CN103155707A - 基于碳氮化硅的磷光体及使用该材料的照明器件 - Google Patents

基于碳氮化硅的磷光体及使用该材料的照明器件 Download PDF

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Publication number
CN103155707A
CN103155707A CN2011800434310A CN201180043431A CN103155707A CN 103155707 A CN103155707 A CN 103155707A CN 2011800434310 A CN2011800434310 A CN 2011800434310A CN 201180043431 A CN201180043431 A CN 201180043431A CN 103155707 A CN103155707 A CN 103155707A
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composition
phosphor
lower group
luminescent device
light
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CN2011800434310A
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Chinese (zh)
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李远强
M·D·罗曼内里
田永驰
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Sarnoff Corp
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Sarnoff Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
CN2011800434310A 2010-09-10 2011-06-20 基于碳氮化硅的磷光体及使用该材料的照明器件 Pending CN103155707A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US38186210P 2010-09-10 2010-09-10
US61/381,862 2010-09-10
US201161441977P 2011-02-11 2011-02-11
US61/441,977 2011-02-11
PCT/US2011/041111 WO2012033557A1 (en) 2010-09-10 2011-06-20 Silicon carbidonitride based phosphors and lighting devices using the same

Publications (1)

Publication Number Publication Date
CN103155707A true CN103155707A (zh) 2013-06-12

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CN2011800434310A Pending CN103155707A (zh) 2010-09-10 2011-06-20 基于碳氮化硅的磷光体及使用该材料的照明器件

Country Status (7)

Country Link
US (1) US8535566B2 (enExample)
EP (1) EP2614683A4 (enExample)
JP (1) JP5779651B2 (enExample)
KR (2) KR20130066677A (enExample)
CN (1) CN103155707A (enExample)
SG (1) SG187896A1 (enExample)
WO (1) WO2012033557A1 (enExample)

Cited By (9)

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CN103275705A (zh) * 2013-06-21 2013-09-04 北京有色金属研究总院 荧光粉、其制备方法及包括其的发光装置
CN105385442A (zh) * 2014-08-28 2016-03-09 Lightscape材料公司 制造Eu2+活性无机红色磷光体的方法
CN105385440A (zh) * 2014-08-28 2016-03-09 Lightscape材料公司 无机红色磷光体和包含其的发光装置
CN105385443A (zh) * 2014-08-28 2016-03-09 Lightscape材料公司 无机磷光体和包含其的发光装置
CN105969356A (zh) * 2016-05-30 2016-09-28 江苏博睿光电有限公司 一种具有防静电功能的氮氧化物荧光体及其制备方法和发光器件
CN109075235A (zh) * 2016-02-23 2018-12-21 亮锐控股有限公司 用于发光器件的波长转换材料
CN111849472A (zh) * 2020-06-29 2020-10-30 江西理工大学 一种低品质氮化物或氮氧化物荧光材料的发光性能提升及其热稳定性能改善方法
CN115109589A (zh) * 2021-03-19 2022-09-27 深圳市绎立锐光科技开发有限公司 一种荧光粉及其制备方法
CN115353880A (zh) * 2022-07-19 2022-11-18 中煤化(北京)经贸有限公司 无机碳氮化物或碳化物荧光材料、其制造方法和包含该荧光材料的发光装置

