KR101436037B1 - 인덕터 소자 및 그 제조 방법 - Google Patents

인덕터 소자 및 그 제조 방법 Download PDF

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Publication number
KR101436037B1
KR101436037B1 KR1020080075390A KR20080075390A KR101436037B1 KR 101436037 B1 KR101436037 B1 KR 101436037B1 KR 1020080075390 A KR1020080075390 A KR 1020080075390A KR 20080075390 A KR20080075390 A KR 20080075390A KR 101436037 B1 KR101436037 B1 KR 101436037B1
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South Korea
Prior art keywords
insulating film
inductor
semiconductor substrate
conductive member
main body
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KR1020080075390A
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English (en)
Korean (ko)
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KR20090014964A (ko
Inventor
도모하루 후지이
마사히로 스노하라
마나부 나카무라
Original Assignee
신꼬오덴기 고교 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0046—Printed inductances with a conductive path having a bridge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/323—Insulation between winding turns, between winding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12—Insulating of windings
    • H01F41/122—Insulating between turns or between winding layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Coils Or Transformers For Communication (AREA)
KR1020080075390A 2007-08-06 2008-08-01 인덕터 소자 및 그 제조 방법 Active KR101436037B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00204325 2007-08-06
JP2007204325A JP5348862B2 (ja) 2007-08-06 2007-08-06 インダクタ素子

Publications (2)

Publication Number Publication Date
KR20090014964A KR20090014964A (ko) 2009-02-11
KR101436037B1 true KR101436037B1 (ko) 2014-09-01

Family

ID=40345926

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080075390A Active KR101436037B1 (ko) 2007-08-06 2008-08-01 인덕터 소자 및 그 제조 방법

Country Status (4)

Country Link
US (1) US7791446B2 (https=)
JP (1) JP5348862B2 (https=)
KR (1) KR101436037B1 (https=)
TW (1) TWI443691B (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
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US8049589B2 (en) * 2008-09-10 2011-11-01 Advanced Semiconductor Engineering, Inc. Balun circuit manufactured by integrate passive device process
US7994873B2 (en) * 2008-09-10 2011-08-09 Advanced Semiconductor Engineering, Inc. Balun device
US8008987B2 (en) * 2008-09-10 2011-08-30 Advanced Semiconductor Engineering, Inc. Balun circuit manufactured by integrate passive device process
US9190201B2 (en) * 2009-03-04 2015-11-17 Qualcomm Incorporated Magnetic film enhanced inductor
WO2011033496A1 (en) * 2009-09-16 2011-03-24 Maradin Technologies Ltd. Micro coil apparatus and manufacturing methods therefor
KR101179386B1 (ko) * 2010-04-08 2012-09-03 성균관대학교산학협력단 패키지 기판의 제조방법
US8664745B2 (en) * 2010-07-20 2014-03-04 Triune Ip Llc Integrated inductor
CN102376693B (zh) * 2010-08-23 2016-05-11 香港科技大学 单片磁感应器件
US8470612B2 (en) 2010-10-07 2013-06-25 Infineon Technologies Ag Integrated circuits with magnetic core inductors and methods of fabrications thereof
CN103377795B (zh) * 2012-04-24 2016-01-27 乾坤科技股份有限公司 电磁器件及其制作方法
US8963671B2 (en) * 2012-08-31 2015-02-24 Advanced Semiconductor Engineering, Inc. Semiconductor transformer device and method for manufacturing the same
JP6115147B2 (ja) 2013-01-22 2017-04-19 富士通株式会社 配線基板及びその設計方法
US9767957B2 (en) * 2013-08-12 2017-09-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing a tunable three dimensional inductor
CN105244367A (zh) * 2014-06-24 2016-01-13 日月光半导体制造股份有限公司 衬底结构及其制造方法
KR101681200B1 (ko) 2014-08-07 2016-12-01 주식회사 모다이노칩 파워 인덕터
KR101686989B1 (ko) 2014-08-07 2016-12-19 주식회사 모다이노칩 파워 인덕터
US9607748B2 (en) * 2014-09-03 2017-03-28 Teledyne Scientific & Imaging, Llc Micro-fabricated integrated coil and magnetic circuit and method of manufacturing thereof
KR101681201B1 (ko) 2014-09-11 2016-12-01 주식회사 모다이노칩 파워 인덕터
JP6557468B2 (ja) * 2014-12-25 2019-08-07 ローム株式会社 チップ部品
US20170236790A1 (en) * 2016-02-12 2017-08-17 Semtech Corporation Semiconductor Device on Leadframe with Integrated Passive Component
JP6838328B2 (ja) * 2016-09-15 2021-03-03 大日本印刷株式会社 インダクタおよびインダクタの製造方法
JP2018174306A (ja) * 2017-03-30 2018-11-08 ローム株式会社 チップインダクタおよびその製造方法
US11094447B2 (en) 2017-03-30 2021-08-17 Rohm Co., Ltd. Chip inductor and method for manufacturing the same
WO2019004264A1 (ja) * 2017-06-30 2019-01-03 株式会社村田製作所 電子部品モジュール及びその製造方法
US10861840B2 (en) * 2017-08-30 2020-12-08 Advanced Semiconductor Engineering, Inc. Integrated passive component and method for manufacturing the same
TWI685858B (zh) * 2017-12-04 2020-02-21 希華晶體科技股份有限公司 薄型化扼流器的量產方法
US11094455B2 (en) 2018-12-27 2021-08-17 Texas Instruments Incorporated Module with reversely coupled inductors and magnetic molded compound (MMC)
JP7818888B2 (ja) 2020-02-17 2026-02-24 日東電工株式会社 積層シート

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729732A (ja) * 1993-07-09 1995-01-31 Fuji Electric Co Ltd 薄膜磁気素子
JPH11251143A (ja) * 1998-03-02 1999-09-17 Toshiba Corp 平面インダクタおよびその製造方法および平面コイルパターンの形成方法
KR20030030957A (ko) * 2001-10-10 2003-04-18 에스티마이크로일렉트로닉스 에스.에이. 모놀리식 회로에서 인덕턴스 및 비아 형성
JP2006173525A (ja) * 2004-12-20 2006-06-29 Sanyo Electric Co Ltd 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
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JPH0897375A (ja) * 1994-07-26 1996-04-12 Toshiba Corp マイクロ波集積回路装置及びその製造方法
JPH0963847A (ja) * 1995-08-25 1997-03-07 Nec Corp インダクタ素子及びその製造方法
JP2005079286A (ja) 2003-08-29 2005-03-24 Canon Inc インダクタ及びその製造方法
TWI336922B (en) * 2007-01-12 2011-02-01 Via Tech Inc Spiral inductor with multi-trace structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729732A (ja) * 1993-07-09 1995-01-31 Fuji Electric Co Ltd 薄膜磁気素子
JPH11251143A (ja) * 1998-03-02 1999-09-17 Toshiba Corp 平面インダクタおよびその製造方法および平面コイルパターンの形成方法
KR20030030957A (ko) * 2001-10-10 2003-04-18 에스티마이크로일렉트로닉스 에스.에이. 모놀리식 회로에서 인덕턴스 및 비아 형성
JP2006173525A (ja) * 2004-12-20 2006-06-29 Sanyo Electric Co Ltd 半導体装置

Also Published As

Publication number Publication date
US20090039999A1 (en) 2009-02-12
JP5348862B2 (ja) 2013-11-20
TWI443691B (zh) 2014-07-01
US7791446B2 (en) 2010-09-07
JP2009043777A (ja) 2009-02-26
TW200915358A (en) 2009-04-01
KR20090014964A (ko) 2009-02-11

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