KR101513107B1 - 조정 장치, 레이저 가공 장치, 조정 방법, 및 조정 프로그램 - Google Patents

조정 장치, 레이저 가공 장치, 조정 방법, 및 조정 프로그램 Download PDF

Info

Publication number
KR101513107B1
KR101513107B1 KR1020080096603A KR20080096603A KR101513107B1 KR 101513107 B1 KR101513107 B1 KR 101513107B1 KR 1020080096603 A KR1020080096603 A KR 1020080096603A KR 20080096603 A KR20080096603 A KR 20080096603A KR 101513107 B1 KR101513107 B1 KR 101513107B1
Authority
KR
South Korea
Prior art keywords
pattern
image
calibration
light
irradiation
Prior art date
Application number
KR1020080096603A
Other languages
English (en)
Korean (ko)
Other versions
KR20090033817A (ko
Inventor
류이치 야마자키
Original Assignee
올림푸스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 올림푸스 가부시키가이샤 filed Critical 올림푸스 가부시키가이샤
Publication of KR20090033817A publication Critical patent/KR20090033817A/ko
Application granted granted Critical
Publication of KR101513107B1 publication Critical patent/KR101513107B1/ko

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/044Seam tracking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/14Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/16Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
    • G01B11/161Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means
    • G01B11/164Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means by holographic interferometry
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G2215/00Apparatus for electrophotographic processes
    • G03G2215/04Arrangements for exposing and producing an image
    • G03G2215/0402Exposure devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
KR1020080096603A 2007-10-01 2008-10-01 조정 장치, 레이저 가공 장치, 조정 방법, 및 조정 프로그램 KR101513107B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-258141 2007-10-01
JP2007258141A JP5090121B2 (ja) 2007-10-01 2007-10-01 調整装置、レーザ加工装置、調整方法、および調整プログラム

Publications (2)

Publication Number Publication Date
KR20090033817A KR20090033817A (ko) 2009-04-06
KR101513107B1 true KR101513107B1 (ko) 2015-04-17

Family

ID=40537886

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080096603A KR101513107B1 (ko) 2007-10-01 2008-10-01 조정 장치, 레이저 가공 장치, 조정 방법, 및 조정 프로그램

Country Status (4)

Country Link
JP (1) JP5090121B2 (ja)
KR (1) KR101513107B1 (ja)
CN (1) CN101403822A (ja)
TW (1) TWI422452B (ja)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5451238B2 (ja) * 2009-08-03 2014-03-26 浜松ホトニクス株式会社 レーザ加工方法
JP5791908B2 (ja) * 2011-01-18 2015-10-07 オリンパス株式会社 調整装置、レーザ加工装置および調整方法
KR101310452B1 (ko) * 2011-08-25 2013-09-24 삼성전기주식회사 어레이 타입 공간변조기를 이용한 레이저가공방법
US20130140286A1 (en) * 2011-12-06 2013-06-06 Herbert Chidsey Roberts, III Systems and methods for internal cavity formation using laser manipulation
CN102879905B (zh) * 2012-09-13 2015-10-28 北京国科世纪激光技术有限公司 一种用于观察光斑方位变换的装置和光束整形方法
JP6128822B2 (ja) 2012-12-05 2017-05-17 オリンパス株式会社 光学装置
KR102117608B1 (ko) * 2013-08-14 2020-06-02 삼성디스플레이 주식회사 밀봉 장치, 밀봉 장치를 포함하는 기판 밀봉 장치 및 기판 밀봉 방법
US10618131B2 (en) 2014-06-05 2020-04-14 Nlight, Inc. Laser patterning skew correction
DE102014213518A1 (de) * 2014-07-11 2016-01-14 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren, Bearbeitungsmaschine und Computerprogrammprodukt zum bildbasierten Platzieren von Werkstückbearbeitungsvorgängen
JP6620976B2 (ja) * 2015-09-29 2019-12-18 株式会社東京精密 レーザー加工装置及びレーザー加工方法
JP6785858B2 (ja) 2015-11-23 2020-11-18 エヌライト,インコーポレーテッド レーザ加工のための微細スケールでの時間的制御
US11179807B2 (en) 2015-11-23 2021-11-23 Nlight, Inc. Fine-scale temporal control for laser material processing
JP6689631B2 (ja) * 2016-03-10 2020-04-28 浜松ホトニクス株式会社 レーザ光照射装置及びレーザ光照射方法
WO2017155104A1 (ja) * 2016-03-10 2017-09-14 浜松ホトニクス株式会社 レーザ光照射装置及びレーザ光照射方法
WO2018063452A1 (en) 2016-09-29 2018-04-05 Nlight, Inc. Adjustable beam characteristics
JP6768444B2 (ja) * 2016-10-14 2020-10-14 浜松ホトニクス株式会社 レーザ加工装置、及び、動作確認方法
EP3607389B1 (en) 2017-04-04 2023-06-07 Nlight, Inc. Optical fiducial generation for galvanometric scanner calibration
CN107186364B (zh) * 2017-07-11 2024-02-02 华侨大学 无机械运动实现精确激光切割轨迹和显微细胞切割方法
US10794838B2 (en) * 2017-07-21 2020-10-06 Isvision (Tianjin) Technology Co., Ltd Method and device for detecting defect of cover lens in laser welding system on automobile production line
JP7105639B2 (ja) 2018-07-05 2022-07-25 浜松ホトニクス株式会社 レーザ加工装置
JP7283918B2 (ja) * 2019-02-20 2023-05-30 株式会社ディスコ 加工装置
CN110497088B (zh) * 2019-08-31 2020-05-19 大连理工大学 基于曲面映射的柔性共形天线激光加工误差控制方法
CN113290313B (zh) * 2020-02-19 2023-10-31 深圳市创客工场科技有限公司 激光加工控制方法、装置及激光加工设备
JP7566640B2 (ja) * 2021-01-04 2024-10-15 株式会社東芝 処理装置、溶接システム、処理方法、プログラム、及び記憶媒体
CN114289858B (zh) * 2021-11-18 2023-07-07 富联裕展科技(深圳)有限公司 调试和监控方法、装置、设备及计算机可读存储介质