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WO2011142770A1 (en) 2010-05-14 2011-11-17 Lightscape Materials, Inc. Carbonitride based phosphors and light emitting devices using the same
CN103045256B (zh) * 2011-10-17 2014-08-27 有研稀土新材料股份有限公司 一种led红色荧光物质及含有该荧光物质的发光器件
US9017574B2 (en) * 2011-12-19 2015-04-28 Lightscape Materials, Inc. Carbidonitride phosphors and LED lighting devices using the same
JP5727955B2 (ja) * 2012-03-08 2015-06-03 株式会社東芝 蛍光体およびその製造方法
US8815121B2 (en) 2012-08-31 2014-08-26 Lightscape Materials, Inc. Halogenated oxycarbidonitride phosphor and devices using same
JP6068914B2 (ja) * 2012-10-09 2017-01-25 デンカ株式会社 蛍光体の製造方法
US11408572B2 (en) 2014-03-15 2022-08-09 Ideal Industries Lighting Llc Luminaires utilizing optical waveguide
US9952372B2 (en) * 2013-03-15 2018-04-24 Cree, Inc. Luminaire utilizing waveguide
US10317608B2 (en) * 2014-03-15 2019-06-11 Cree, Inc. Luminaires utilizing optical waveguide
JP2014181260A (ja) * 2013-03-18 2014-09-29 Toshiba Corp 蛍光体、発光装置、および蛍光体の製造方法
US9219202B2 (en) * 2013-04-19 2015-12-22 Cree, Inc. Semiconductor light emitting devices including red phosphors that exhibit good color rendering properties and related red phosphors
US20150009290A1 (en) * 2013-07-05 2015-01-08 Peter MANKOWSKI Compact light module for structured-light 3d scanning
US10069046B2 (en) * 2013-11-13 2018-09-04 Lg Innotek Co., Ltd. Bluish green phosphor and light emitting device package including the same
JP6528418B2 (ja) * 2014-01-29 2019-06-12 日亜化学工業株式会社 蛍光体及びこれを用いた発光装置
KR102214065B1 (ko) * 2014-02-20 2021-02-09 엘지전자 주식회사 산 질화물 형광체, 그 제조 방법 및 이를 이용한 발광 소자 패키지
WO2019192791A1 (de) * 2018-04-04 2019-10-10 Osram Opto Semiconductors Gmbh Leuchtstoff und beleuchtungsvorrichtung
KR102201673B1 (ko) * 2018-08-13 2021-01-12 한국세라믹기술원 전이금속이 도핑된 유리를 이용한 형광체 복합 유리

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103275705A (zh) * 2013-06-21 2013-09-04 北京有色金属研究总院 荧光粉、其制备方法及包括其的发光装置
CN103275705B (zh) * 2013-06-21 2017-08-25 北京有色金属研究总院 荧光粉、其制备方法及包括其的发光装置
CN105385443A (zh) * 2014-08-28 2016-03-09 Lightscape材料公司 无机磷光体和包含其的发光装置
CN105385440A (zh) * 2014-08-28 2016-03-09 Lightscape材料公司 无机红色磷光体和包含其的发光装置
CN105385442A (zh) * 2014-08-28 2016-03-09 Lightscape材料公司 制造Eu2+活性无机红色磷光体的方法
CN105385442B (zh) * 2014-08-28 2017-11-07 Lightscape 材料公司 制造Eu2+活性无机红色磷光体的方法
CN109075235A (zh) * 2016-02-23 2018-12-21 亮锐控股有限公司 用于发光器件的波长转换材料
US11041122B2 (en) 2016-02-23 2021-06-22 Lumileds Llc Wavelength converting material for a light emitting device
CN105969356A (zh) * 2016-05-30 2016-09-28 江苏博睿光电有限公司 一种具有防静电功能的氮氧化物荧光体及其制备方法和发光器件
CN105969356B (zh) * 2016-05-30 2017-04-12 江苏博睿光电有限公司 一种具有防静电功能的氮氧化物荧光体及其制备方法和发光器件
CN111849472A (zh) * 2020-06-29 2020-10-30 江西理工大学 一种低品质氮化物或氮氧化物荧光材料的发光性能提升及其热稳定性能改善方法
CN111849472B (zh) * 2020-06-29 2022-12-09 江西理工大学 一种低品质氮化物或氮氧化物荧光材料的发光性能提升及其热稳定性能改善方法
CN115109589A (zh) * 2021-03-19 2022-09-27 深圳市绎立锐光科技开发有限公司 一种荧光粉及其制备方法
CN115353880A (zh) * 2022-07-19 2022-11-18 中煤化(北京)经贸有限公司 无机碳氮化物或碳化物荧光材料、其制造方法和包含该荧光材料的发光装置

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KR101521513B1 (ko) 2015-05-19
US8535566B2 (en) 2013-09-17
KR20140106708A (ko) 2014-09-03
JP2013543016A (ja) 2013-11-28
KR20130066677A (ko) 2013-06-20
EP2614683A4 (en) 2014-04-16
WO2012033557A1 (en) 2012-03-15
JP5779651B2 (ja) 2015-09-16
SG187896A1 (en) 2013-04-30
EP2614683A1 (en) 2013-07-17
US20120062105A1 (en) 2012-03-15

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