B2 JP 6245833B2 JP 2013083332 A JP2013083332 A JP 2013083332A JP 2013083332 A JP2013083332 A JP 2013083332A JP 6245833 B2 JP6245833 B2 JP 6245833B2
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JP
Japan
Prior art keywords
wire saw
abrasive
layer
wire
abrasive grains
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013083332A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014205211A (ja
JP2014205211A5 (zh
Inventor
宮坂　四志男
四志男 宮坂
加藤　修
修 加藤
博史 笹部
博史 笹部
隆秀 西尾
隆秀 西尾
慎一 坂田
慎一 坂田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Kihan Co Ltd
Original Assignee
Fuji Kihan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Kihan Co Ltd filed Critical Fuji Kihan Co Ltd
Priority to JP2013083332A priority Critical patent/JP6245833B2/ja
Priority to TW103106232A priority patent/TWI566864B/zh
Priority to KR1020140023279A priority patent/KR101563418B1/ko
Priority to CN201410126245.9A priority patent/CN104097270B/zh
Publication of JP2014205211A publication Critical patent/JP2014205211A/ja
Publication of JP2014205211A5 publication Critical patent/JP2014205211A5/ja
Application granted granted Critical
Publication of JP6245833B2 publication Critical patent/JP6245833B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2013083332A 2013-04-11 2013-04-11 ワイヤソーの製造方法 Active JP6245833B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013083332A JP6245833B2 (ja) 2013-04-11 2013-04-11 ワイヤソーの製造方法
TW103106232A TWI566864B (zh) 2013-04-11 2014-02-25 Manufacture of wire saws and wire saws
KR1020140023279A KR101563418B1 (ko) 2013-04-11 2014-02-27 와이어 쏘 및 와이어 쏘의 제조방법
CN201410126245.9A CN104097270B (zh) 2013-04-11 2014-03-31 线锯及线锯的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013083332A JP6245833B2 (ja) 2013-04-11 2013-04-11 ワイヤソーの製造方法

Publications (3)

Publication Number Publication Date
JP2014205211A JP2014205211A (ja) 2014-10-30
JP2014205211A5 JP2014205211A5 (zh) 2016-06-02
JP6245833B2 true JP6245833B2 (ja) 2017-12-13

Family

ID=51666008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013083332A Active JP6245833B2 (ja) 2013-04-11 2013-04-11 ワイヤソーの製造方法

Country Status (4)

Country Link
JP (1) JP6245833B2 (zh)
KR (1) KR101563418B1 (zh)
CN (1) CN104097270B (zh)
TW (1) TWI566864B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104908500B (zh) * 2015-05-18 2017-08-25 刘肖梅 一种钢丝纹理加工装置的雕刻轮
CN104849211B (zh) * 2015-05-27 2017-11-17 深圳市常兴技术股份有限公司 电镀磨具表面金刚石加厚程度的检测方法
CN106086950B (zh) * 2016-06-24 2018-12-18 中国有色桂林矿产地质研究院有限公司 一种齿缝镶嵌金刚石的内圆刀片的制备方法
CN108527664A (zh) * 2018-02-09 2018-09-14 江苏中博钻石科技有限公司 环形金刚石线锯切割装置
CN110091435A (zh) * 2019-06-12 2019-08-06 成都易德莱斯科技有限公司 负反馈自动调控绳锯及调控方法
CN110704985A (zh) * 2019-10-16 2020-01-17 北京航空航天大学 一种渐开线砂轮磨削表面形貌仿真方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10100070A (ja) * 1996-09-26 1998-04-21 Toyota Banmotsupusu Kk メタルボンド砥石
KR100299102B1 (ko) * 1998-11-24 2001-11-22 홍영철 취성재료절단용다이아몬드전착와이어및그제조방법
JP2002075767A (ja) * 2000-08-31 2002-03-15 Sumitomo Special Metals Co Ltd 耐食性被膜を有する希土類系永久磁石およびその製造方法
TW571000B (en) * 2001-10-19 2004-01-11 Nihon Parkerizing Methods of preparing metal wires for plastic processing
JP2004009238A (ja) * 2002-06-10 2004-01-15 Kanai Hiroaki ソーワイヤ製造方法及びソーワイヤ
JP2007152485A (ja) * 2005-12-05 2007-06-21 Kanai Hiroaki ソーワイヤの製造方法
WO2007039934A1 (ja) * 2005-12-27 2007-04-12 Japan Fine Steel Co., Ltd. 固定砥粒ワイヤ
JP2007268627A (ja) * 2006-03-30 2007-10-18 Noritake Super Abrasive:Kk 電着ワイヤソー
JP5356071B2 (ja) * 2009-03-02 2013-12-04 住友電気工業株式会社 ダイヤモンドワイヤーソー、ダイヤモンドワイヤーソーの製造方法
CN102481647B (zh) * 2009-08-14 2015-07-15 圣戈班磨料磨具有限公司 包括粘结到长形本体上的磨料颗粒的磨料物品
JP5576177B2 (ja) * 2010-04-28 2014-08-20 株式会社リード 固定砥粒ワイヤーソー及びその製造方法
JP2012157908A (ja) * 2011-01-28 2012-08-23 Sumco Corp 硬脆性材料のスライス方法
JP5863170B2 (ja) * 2011-01-31 2016-02-16 サンコール株式会社 固定砥粒ワイヤの製造方法
TWM412050U (en) * 2011-03-17 2011-09-21 Tomohiko Sinosaki Wire saw structure with fixed abrasive particle
KR20120117594A (ko) * 2011-04-16 2012-10-24 다이섹(주) 엔드리스 와이어 톱용 컷팅 비드
CN103857494B (zh) * 2011-09-16 2017-07-11 圣戈班磨料磨具有限公司 研磨制品和形成方法

Also Published As

Publication number Publication date
CN104097270A (zh) 2014-10-15
JP2014205211A (ja) 2014-10-30
KR101563418B1 (ko) 2015-10-26
KR20140122999A (ko) 2014-10-21
TW201438833A (zh) 2014-10-16
TWI566864B (zh) 2017-01-21
CN104097270B (zh) 2016-03-30

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