KR101437256B1 - 이방성 도전 필름, 접합체 및 접속 방법 - Google Patents

이방성 도전 필름, 접합체 및 접속 방법 Download PDF

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Publication number
KR101437256B1
KR101437256B1 KR1020127030305A KR20127030305A KR101437256B1 KR 101437256 B1 KR101437256 B1 KR 101437256B1 KR 1020127030305 A KR1020127030305 A KR 1020127030305A KR 20127030305 A KR20127030305 A KR 20127030305A KR 101437256 B1 KR101437256 B1 KR 101437256B1
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KR
South Korea
Prior art keywords
circuit member
anisotropic conductive
amine
conductive film
silane coupling
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Expired - Fee Related
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KR1020127030305A
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English (en)
Korean (ko)
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KR20130029770A (ko
Inventor
도모유키 이시마츠
히로시 하마치
레이지 츠카오
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데쿠세리아루즈 가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
KR1020127030305A 2010-04-20 2011-04-13 이방성 도전 필름, 접합체 및 접속 방법 Expired - Fee Related KR101437256B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2010-097358 2010-04-20
JP2010097358A JP5558184B2 (ja) 2010-04-20 2010-04-20 異方性導電フィルム、接合体及び接続方法
PCT/JP2011/059146 WO2011132578A1 (ja) 2010-04-20 2011-04-13 異方性導電フィルム、接合体及び接続方法

Publications (2)

Publication Number Publication Date
KR20130029770A KR20130029770A (ko) 2013-03-25
KR101437256B1 true KR101437256B1 (ko) 2014-09-02

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ID=42767265

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127030305A Expired - Fee Related KR101437256B1 (ko) 2010-04-20 2011-04-13 이방성 도전 필름, 접합체 및 접속 방법

Country Status (4)

Country Link
JP (1) JP5558184B2 (https=)
KR (1) KR101437256B1 (https=)
TW (1) TWI498410B (https=)
WO (1) WO2011132578A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6782532B2 (ja) * 2014-07-23 2020-11-11 日本乳化剤株式会社 イオン結合性塩、イオン結合性塩組成物およびこれを含む樹脂組成物
TWI824740B (zh) * 2014-10-28 2023-12-01 日商迪睿合股份有限公司 異向性導電膜、連接構造體、及連接構造體之製造方法
US11396637B2 (en) 2018-06-18 2022-07-26 Chemetall U.S., Inc. Amine-functionalized organosilane/organophosphate combination systems as EP agents / corrosion inhibitors in compositions for treating metal surfaces

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11279424A (ja) * 1998-03-26 1999-10-12 Asahi Glass Co Ltd 硬化性組成物
KR100642445B1 (ko) * 2004-12-29 2006-11-02 제일모직주식회사 이방 도전성 접착제용 수지 조성물
KR20100017828A (ko) * 2008-03-27 2010-02-16 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 이방성 도전 필름, 그리고 접합체 및 그 제조방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3909816B2 (ja) * 2001-10-31 2007-04-25 オプトレックス株式会社 液晶表示パネルへの回路部品接続装置
JP2004047228A (ja) * 2002-07-10 2004-02-12 Bridgestone Corp 異方性導電フィルム及び電極付き基板の接着方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11279424A (ja) * 1998-03-26 1999-10-12 Asahi Glass Co Ltd 硬化性組成物
KR100642445B1 (ko) * 2004-12-29 2006-11-02 제일모직주식회사 이방 도전성 접착제용 수지 조성물
KR20100017828A (ko) * 2008-03-27 2010-02-16 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 이방성 도전 필름, 그리고 접합체 및 그 제조방법

Also Published As

Publication number Publication date
TW201144405A (en) 2011-12-16
JP2010186752A (ja) 2010-08-26
KR20130029770A (ko) 2013-03-25
WO2011132578A1 (ja) 2011-10-27
TWI498410B (zh) 2015-09-01
JP5558184B2 (ja) 2014-07-23

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