KR101560452B1 - 전자 디바이스의 제조 방법, 표시 장치의 제조 방법, 포토마스크의 제조 방법 및 포토마스크 - Google Patents
전자 디바이스의 제조 방법, 표시 장치의 제조 방법, 포토마스크의 제조 방법 및 포토마스크 Download PDFInfo
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- KR101560452B1 KR101560452B1 KR1020130118827A KR20130118827A KR101560452B1 KR 101560452 B1 KR101560452 B1 KR 101560452B1 KR 1020130118827 A KR1020130118827 A KR 1020130118827A KR 20130118827 A KR20130118827 A KR 20130118827A KR 101560452 B1 KR101560452 B1 KR 101560452B1
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- pattern
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- 238000000034 method Methods 0.000 claims abstract description 127
- 239000000758 substrate Substances 0.000 claims abstract description 87
- 238000012545 processing Methods 0.000 claims abstract description 67
- 238000000206 photolithography Methods 0.000 claims abstract description 38
- 239000010408 film Substances 0.000 claims description 293
- 238000005530 etching Methods 0.000 claims description 98
- 239000000463 material Substances 0.000 claims description 61
- 238000000059 patterning Methods 0.000 claims description 53
- 206010034972 Photosensitivity reaction Diseases 0.000 claims description 10
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- 238000010030 laminating Methods 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 18
- 238000002834 transmittance Methods 0.000 description 14
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- 238000013461 design Methods 0.000 description 6
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- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
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- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 2
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- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910010282 TiON Inorganic materials 0.000 description 1
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- LDDQLRUQCUTJBB-UHFFFAOYSA-O azanium;hydrofluoride Chemical compound [NH4+].F LDDQLRUQCUTJBB-UHFFFAOYSA-O 0.000 description 1
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- 229910052801 chlorine Inorganic materials 0.000 description 1
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- 230000000994 depressogenic effect Effects 0.000 description 1
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- 229910052731 fluorine Inorganic materials 0.000 description 1
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- 238000003754 machining Methods 0.000 description 1
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- 238000010422 painting Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012227309A JP6157832B2 (ja) | 2012-10-12 | 2012-10-12 | 電子デバイスの製造方法、表示装置の製造方法、フォトマスクの製造方法、及びフォトマスク |
JPJP-P-2012-227309 | 2012-10-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20140047534A KR20140047534A (ko) | 2014-04-22 |
KR101560452B1 true KR101560452B1 (ko) | 2015-10-14 |
Family
ID=50452966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020130118827A Active KR101560452B1 (ko) | 2012-10-12 | 2013-10-04 | 전자 디바이스의 제조 방법, 표시 장치의 제조 방법, 포토마스크의 제조 방법 및 포토마스크 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6157832B2 (enrdf_load_stackoverflow) |
KR (1) | KR101560452B1 (enrdf_load_stackoverflow) |
CN (3) | CN105892226B (enrdf_load_stackoverflow) |
TW (1) | TWI512391B (enrdf_load_stackoverflow) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6726553B2 (ja) * | 2015-09-26 | 2020-07-22 | Hoya株式会社 | フォトマスクの製造方法、及び表示装置の製造方法 |
JP6718225B2 (ja) * | 2015-12-02 | 2020-07-08 | 株式会社エスケーエレクトロニクス | フォトマスクおよびその製造方法 |
JP6514143B2 (ja) * | 2016-05-18 | 2019-05-15 | Hoya株式会社 | フォトマスクの製造方法、フォトマスク、及び表示装置の製造方法 |
TW201823855A (zh) * | 2016-09-21 | 2018-07-01 | 日商Hoya股份有限公司 | 光罩之製造方法、光罩、及顯示裝置之製造方法 |
KR101918380B1 (ko) | 2017-01-06 | 2018-11-13 | 가부시키가이샤 에스케이 일렉트로닉스 | 얼라이먼트 패턴을 갖는 포토 마스크 블랭크 및 이를 이용한 포토 마스크 및 그 제조 방법 |
