KR101555709B1 - 해석 장치, 처리 장치, 측정 장치, 노광 장치, 기판 처리시스템, 해석 방법 및 프로그램 - Google Patents

해석 장치, 처리 장치, 측정 장치, 노광 장치, 기판 처리시스템, 해석 방법 및 프로그램 Download PDF

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KR101555709B1
KR101555709B1 KR1020087013398A KR20087013398A KR101555709B1 KR 101555709 B1 KR101555709 B1 KR 101555709B1 KR 1020087013398 A KR1020087013398 A KR 1020087013398A KR 20087013398 A KR20087013398 A KR 20087013398A KR 101555709 B1 KR101555709 B1 KR 101555709B1
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KR
South Korea
Prior art keywords
processing
pattern
information
pattern size
size
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KR1020087013398A
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English (en)
Korean (ko)
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KR20080074942A (ko
Inventor
신이치 오키타
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가부시키가이샤 니콘
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Publication of KR20080074942A publication Critical patent/KR20080074942A/ko
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Publication of KR101555709B1 publication Critical patent/KR101555709B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020087013398A 2005-11-04 2006-11-01 해석 장치, 처리 장치, 측정 장치, 노광 장치, 기판 처리시스템, 해석 방법 및 프로그램 KR101555709B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005320281 2005-11-04
JPJP-P-2005-00320281 2005-11-04

Publications (2)

Publication Number Publication Date
KR20080074942A KR20080074942A (ko) 2008-08-13
KR101555709B1 true KR101555709B1 (ko) 2015-09-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087013398A KR101555709B1 (ko) 2005-11-04 2006-11-01 해석 장치, 처리 장치, 측정 장치, 노광 장치, 기판 처리시스템, 해석 방법 및 프로그램

Country Status (4)

Country Link
JP (1) JP5035685B2 (zh)
KR (1) KR101555709B1 (zh)
TW (1) TWI413154B (zh)
WO (1) WO2007052699A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5065082B2 (ja) * 2008-02-25 2012-10-31 東京エレクトロン株式会社 基板の処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム
JP5237690B2 (ja) * 2008-05-16 2013-07-17 ルネサスエレクトロニクス株式会社 半導体デバイスの製造方法
KR101017109B1 (ko) * 2008-11-26 2011-02-25 세메스 주식회사 반도체 제조 공정 모니터링 방법
JP2011054859A (ja) * 2009-09-04 2011-03-17 Hitachi High-Technologies Corp 半導体装置用パターン検査装置および検査システム
NL2005719A (en) 2009-12-18 2011-06-21 Asml Netherlands Bv Method of measuring properties of dynamic positioning errors in a lithographic apparatus, data processing apparatus, and computer program product.
JP6107078B2 (ja) * 2012-11-21 2017-04-05 大日本印刷株式会社 インプリントモールドの製造方法、および、パターン形成方法と半導体装置の製造方法
CN107278279B (zh) * 2015-02-23 2020-07-03 株式会社尼康 基板处理系统及基板处理方法、以及组件制造方法
JP7188950B2 (ja) 2018-09-20 2022-12-13 株式会社Ｓｃｒｅｅｎホールディングス データ処理方法およびデータ処理プログラム
JP7214417B2 (ja) * 2018-09-20 2023-01-30 株式会社Ｓｃｒｅｅｎホールディングス データ処理方法およびデータ処理プログラム
JP7329386B2 (ja) * 2019-08-09 2023-08-18 コニアク ゲーエムベーハー リソグラフィ処理される半導体デバイスのためのプロセス制御方法
CN112967942B (zh) * 2020-08-07 2023-03-10 重庆康佳光电技术研究院有限公司 晶圆测试方法和装置、计算机存储介质及计算机设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243288A (ja) 2002-02-15 2003-08-29 Canon Inc 加工装置
JP2005101286A (ja) * 2003-09-25 2005-04-14 Toshiba Corp 半導体製造方法及び半導体製造装置
JP2005175283A (ja) * 2003-12-12 2005-06-30 Nikon Corp データ分析方法、及び、デバイス製造方法とそのシステム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3067142B2 (ja) * 1989-11-28 2000-07-17 富士通株式会社 ホトマスクの検査装置及びホトマスクの検査方法
JP2005121286A (ja) * 2003-10-16 2005-05-12 Matsushita Electric Ind Co Ltd 酸素富化給湯装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243288A (ja) 2002-02-15 2003-08-29 Canon Inc 加工装置
JP2005101286A (ja) * 2003-09-25 2005-04-14 Toshiba Corp 半導体製造方法及び半導体製造装置
JP2005175283A (ja) * 2003-12-12 2005-06-30 Nikon Corp データ分析方法、及び、デバイス製造方法とそのシステム

Also Published As

Publication number Publication date
TW200719397A (en) 2007-05-16
KR20080074942A (ko) 2008-08-13
WO2007052699A1 (ja) 2007-05-10
JP5035685B2 (ja) 2012-09-26
TWI413154B (zh) 2013-10-21
JPWO2007052699A1 (ja) 2009-04-30

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