KR101521513B1 - 실리콘 카바이도나이트라이드계 형광체 및 이를 사용한 발광장치 - Google Patents

실리콘 카바이도나이트라이드계 형광체 및 이를 사용한 발광장치 Download PDF

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KR101521513B1
KR101521513B1 KR1020147019974A KR20147019974A KR101521513B1 KR 101521513 B1 KR101521513 B1 KR 101521513B1 KR 1020147019974 A KR1020147019974 A KR 1020147019974A KR 20147019974 A KR20147019974 A KR 20147019974A KR 101521513 B1 KR101521513 B1 KR 101521513B1
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phosphor
light
composition
certain embodiments
group
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Korean (ko)
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KR20140106708A (ko
Inventor
유안퀴앙 리
마이클 데니스 로마넬리
용치 티안
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라이트스케이프 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
KR1020147019974A 2010-09-10 2011-06-20 실리콘 카바이도나이트라이드계 형광체 및 이를 사용한 발광장치 Expired - Fee Related KR101521513B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US38186210P 2010-09-10 2010-09-10
US61/381,862 2010-09-10
US201161441977P 2011-02-11 2011-02-11
US61/441,977 2011-02-11
PCT/US2011/041111 WO2012033557A1 (en) 2010-09-10 2011-06-20 Silicon carbidonitride based phosphors and lighting devices using the same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020137007915A Division KR20130066677A (ko) 2010-09-10 2011-06-20 실리콘 카바이도나이트라이드계 형광체 및 이를 사용한 발광장치

Publications (2)

Publication Number Publication Date
KR20140106708A KR20140106708A (ko) 2014-09-03
KR101521513B1 true KR101521513B1 (ko) 2015-05-19

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KR1020137007915A Ceased KR20130066677A (ko) 2010-09-10 2011-06-20 실리콘 카바이도나이트라이드계 형광체 및 이를 사용한 발광장치
KR1020147019974A Expired - Fee Related KR101521513B1 (ko) 2010-09-10 2011-06-20 실리콘 카바이도나이트라이드계 형광체 및 이를 사용한 발광장치

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Country Status (7)

Country Link
US (1) US8535566B2 (enExample)
EP (1) EP2614683A4 (enExample)
JP (1) JP5779651B2 (enExample)
KR (2) KR20130066677A (enExample)
CN (1) CN103155707A (enExample)
SG (1) SG187896A1 (enExample)
WO (1) WO2012033557A1 (enExample)

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WO2011142770A1 (en) 2010-05-14 2011-11-17 Lightscape Materials, Inc. Carbonitride based phosphors and light emitting devices using the same
CN103045256B (zh) * 2011-10-17 2014-08-27 有研稀土新材料股份有限公司 一种led红色荧光物质及含有该荧光物质的发光器件
US9017574B2 (en) * 2011-12-19 2015-04-28 Lightscape Materials, Inc. Carbidonitride phosphors and LED lighting devices using the same
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US8815121B2 (en) 2012-08-31 2014-08-26 Lightscape Materials, Inc. Halogenated oxycarbidonitride phosphor and devices using same
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US9200198B1 (en) 2014-08-28 2015-12-01 Lightscape Materials, Inc. Inorganic phosphor and light emitting devices comprising same
US9315725B2 (en) 2014-08-28 2016-04-19 Lightscape Materials, Inc. Method of making EU2+ activated inorganic red phosphor
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CN109075235B (zh) * 2016-02-23 2021-11-12 亮锐控股有限公司 用于发光器件的波长转换材料
CN105969356B (zh) * 2016-05-30 2017-04-12 江苏博睿光电有限公司 一种具有防静电功能的氮氧化物荧光体及其制备方法和发光器件
WO2019192791A1 (de) * 2018-04-04 2019-10-10 Osram Opto Semiconductors Gmbh Leuchtstoff und beleuchtungsvorrichtung
KR102201673B1 (ko) * 2018-08-13 2021-01-12 한국세라믹기술원 전이금속이 도핑된 유리를 이용한 형광체 복합 유리
CN111849472B (zh) * 2020-06-29 2022-12-09 江西理工大学 一种低品质氮化物或氮氧化物荧光材料的发光性能提升及其热稳定性能改善方法
CN115109589A (zh) * 2021-03-19 2022-09-27 深圳市绎立锐光科技开发有限公司 一种荧光粉及其制备方法
CN115353880B (zh) * 2022-07-19 2023-04-18 中煤化(北京)经贸有限公司 无机碳氮化物或碳化物荧光材料、其制造方法和包含该荧光材料的发光装置

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US8535566B2 (en) 2013-09-17
KR20140106708A (ko) 2014-09-03
JP2013543016A (ja) 2013-11-28
KR20130066677A (ko) 2013-06-20
EP2614683A4 (en) 2014-04-16
WO2012033557A1 (en) 2012-03-15
JP5779651B2 (ja) 2015-09-16
CN103155707A (zh) 2013-06-12
SG187896A1 (en) 2013-04-30
EP2614683A1 (en) 2013-07-17
US20120062105A1 (en) 2012-03-15

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