KR101521190B1 - 제조 툴에 대한 레시피를 생성하는 방법 및 그 시스템 - Google Patents

제조 툴에 대한 레시피를 생성하는 방법 및 그 시스템 Download PDF

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KR101521190B1
KR101521190B1 KR1020130060427A KR20130060427A KR101521190B1 KR 101521190 B1 KR101521190 B1 KR 101521190B1 KR 1020130060427 A KR1020130060427 A KR 1020130060427A KR 20130060427 A KR20130060427 A KR 20130060427A KR 101521190 B1 KR101521190 B1 KR 101521190B1
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South Korea
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periodic
arrays
sub
stitches
periodicity
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Korean (ko)
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KR20130133685A (ko
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마크 게셀
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어플라이드 머티리얼즈 이스라엘 리미티드
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020130060427A 2012-05-29 2013-05-28 제조 툴에 대한 레시피를 생성하는 방법 및 그 시스템 Active KR101521190B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/482,955 2012-05-29
US13/482,955 US8640060B2 (en) 2012-05-29 2012-05-29 Method of generating a recipe for a manufacturing tool and system thereof

Publications (2)

Publication Number Publication Date
KR20130133685A KR20130133685A (ko) 2013-12-09
KR101521190B1 true KR101521190B1 (ko) 2015-05-18

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ID=49671900

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KR1020130060427A Active KR101521190B1 (ko) 2012-05-29 2013-05-28 제조 툴에 대한 레시피를 생성하는 방법 및 그 시스템

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Country Link
US (1) US8640060B2 (enExample)
JP (1) JP5745573B2 (enExample)
KR (1) KR101521190B1 (enExample)
TW (1) TWI474208B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2789311B2 (ja) 1995-04-05 1998-08-20 株式会社十勝重機工作所 大動物移動式診療台
US9141730B2 (en) * 2011-09-12 2015-09-22 Applied Materials Israel, Ltd. Method of generating a recipe for a manufacturing tool and system thereof
US10012689B2 (en) 2015-03-25 2018-07-03 Applied Materials Israel Ltd. Method of inspecting a specimen and system thereof
US10671786B2 (en) * 2016-11-29 2020-06-02 Taiwan Semiconductor Manufacturing Co., Ltd. Method of modeling a mask by taking into account of mask pattern edge interaction
US10466586B2 (en) 2016-11-29 2019-11-05 Taiwan Semiconductor Manufacturing Co., Ltd. Method of modeling a mask having patterns with arbitrary angles
CN109246257B (zh) * 2018-10-12 2021-10-08 平安科技（深圳）有限公司 流量调配方法、装置、计算机设备及存储介质
CN109446695A (zh) * 2018-11-08 2019-03-08 中铁山桥集团有限公司 一种基于acad快速拼图的方法
US12118726B2 (en) * 2021-01-15 2024-10-15 Kulicke And Soffa Industries, Inc. Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7869643B2 (en) * 2007-01-31 2011-01-11 Applied Materials South East Asia Pte. Ltd. Advanced cell-to-cell inspection
US20130066454A1 (en) * 2011-09-12 2013-03-14 Mark Geshel Method of generating a recipe for a manufacturing tool and system thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3191710B2 (ja) * 1997-01-20 2001-07-23 日本電気株式会社 図形一括電子線描画用マスク及び図形一括電子線描画用マスク作成方法並びに図形一括電子線描画装置
US6486066B2 (en) * 2001-02-02 2002-11-26 Matrix Semiconductor, Inc. Method of generating integrated circuit feature layout for improved chemical mechanical polishing
US6886153B1 (en) * 2001-12-21 2005-04-26 Kla-Tencor Corporation Design driven inspection or measurement for semiconductor using recipe
JP4868727B2 (ja) * 2004-09-27 2012-02-01 株式会社東芝 自動検査レシピ作成装置及び作成方法
KR100924338B1 (ko) * 2007-06-25 2009-11-05 주식회사 하이닉스반도체 선형 패턴 어레이 형성 방법, 이에 따른 반도체 소자 및이에 사용되는 포토 마스크

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7869643B2 (en) * 2007-01-31 2011-01-11 Applied Materials South East Asia Pte. Ltd. Advanced cell-to-cell inspection
US20130066454A1 (en) * 2011-09-12 2013-03-14 Mark Geshel Method of generating a recipe for a manufacturing tool and system thereof

Also Published As

Publication number Publication date
KR20130133685A (ko) 2013-12-09
JP2013251542A (ja) 2013-12-12
JP5745573B2 (ja) 2015-07-08
TW201407395A (zh) 2014-02-16
TWI474208B (zh) 2015-02-21
US8640060B2 (en) 2014-01-28
US20130326443A1 (en) 2013-12-05

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