JP6744955B2 (ja) * | 2019-06-19 | 2020-08-19 | Hoya株式会社 | フォトマスクの製造方法、フォトマスク及び表示装置の製造方法 |
JP7261709B2 (ja) * | 2019-09-13 | 2023-04-20 | Hoya株式会社 | フォトマスク、フォトマスクの製造方法及び表示装置の製造方法 |
CN112526818B (zh) * | 2020-12-02 | 2024-12-20 | 北海惠科光电技术有限公司 | 半色调掩膜版和薄膜晶体管阵列基板制造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006084507A (ja) | 2004-09-14 | 2006-03-30 | Matsushita Electric Ind Co Ltd | 位相シフトマスク及び位相シフトマスクの製造方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001083688A (ja) * | 1999-07-13 | 2001-03-30 | Matsushita Electronics Industry Corp | フォトマスク、レジストパターンの形成方法、アライメント精度計測方法及び半導体装置の製造方法 |
JP3586647B2 (ja) * | 2000-12-26 | 2004-11-10 | Hoya株式会社 | グレートーンマスク及びその製造方法 |
WO2003046659A1 (en) * | 2001-11-27 | 2003-06-05 | Hoya Corporation | Halftone phase shift mask blank, halftone phase shift mask, and manufacturing method thereof |
US7160649B2 (en) * | 2002-07-11 | 2007-01-09 | Hitachi Via Mechanics, Ltd. | Gray level imaging masks, optical imaging apparatus for gray level imaging masks and methods for encoding mask and use of the masks |
TWI286663B (en) * | 2003-06-30 | 2007-09-11 | Hoya Corp | Method for manufacturing gray tone mask, and gray tone mask |
JP4443873B2 (ja) * | 2003-08-15 | 2010-03-31 | Hoya株式会社 | 位相シフトマスクの製造方法 |
US7862960B2 (en) * | 2004-06-22 | 2011-01-04 | Hoya Corporation | Manufacturing method of transparent substrate for mask blanks, manufacturing method of mask blanks, manufacturing method of exposure masks, manufacturing method of semiconductor devices, manufacturing method of liquid crystal display devices, and defect correction method of exposure masks |
JP2007123356A (ja) * | 2005-10-25 | 2007-05-17 | Sharp Corp | 半導体装置の製造方法 |
KR101255616B1 (ko) * | 2006-07-28 | 2013-04-16 | 삼성디스플레이 주식회사 | 다중톤 광마스크, 이의 제조방법 및 이를 이용한박막트랜지스터 기판의 제조방법 |
JP4864776B2 (ja) * | 2007-03-14 | 2012-02-01 | 株式会社東芝 | フォトマスク |
JP2009229893A (ja) * | 2008-03-24 | 2009-10-08 | Hoya Corp | 多階調フォトマスクの製造方法及びパターン転写方法 |
JP2009258693A (ja) * | 2008-03-27 | 2009-11-05 | Hoya Corp | 多階調フォトマスク及びそれを用いたパターン転写方法 |
JP5215019B2 (ja) * | 2008-03-28 | 2013-06-19 | Hoya株式会社 | 多階調フォトマスク及びその製造方法、並びにパターン転写方法 |
JP4878379B2 (ja) * | 2009-02-09 | 2012-02-15 | Hoya株式会社 | グレートーンマスクの製造方法 |
JP2010276724A (ja) * | 2009-05-26 | 2010-12-09 | Hoya Corp | 多階調フォトマスク、多階調フォトマスクの製造方法、及びパターン転写方法 |
JP2011027878A (ja) * | 2009-07-23 | 2011-02-10 | Hoya Corp | 多階調フォトマスク、多階調フォトマスクの製造方法、及びパターン転写方法 |
JP2011081326A (ja) * | 2009-10-10 | 2011-04-21 | Hoya Corp | 多階調フォトマスクの製造方法及び多階調フォトマスク用ブランク、並びに電子デバイスの製造方法 |
TWI502623B (zh) * | 2010-01-07 | 2015-10-01 | Hoya Corp | 光罩之製造方法、光罩、及顯示裝置之製造方法 |
JP2012008545A (ja) * | 2010-05-24 | 2012-01-12 | Hoya Corp | 多階調フォトマスクの製造方法、及びパターン転写方法 |
JP2012008546A (ja) * | 2010-05-24 | 2012-01-12 | Hoya Corp | 多階調フォトマスクの製造方法、及びパターン転写方法 |
-
2012
- 2012-10-12 JP JP2012227309A patent/JP6157832B2/ja active Active
-
2013
- 2013-08-29 TW TW102131117A patent/TWI512391B/zh active
- 2013-10-04 KR KR1020130118827A patent/KR101560452B1/ko active Active
- 2013-10-12 CN CN201610307797.9A patent/CN105892226B/zh active Active
- 2013-10-12 CN CN201910348874.9A patent/CN110147029B/zh active Active
- 2013-10-12 CN CN201310475805.7A patent/CN103728832B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006084507A (ja) | 2004-09-14 | 2006-03-30 | Matsushita Electric Ind Co Ltd | 位相シフトマスク及び位相シフトマスクの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103728832B (zh) | 2017-07-14 |
TW201415160A (zh) | 2014-04-16 |
CN105892226B (zh) | 2019-08-02 |
CN110147029B (zh) | 2022-06-07 |
CN105892226A (zh) | 2016-08-24 |
JP2014081409A (ja) | 2014-05-08 |
TWI512391B (zh) | 2015-12-11 |
KR20140047534A (ko) | 2014-04-22 |
JP6157832B2 (ja) | 2017-07-05 |
CN103728832A (zh) | 2014-04-16 |
CN110147029A (zh) | 2019-08-20 |
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