KR101554969B1 - 폴리싱장치 - Google Patents

폴리싱장치 Download PDF

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Publication number
KR101554969B1
KR101554969B1 KR1020107017423A KR20107017423A KR101554969B1 KR 101554969 B1 KR101554969 B1 KR 101554969B1 KR 1020107017423 A KR1020107017423 A KR 1020107017423A KR 20107017423 A KR20107017423 A KR 20107017423A KR 101554969 B1 KR101554969 B1 KR 101554969B1
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KR
South Korea
Prior art keywords
ring
retainer ring
polishing
substrate
top ring
Prior art date
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KR1020107017423A
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English (en)
Korean (ko)
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KR20100131973A (ko
Inventor
마코토 후쿠시마
데츠지 도가와
호즈미 야스다
고지 사이토
오사무 나베야
도모시 이노우에
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20100131973A publication Critical patent/KR20100131973A/ko
Application granted granted Critical
Publication of KR101554969B1 publication Critical patent/KR101554969B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020107017423A 2008-02-13 2009-02-09 폴리싱장치 Active KR101554969B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-031307 2008-02-13
JP2008031307A JP5199691B2 (ja) 2008-02-13 2008-02-13 研磨装置

Publications (2)

Publication Number Publication Date
KR20100131973A KR20100131973A (ko) 2010-12-16
KR101554969B1 true KR101554969B1 (ko) 2015-09-22

Family

ID=40957077

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107017423A Active KR101554969B1 (ko) 2008-02-13 2009-02-09 폴리싱장치

Country Status (5)

Country Link
US (1) US8357029B2 (https=)
JP (2) JP5199691B2 (https=)
KR (1) KR101554969B1 (https=)
TW (1) TWI441710B (https=)
WO (1) WO2009102047A1 (https=)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200460151Y1 (ko) * 2009-09-07 2012-05-07 시너스(주) 화학기계적 연마장치용 리테이너 링 구조물
CN103252715B (zh) * 2010-08-06 2016-06-22 应用材料公司 内扣环和外扣环
TWI613037B (zh) * 2011-07-19 2018-02-01 荏原製作所股份有限公司 硏磨方法
JP5922965B2 (ja) * 2012-03-29 2016-05-24 株式会社荏原製作所 基板保持装置、研磨装置、および研磨方法
JP5964064B2 (ja) * 2012-01-31 2016-08-03 株式会社荏原製作所 基板保持装置、研磨装置、および研磨方法
TWI674171B (zh) 2012-01-31 2019-10-11 日商荏原製作所股份有限公司 基板保持裝置、研磨裝置、及研磨方法
US10702972B2 (en) 2012-05-31 2020-07-07 Ebara Corporation Polishing apparatus
