KR101511483B1 - 가공 제어 장치, 레이저 가공 장치 및 가공 제어 방법 - Google Patents

가공 제어 장치, 레이저 가공 장치 및 가공 제어 방법 Download PDF

Info

Publication number
KR101511483B1
KR101511483B1 KR1020147025389A KR20147025389A KR101511483B1 KR 101511483 B1 KR101511483 B1 KR 101511483B1 KR 1020147025389 A KR1020147025389 A KR 1020147025389A KR 20147025389 A KR20147025389 A KR 20147025389A KR 101511483 B1 KR101511483 B1 KR 101511483B1
Authority
KR
South Korea
Prior art keywords
area
machining
galvano
laser
cooperative control
Prior art date
Application number
KR1020147025389A
Other languages
English (en)
Korean (ko)
Other versions
KR20140114465A (ko
Inventor
아츠시 이케미
Original Assignee
미쓰비시덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시덴키 가부시키가이샤 filed Critical 미쓰비시덴키 가부시키가이샤
Publication of KR20140114465A publication Critical patent/KR20140114465A/ko
Application granted granted Critical
Publication of KR101511483B1 publication Critical patent/KR101511483B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Numerical Control (AREA)
KR1020147025389A 2013-01-04 2013-11-20 가공 제어 장치, 레이저 가공 장치 및 가공 제어 방법 KR101511483B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-000178 2013-01-04
JP2013000178 2013-01-04
PCT/JP2013/081303 WO2014106919A1 (ja) 2013-01-04 2013-11-20 加工制御装置、レーザ加工装置および加工制御方法

Publications (2)

Publication Number Publication Date
KR20140114465A KR20140114465A (ko) 2014-09-26
KR101511483B1 true KR101511483B1 (ko) 2015-04-10

Family

ID=51062241

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147025389A KR101511483B1 (ko) 2013-01-04 2013-11-20 가공 제어 장치, 레이저 가공 장치 및 가공 제어 방법

Country Status (5)

Country Link
JP (1) JP5622973B1 (zh)
KR (1) KR101511483B1 (zh)
CN (1) CN104203482B (zh)
TW (1) TWI511822B (zh)
WO (1) WO2014106919A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6647888B2 (ja) * 2016-01-29 2020-02-14 ビアメカニクス株式会社 レーザ加工方法及びレーザ加工装置
JP6035461B1 (ja) * 2016-04-28 2016-11-30 武井電機工業株式会社 レーザー加工方法及びレーザー加工装置
KR20200017394A (ko) * 2017-05-29 2020-02-18 에이씨에스 모션 컨트롤 리미티드 비교적 큰 워크피스의 가공을 위한 시스템 및 방법
CN108608120A (zh) * 2018-04-25 2018-10-02 大族激光科技产业集团股份有限公司 芯片衬底的激光剥离系统和方法
JP7348109B2 (ja) * 2020-03-11 2023-09-20 住友重機械工業株式会社 レーザ加工装置の制御装置、レーザ加工装置、及びレーザ加工方法
CN111505992B (zh) * 2020-05-06 2021-05-18 清华大学 一种具有多种连接方式的多通道激光振镜运动控制系统
CN112630983A (zh) * 2020-12-24 2021-04-09 中国工程物理研究院激光聚变研究中心 一种激光系统、激光诱导损伤测试系统及方法
JP2023122989A (ja) * 2022-02-24 2023-09-05 オムロン株式会社 制御システム、制御方法および制御装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011140057A (ja) 2010-01-08 2011-07-21 Mitsubishi Electric Corp 加工制御装置、レーザ加工装置および加工制御方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5817243A (en) * 1996-10-30 1998-10-06 Shaffer; Wayne K. Method for applying decorative contrast designs to automotive and motorcycle parts using lasers
JP3561159B2 (ja) * 1998-09-21 2004-09-02 三菱電機株式会社 レーザ加工装置
TWI275439B (en) * 2003-05-19 2007-03-11 Mitsubishi Electric Corp Laser processing apparatus
JP4800939B2 (ja) * 2006-01-06 2011-10-26 三菱電機株式会社 レーザ加工装置、プログラム作成装置およびレーザ加工方法
JP4297952B2 (ja) * 2007-05-28 2009-07-15 三菱電機株式会社 レーザ加工装置
JP4509174B2 (ja) * 2007-12-27 2010-07-21 三菱電機株式会社 レーザ加工装置およびレーザ加工制御装置
JP5219623B2 (ja) * 2008-05-23 2013-06-26 三菱電機株式会社 レーザ加工制御装置およびレーザ加工装置
JP5026455B2 (ja) * 2009-03-18 2012-09-12 住友重機械工業株式会社 Ｘｙステージ装置、半導体検査装置、及び半導体露光装置
JP2011121093A (ja) * 2009-12-10 2011-06-23 Mitsubishi Materials Corp レーザ加工装置およびこれを用いた工具のレーザ加工方法
CN101870039B (zh) * 2010-06-12 2014-01-22 中国电子科技集团公司第四十五研究所 双工作台驱动激光加工机及其加工方法
JP5634765B2 (ja) * 2010-06-24 2014-12-03 東芝機械株式会社 パルスレーザ加工方法およびパルスレーザ加工用データ作成方法
JP5981094B2 (ja) * 2010-06-24 2016-08-31 東芝機械株式会社 ダイシング方法
JP2012187620A (ja) * 2011-03-11 2012-10-04 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工計画方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011140057A (ja) 2010-01-08 2011-07-21 Mitsubishi Electric Corp 加工制御装置、レーザ加工装置および加工制御方法

