KR101562692B1 - 부품 장착 장치 - Google Patents

부품 장착 장치 Download PDF

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Publication number
KR101562692B1
KR101562692B1 KR1020120109039A KR20120109039A KR101562692B1 KR 101562692 B1 KR101562692 B1 KR 101562692B1 KR 1020120109039 A KR1020120109039 A KR 1020120109039A KR 20120109039 A KR20120109039 A KR 20120109039A KR 101562692 B1 KR101562692 B1 KR 101562692B1
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KR
South Korea
Prior art keywords
led element
substrate
phosphor
light
camera
Prior art date
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KR1020120109039A
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English (en)
Korean (ko)
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KR20130035235A (ko
Inventor
요시노리 이께다
아끼히로 가와이
Original Assignee
야마하하쓰도키 가부시키가이샤
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Publication of KR20130035235A publication Critical patent/KR20130035235A/ko
Application granted granted Critical
Publication of KR101562692B1 publication Critical patent/KR101562692B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020120109039A 2011-09-29 2012-09-28 부품 장착 장치 Active KR101562692B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011215557A JP5566359B2 (ja) 2011-09-29 2011-09-29 部品装着装置
JPJP-P-2011-215557 2011-09-29

Publications (2)

Publication Number Publication Date
KR20130035235A KR20130035235A (ko) 2013-04-08
KR101562692B1 true KR101562692B1 (ko) 2015-10-22

Family

ID=48155757

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120109039A Active KR101562692B1 (ko) 2011-09-29 2012-09-28 부품 장착 장치

Country Status (3)

Country Link
JP (1) JP5566359B2 (enrdf_load_stackoverflow)
KR (1) KR101562692B1 (enrdf_load_stackoverflow)
CN (1) CN103079392B (enrdf_load_stackoverflow)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6259274B2 (ja) * 2012-12-11 2018-01-10 ヤマハ発動機株式会社 部品装着装置
AT513747B1 (de) 2013-02-28 2014-07-15 Mikroelektronik Ges Mit Beschränkter Haftung Ab Bestückungsverfahren für Schaltungsträger und Schaltungsträger
JP6190172B2 (ja) * 2013-06-12 2017-08-30 ヤマハ発動機株式会社 部品装着装置
KR101497919B1 (ko) * 2013-07-16 2015-03-11 미래산업 주식회사 마운터용 실장좌표 획득장치, 마운터, 및 이를 이용한 렌즈 실장방법
JP5903563B2 (ja) * 2013-08-19 2016-04-13 パナソニックＩｐマネジメント株式会社 部品実装装置
JP6450923B2 (ja) * 2013-12-20 2019-01-16 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法ならびに電子部品実装装置
JP6263028B2 (ja) * 2013-12-27 2018-01-17 ヤマハ発動機株式会社 部品装着装置
DE102014101901B4 (de) * 2014-02-14 2015-10-15 Asm Assembly Systems Gmbh & Co. Kg Optisches Vermessen eines Bauelementes mit an gegenüberliegenden Seiten vorhandenen strukturellen Merkmalen
DE102014210654B4 (de) 2014-06-04 2023-08-31 Automotive Lighting Reutlingen Gmbh Kraftfahrzeugscheinwerfer umfassend ein SMD-Halbleiterlichtquellenbauteil auf einer Leiterplatte
KR102022473B1 (ko) * 2014-07-04 2019-09-18 한화정밀기계 주식회사 테이프 실장 장치
JP6293899B2 (ja) 2014-08-04 2018-03-14 富士機械製造株式会社 実装装置
AT516638A1 (de) * 2014-12-17 2016-07-15 A B Mikroelektronik Ges Mit Beschränkter Haftung Verfahren zur Herstellung eines Schaltungsträgers und Schaltungsträger
AT517259B1 (de) 2015-06-09 2020-01-15 Zkw Group Gmbh Verfahren zur positionsgenauen Bestückung eines Schaltungsträgers
JP6860440B2 (ja) * 2017-07-20 2021-04-14 日本メクトロン株式会社 基板位置認識装置、位置認識加工装置および基板製造方法
WO2020070809A1 (ja) * 2018-10-02 2020-04-09 株式会社Ｆｕｊｉ 作業機

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009128366A (ja) 2007-11-23 2009-06-11 Samsung Electro Mech Co Ltd 発光素子検査装置及びこれを用いた発光素子検査方法
JP2010225791A (ja) 2009-03-23 2010-10-07 Stanley Electric Co Ltd 半導体発光装置
JP2010245467A (ja) 2009-04-10 2010-10-28 Siix Corp 透明部品の実装方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3090567B2 (ja) * 1993-12-29 2000-09-25 ヤマハ発動機株式会社 実装機における部品認識方法および同装置
JP3412224B2 (ja) * 1994-01-07 2003-06-03 住友電気工業株式会社 レンズ実装方法と装置
US6867421B1 (en) * 1998-12-29 2005-03-15 Bayer Materialscience Llc In-line process for monitoring binder dosage and distribution on a surface and apparatus useful therefor
CN201903509U (zh) * 2010-12-08 2011-07-20 昆山琉明光电有限公司 Led检查装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009128366A (ja) 2007-11-23 2009-06-11 Samsung Electro Mech Co Ltd 発光素子検査装置及びこれを用いた発光素子検査方法
JP2010225791A (ja) 2009-03-23 2010-10-07 Stanley Electric Co Ltd 半導体発光装置
JP2010245467A (ja) 2009-04-10 2010-10-28 Siix Corp 透明部品の実装方法

Also Published As

Publication number Publication date
JP2013077648A (ja) 2013-04-25
JP5566359B2 (ja) 2014-08-06
KR20130035235A (ko) 2013-04-08
CN103079392B (zh) 2016-05-11
CN103079392A (zh) 2013-05-01

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