JP5976522B2 (ja) * 2012-05-31 2016-08-23 株式会社荏原製作所 研磨装置および研磨方法
KR101346995B1 (ko) * 2012-08-27 2014-01-16 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드
JP2015062956A (ja) * 2012-09-19 2015-04-09 株式会社荏原製作所 研磨装置
JP6403981B2 (ja) 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
JP6232297B2 (ja) 2014-01-21 2017-11-15 株式会社荏原製作所 基板保持装置および研磨装置
KR102173323B1 (ko) 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
SG10201604105TA (en) 2015-05-25 2016-12-29 Ebara Corp Polishing apparatus, polishing head and retainer ring
KR102424495B1 (ko) * 2015-11-09 2022-07-26 주식회사 케이씨텍 화학 기계적 연마 장치용 연마 헤드
JP6258529B2 (ja) * 2016-02-08 2018-01-10 株式会社荏原製作所 基板保持装置、研磨装置、および研磨方法
WO2017171262A1 (ko) 2016-04-01 2017-10-05 강준모 기판수용부재를 포함하는 화학기계적연마장치용 캐리어헤드
KR101841364B1 (ko) 2016-11-04 2018-03-22 주식회사 씨티에스 씨엠피 해드 및 이를 포함하는 씨엠피 장치
JP6894805B2 (ja) * 2017-08-21 2021-06-30 株式会社荏原製作所 基板研磨装置および基板研磨装置における研磨液吐出方法
JP7074606B2 (ja) * 2018-08-02 2022-05-24 株式会社荏原製作所 基板を保持するためのトップリングおよび基板処理装置
TWI837213B (zh) * 2018-11-21 2024-04-01 美商應用材料股份有限公司 拋光系統、載具頭組件及拋光基板的方法
CN111266993B (zh) * 2018-12-05 2023-06-30 凯斯科技股份有限公司 化学机械式研磨装置用承载头的卡环及具备其的承载头
KR102721972B1 (ko) 2019-07-08 2024-10-29 삼성전자주식회사 회전체 모듈 및 이를 구비하는 화학 기계적 연마 장치
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
JP7536601B2 (ja) * 2020-11-04 2024-08-20 株式会社荏原製作所 研磨ヘッドおよび研磨装置
JP7659565B2 (ja) 2020-11-10 2025-04-09 アプライド マテリアルズ インコーポレイテッド 局所的なウエハ圧力を有する研磨ヘッド
CN112705716B (zh) * 2020-12-10 2023-04-18 九江市钒宇新材料股份有限公司 一种钒氮合金加工设备的卸料机构
TWI797532B (zh) * 2020-12-31 2023-04-01 創技工業股份有限公司 半導體加工的方法及裝置
US12594644B2 (en) * 2021-06-25 2026-04-07 Globalwafers Co., Ltd. Polishing head assembly having recess and cap
US20230356355A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Polishing head with local inner ring downforce control
US20250100105A1 (en) * 2023-09-27 2025-03-27 Applied Materials, Inc. Cmp inner ring in smart head
CN117532495B (zh) * 2023-12-22 2026-02-06 北京晶亦精微科技股份有限公司 一种化学机械抛光装置
CN118769095B (zh) * 2024-09-13 2024-11-26 兴化市台林机械有限公司 一种割草机加工打磨废屑清除装置
CN120395610B (zh) * 2025-07-01 2025-09-16 江西华派光电科技有限公司 一种基于对中冷却结构的摄像头镜片磨边系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000094309A (ja) 1998-09-18 2000-04-04 Toshiba Corp ポリッシング装置
JP2007268654A (ja) 2006-03-31 2007-10-18 Ebara Corp 基板保持装置、研磨装置、および研磨方法

