KR101465425B1 - 실리콘 단결정의 육성방법 - Google Patents
실리콘 단결정의 육성방법 Download PDFInfo
- Publication number
- KR101465425B1 KR101465425B1 KR1020097024707A KR20097024707A KR101465425B1 KR 101465425 B1 KR101465425 B1 KR 101465425B1 KR 1020097024707 A KR1020097024707 A KR 1020097024707A KR 20097024707 A KR20097024707 A KR 20097024707A KR 101465425 B1 KR101465425 B1 KR 101465425B1
- Authority
- KR
- South Korea
- Prior art keywords
- single crystal
- carbon
- silicon
- silicon single
- raw material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 121
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 96
- 239000010703 silicon Substances 0.000 title claims abstract description 96
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 title claims abstract description 47
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 94
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 85
- 239000002994 raw material Substances 0.000 claims abstract description 45
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910002091 carbon monoxide Inorganic materials 0.000 claims abstract 2
- 239000012778 molding material Substances 0.000 claims description 50
- 239000002019 doping agent Substances 0.000 claims description 24
- 238000001125 extrusion Methods 0.000 claims description 18
- 239000000155 melt Substances 0.000 claims description 14
- 238000010298 pulverizing process Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 6
- 238000002109 crystal growth method Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 20
- 239000002245 particle Substances 0.000 description 17
- 239000007789 gas Substances 0.000 description 9
- 239000010453 quartz Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 238000002844 melting Methods 0.000 description 5
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910001385 heavy metal Inorganic materials 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005247 gettering Methods 0.000 description 2
- 230000002706 hydrostatic effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/02—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
- C30B15/04—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt adding doping materials, e.g. for n-p-junction
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2007-142988 | 2007-05-30 | ||
| JP2007142988A JP5061728B2 (ja) | 2007-05-30 | 2007-05-30 | シリコン単結晶の育成方法 |
| PCT/JP2008/001029 WO2008146443A1 (ja) | 2007-05-30 | 2008-04-18 | シリコン単結晶の育成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100017406A KR20100017406A (ko) | 2010-02-16 |
| KR101465425B1 true KR101465425B1 (ko) | 2014-11-26 |
Family
ID=40074721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097024707A Active KR101465425B1 (ko) | 2007-05-30 | 2008-04-18 | 실리콘 단결정의 육성방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20100116195A1 (enExample) |
| JP (1) | JP5061728B2 (enExample) |
| KR (1) | KR101465425B1 (enExample) |
| DE (1) | DE112008001201T5 (enExample) |
| WO (1) | WO2008146443A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5510359B2 (ja) * | 2011-02-21 | 2014-06-04 | 信越半導体株式会社 | 炭素ドープシリコン単結晶の製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58151392A (ja) * | 1982-02-26 | 1983-09-08 | Sumitomo Metal Mining Co Ltd | かさ比重の大きい酸化物単結晶引上げ用原料の調整方法 |
| JP2002068886A (ja) * | 2000-08-31 | 2002-03-08 | Shin Etsu Handotai Co Ltd | 半導体単結晶製造装置及び黒鉛部材評価方法 |
| JP2002293691A (ja) * | 2001-03-30 | 2002-10-09 | Shin Etsu Handotai Co Ltd | シリコン単結晶の製造方法及びシリコン単結晶並びにシリコンウエーハ |
| JP2003146769A (ja) * | 2001-07-11 | 2003-05-21 | Sgl Carbon Ag | 多層セラミックス複合体とその製造方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3980854A (en) * | 1974-11-15 | 1976-09-14 | Rca Corporation | Graphite susceptor structure for inductively heating semiconductor wafers |
| JPS6033210A (ja) * | 1983-08-02 | 1985-02-20 | Komatsu Denshi Kinzoku Kk | 半導体用シリコンの破砕方法 |
| DE4106589C2 (de) * | 1991-03-01 | 1997-04-24 | Wacker Siltronic Halbleitermat | Kontinuierliches Nachchargierverfahren mit flüssigem Silicium beim Tiegelziehen nach Czochralski |
| TW429273B (en) * | 1996-02-08 | 2001-04-11 | Shinetsu Handotai Kk | Method for feeding garnular silicon material, feed pipe used in the method, and method of manufacturing a silicon monocrystal |
| EP0871233B1 (en) * | 1996-07-30 | 2000-01-12 | Sony Corporation | Non-aqueous electrolyte secondary battery |
| JPH11302099A (ja) | 1998-04-21 | 1999-11-02 | Sumitomo Metal Ind Ltd | シリコン単結晶の製造方法 |
| JPH11312683A (ja) | 1998-04-28 | 1999-11-09 | Sumitomo Metal Ind Ltd | 半導体単結晶シリコンの製造方法 |
| WO2003005417A2 (en) * | 2001-07-05 | 2003-01-16 | Axt, Inc. | Method and apparatus for growing semiconductor crystals with a rigid support |
| KR20030035152A (ko) * | 2001-10-30 | 2003-05-09 | 주식회사 하이닉스반도체 | 반도체웨이퍼 제조방법 |
| US20030101924A1 (en) * | 2001-11-15 | 2003-06-05 | Memc Electronic Materials, Inc. | Intermittent feeding technique for increasing the melting rate of polycrystalline silicon |
| JP4507690B2 (ja) | 2004-05-10 | 2010-07-21 | 信越半導体株式会社 | シリコン単結晶の製造方法及びシリコン単結晶 |
| JP4992425B2 (ja) * | 2004-08-30 | 2012-08-08 | 三菱化学株式会社 | 非水系二次電池用負極材料、非水系二次電池用負極、および非水系二次電池 |
-
2007
- 2007-05-30 JP JP2007142988A patent/JP5061728B2/ja active Active
-
2008
- 2008-04-18 KR KR1020097024707A patent/KR101465425B1/ko active Active
- 2008-04-18 US US12/450,807 patent/US20100116195A1/en not_active Abandoned
- 2008-04-18 DE DE112008001201T patent/DE112008001201T5/de not_active Ceased
- 2008-04-18 WO PCT/JP2008/001029 patent/WO2008146443A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58151392A (ja) * | 1982-02-26 | 1983-09-08 | Sumitomo Metal Mining Co Ltd | かさ比重の大きい酸化物単結晶引上げ用原料の調整方法 |
| JP2002068886A (ja) * | 2000-08-31 | 2002-03-08 | Shin Etsu Handotai Co Ltd | 半導体単結晶製造装置及び黒鉛部材評価方法 |
| JP2002293691A (ja) * | 2001-03-30 | 2002-10-09 | Shin Etsu Handotai Co Ltd | シリコン単結晶の製造方法及びシリコン単結晶並びにシリコンウエーハ |
| JP2003146769A (ja) * | 2001-07-11 | 2003-05-21 | Sgl Carbon Ag | 多層セラミックス複合体とその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008297139A (ja) | 2008-12-11 |
| DE112008001201T5 (de) | 2010-08-05 |
| KR20100017406A (ko) | 2010-02-16 |
| US20100116195A1 (en) | 2010-05-13 |
| JP5061728B2 (ja) | 2012-10-31 |
| WO2008146443A1 (ja) | 2008-12-04 |
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Patent event date: 20091126 Patent event code: PA01051R01D Comment text: International Patent Application |
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| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20130313 Comment text: Request for Examination of Application |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20140428 Patent event code: PE09021S01D |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20141006 |
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| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20141120 Patent event code: PR07011E01D |
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