Also Published As

Publication number Publication date
CN104203482B (zh) 2015-07-22
TWI511822B (zh) 2015-12-11
WO2014106919A1 (ja) 2014-07-10
CN104203482A (zh) 2014-12-10
TW201436912A (zh) 2014-10-01
JPWO2014106919A1 (ja) 2017-01-19
JP5622973B1 (ja) 2014-11-12
KR20140114465A (ko) 2014-09-26

Similar Documents

Publication Publication Date Title
KR101511483B1 (ko) 가공 제어 장치, 레이저 가공 장치 및 가공 제어 방법
US11826851B2 (en) Method and system for laser machining of relatively large workpieces
CN108628258B (zh) 扫描器控制装置、机器人控制装置以及远程激光焊接机器人系统
JP2002361463A (ja) 加工装置および加工方法
JP6035461B1 (ja) レーザー加工方法及びレーザー加工装置
WO2019003557A1 (ja) 三次元レーザ加工機および三次元レーザ加工機の制御方法
KR101722916B1 (ko) 레이저 스캐너 기반 5축 표면 연속 가공 장치 및 그 제어 방법
JP5628524B2 (ja) 加工制御装置、レーザ加工装置および加工制御方法
JP2009220128A (ja) ワーク加工方法およびワーク加工装置
KR20170029381A (ko) 레이저 가공 장치
JP3561159B2 (ja) レーザ加工装置
EP3819068B1 (en) Cutting machine and cutting method
KR101637456B1 (ko) 다중 위치 제어를 이용한 연속적 레이저 가공 방법 및 이를 적용하는 시스템
KR20160076895A (ko) 레이저 가공장치 및 이를 이용한 레이저 가공방법
JP5980042B2 (ja) 搬送装置の制御方法及び搬送システム
JP2009181395A (ja) ロボットの制御方法、ロボットの制御装置及び部品実装機
WO2024111031A1 (ja) 加工状態予測装置及び加工制御装置
JP5943627B2 (ja) レーザ加工装置及びレーザ加工方法
JP5731868B2 (ja) レーザ加工方法及び加工装置
JP5319175B2 (ja) パターン描画方法及び装置
JP2008254073A (ja) レーザ加工装置
KR20160143281A (ko) 레이저 스캐너 기반 3축 표면 연속 가공 장치 및 그 제어 방법
JP2016209906A (ja) レーザ加工機及びレーザ加工方法
CN111822866A (zh) 分线连续打标的雷射打标系统
JP2002283084A (ja) レーザ加工方法及び装置

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20180316

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20190319

Year of fee payment: 5