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3180194B2 (ja) * 1991-07-25 2001-06-25 日立ビアメカニクス株式会社 レーザ加工機
JP2823750B2 (ja) * 1992-09-02 1998-11-11 三菱電機株式会社 レーザマーキング装置
JP2002001562A (ja) * 2000-06-16 2002-01-08 Ricoh Microelectronics Co Ltd 光加工方法及びその装置並びに記録媒体
JP2004109565A (ja) * 2002-09-19 2004-04-08 Olympus Corp 標本観察システム及び標本観察システムの調整方法
TWI279278B (en) * 2006-01-13 2007-04-21 Hs Comp Co Ltd Method of edge-directed cutting fabric with laser
JP5119728B2 (ja) * 2007-05-08 2013-01-16 ソニー株式会社 レーザ加工装置の較正方法及びレーザ加工装置

Also Published As

Publication number Publication date
TW200916248A (en) 2009-04-16
CN101403822A (zh) 2009-04-08
JP2009082966A (ja) 2009-04-23
KR20090033817A (ko) 2009-04-06
TWI422452B (zh) 2014-01-11
JP5090121B2 (ja) 2012-12-05

Similar Documents

Publication Publication Date Title
KR101513107B1 (ko) 조정 장치, 레이저 가공 장치, 조정 방법, 및 조정 프로그램
JP5791908B2 (ja) 調整装置、レーザ加工装置および調整方法
KR101485437B1 (ko) 기준 위치 측정 장치 및 방법, 및 패턴 형성 장치
KR101615946B1 (ko) 3차원 형상 측정장치
JP4450739B2 (ja) 露光装置
JP2009262161A (ja) 修正装置、修正方法、制御装置、およびプログラム
JP2011025316A (ja) 欠陥修正装置
WO2023007405A1 (en) Calibration systems and methods for additive manufacturing systems with multiple image projection
JP2008251797A (ja) 基準位置計測装置及び方法、並びに描画装置
US8258472B2 (en) Charged particle radiation device and image capturing condition determining method using charged particle radiation device
KR101094468B1 (ko) 노광 패턴 형성 방법
JP2007033202A (ja) 外観検査装置および外観検査方法
JP2009288162A (ja) 3次元測定装置
US20220355548A1 (en) Calibration systems and methods for additive manufacturing systems with multiple image projection
JP5420942B2 (ja) パターン描画装置およびパターン描画方法
JP5136108B2 (ja) 三次元形状計測方法および三次元形状計測装置
JP2006267191A (ja) 露光装置
WO2021053852A1 (ja) 外観検査装置、外観検査装置の較正方法及びプログラム
JP6879484B2 (ja) 画像取得装置、露光装置、及び画像取得方法
KR20150032772A (ko) 묘화 장치, 기판 처리 시스템 및 묘화 방법
JP2007334213A (ja) パターン欠陥修正装置およびパターン欠陥修正方法
KR100491308B1 (ko) 레이저 장치의 갈바노 스캐너의 드리프트 및 왜곡 보정방법
CN117745770A (zh) 模板生成装置、描绘系统、模板生成方法以及存储介质
TW202309476A (zh) 描繪裝置、描繪方法以及記錄了程式的程式產品
JP5753726B2 (ja) 検査方法および検査装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
LAPS Lapse due to unpaid annual fee