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4270314A (en) * 1979-09-17 1981-06-02 Speedfam Corporation Bearing mount for lapping machine pressure plate
JPH01172625A (ja) * 1987-12-28 1989-07-07 Taiho Kogyo Co Ltd 球面軸受
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
JP3158934B2 (ja) * 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
US5681215A (en) * 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5795215A (en) * 1995-06-09 1998-08-18 Applied Materials, Inc. Method and apparatus for using a retaining ring to control the edge effect
US5762544A (en) 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
JP3807807B2 (ja) * 1997-02-27 2006-08-09 株式会社荏原製作所 ポリッシング装置
JPH10329014A (ja) * 1997-05-26 1998-12-15 Tokyo Seimitsu Co Ltd 断熱機構付きウェーハ研磨装置
JPH11188618A (ja) * 1997-12-22 1999-07-13 Sumitomo Metal Ind Ltd ウェーハの研磨方法と研磨用ウェーハホルダー
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US6390904B1 (en) 1998-05-21 2002-05-21 Applied Materials, Inc. Retainers and non-abrasive liners used in chemical mechanical polishing
US6409585B1 (en) * 1998-12-21 2002-06-25 Ebara Corporation Polishing apparatus and holder for holding an article to be polished
TW436378B (en) * 1999-02-05 2001-05-28 Mitsubishi Materials Corp Wafer polishing apparatus and method for making a wafer
US20020173242A1 (en) * 1999-04-19 2002-11-21 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6231428B1 (en) * 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6113468A (en) * 1999-04-06 2000-09-05 Speedfam-Ipec Corporation Wafer planarization carrier having floating pad load ring
KR100355224B1 (ko) 1999-06-22 2002-10-11 삼성전자 주식회사 연마 헤드의 리테이너 링과 이를 구비한 화학기계적 연마장치
US6206768B1 (en) 1999-07-29 2001-03-27 Chartered Semiconductor Manufacturing, Ltd. Adjustable and extended guide rings
EP1092504B1 (en) * 1999-10-15 2005-12-07 Ebara Corporation Apparatus and method for polishing workpiece
JP3753577B2 (ja) * 1999-11-16 2006-03-08 株式会社荏原製作所 基板保持装置及び該基板保持装置を備えたポリッシング装置
US6354928B1 (en) * 2000-04-21 2002-03-12 Agere Systems Guardian Corp. Polishing apparatus with carrier ring and carrier head employing like polarities
TW579319B (en) 2000-05-12 2004-03-11 Multi Planar Technologies Inc System and method for CMP head having multi-pressure annular zone subcarrier material removal control
US6506105B1 (en) * 2000-05-12 2003-01-14 Multi-Planar Technologies, Inc. System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control
US6558232B1 (en) 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
JP2001338901A (ja) 2000-05-26 2001-12-07 Hitachi Ltd 平坦化加工方法及び、装置並びに，半導体装置の製造方法
US6540592B1 (en) 2000-06-29 2003-04-01 Speedfam-Ipec Corporation Carrier head with reduced moment wear ring
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
US6503129B1 (en) 2000-10-06 2003-01-07 Lam Research Corporation Activated slurry CMP system and methods for implementing the same
JP3849918B2 (ja) * 2000-12-04 2006-11-22 株式会社東京精密 ウェーハ研磨装置
JP3330370B2 (ja) * 2001-01-10 2002-09-30 廣田 重義 低摩擦球面軸受
US6709322B2 (en) 2001-03-29 2004-03-23 Lam Research Corporation Apparatus for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing
JP3977037B2 (ja) * 2001-08-08 2007-09-19 株式会社荏原製作所 四辺形基板の研磨装置
US6796887B2 (en) 2002-11-13 2004-09-28 Speedfam-Ipec Corporation Wear ring assembly
JP2005088171A (ja) * 2003-09-19 2005-04-07 Tokyo Seimitsu Co Ltd ワーク保持ヘッド及び該ワーク保持ヘッドを有する研磨装置
JP4817687B2 (ja) 2005-03-18 2011-11-16 株式会社荏原製作所 研磨装置
JP4597634B2 (ja) 2004-11-01 2010-12-15 株式会社荏原製作所 トップリング、基板の研磨装置及び研磨方法
CN101934491B (zh) * 2004-11-01 2012-07-25 株式会社荏原制作所 抛光设备
US7186171B2 (en) 2005-04-22 2007-03-06 Applied Materials, Inc. Composite retaining ring
JP2007053163A (ja) * 2005-08-16 2007-03-01 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 研磨装置および研磨ヘッド
JP2007053164A (ja) * 2005-08-16 2007-03-01 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 研磨装置および研磨ヘッド
JP2008023603A (ja) * 2006-07-18 2008-02-07 Nippon Seimitsu Denshi Co Ltd ２層構造のリテーナリング
JP5464820B2 (ja) * 2007-10-29 2014-04-09 株式会社荏原製作所 研磨装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000094309A (ja) 1998-09-18 2000-04-04 Toshiba Corp ポリッシング装置
JP2007268654A (ja) 2006-03-31 2007-10-18 Ebara Corp 基板保持装置、研磨装置、および研磨方法

Also Published As

Publication number Publication date
JP5572730B2 (ja) 2014-08-13
TWI441710B (zh) 2014-06-21
US8357029B2 (en) 2013-01-22
KR20100131973A (ko) 2010-12-16
JP2009190101A (ja) 2009-08-27
TW200946281A (en) 2009-11-16
JP5199691B2 (ja) 2013-05-15
US20100273405A1 (en) 2010-10-28
JP2013082069A (ja) 2013-05-09
WO2009102047A1 (en) 2009-08-20

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